JP2001157879A5 - - Google Patents
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- Publication number
- JP2001157879A5 JP2001157879A5 JP2000305498A JP2000305498A JP2001157879A5 JP 2001157879 A5 JP2001157879 A5 JP 2001157879A5 JP 2000305498 A JP2000305498 A JP 2000305498A JP 2000305498 A JP2000305498 A JP 2000305498A JP 2001157879 A5 JP2001157879 A5 JP 2001157879A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- water
- substrate
- aqueous solution
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000758 substrate Substances 0.000 description 99
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 95
- 239000007789 gas Substances 0.000 description 87
- 238000004140 cleaning Methods 0.000 description 68
- 239000007864 aqueous solution Substances 0.000 description 55
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 47
- 239000012528 membrane Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 37
- 230000033116 oxidation-reduction process Effects 0.000 description 37
- 229910021642 ultra pure water Inorganic materials 0.000 description 31
- 239000012498 ultrapure water Substances 0.000 description 31
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 30
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 29
- 239000001569 carbon dioxide Substances 0.000 description 24
- 229910002092 carbon dioxide Inorganic materials 0.000 description 24
- 239000004065 semiconductor Substances 0.000 description 24
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 20
- 239000001257 hydrogen Substances 0.000 description 20
- 229910052739 hydrogen Inorganic materials 0.000 description 20
- 238000005406 washing Methods 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 17
- 239000004973 liquid crystal related substance Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 16
- 239000010419 fine particle Substances 0.000 description 15
- 230000020477 pH reduction Effects 0.000 description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 8
- 229910052801 chlorine Inorganic materials 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 238000007872 degassing Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical class [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000004876 x-ray fluorescence Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000000908 ammonium hydroxide Substances 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 5
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 238000001223 reverse osmosis Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- -1 coagulation Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000005342 ion exchange Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000015271 coagulation Effects 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000011001 backwashing Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001471 micro-filtration Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 238000000108 ultra-filtration Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000305498A JP2001157879A (ja) | 1999-08-31 | 2000-08-31 | 水溶液のpH制御の方法及びその装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-285851 | 1999-08-31 | ||
| JP28585199 | 1999-08-31 | ||
| JP2000305498A JP2001157879A (ja) | 1999-08-31 | 2000-08-31 | 水溶液のpH制御の方法及びその装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010002909A Division JP2010135810A (ja) | 1999-08-31 | 2010-01-08 | 水溶液のpH及び酸化還元電位の制御方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001157879A JP2001157879A (ja) | 2001-06-12 |
| JP2001157879A5 true JP2001157879A5 (enExample) | 2007-10-11 |
Family
ID=26556046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000305498A Pending JP2001157879A (ja) | 1999-08-31 | 2000-08-31 | 水溶液のpH制御の方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001157879A (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004016729A2 (en) * | 2002-08-19 | 2004-02-26 | Bioprocessors Corporation | SYSTEMS AND METHODS FOR CONTROL OF pH AND OTHER REACTOR ENVIRONMENTAL CONDITIONS |
| JP5222059B2 (ja) * | 2008-08-19 | 2013-06-26 | オルガノ株式会社 | 超音波処理装置用供給液の製造装置、超音波処理装置用供給液の製造方法及び超音波処理システム |
| JP2013045961A (ja) * | 2011-08-25 | 2013-03-04 | Dainippon Screen Mfg Co Ltd | 基板洗浄方法、基板洗浄液および基板処理装置 |
| JP6324659B2 (ja) * | 2013-02-08 | 2018-05-16 | 幸信 森 | 水素水製造装置及び水素水の製造方法 |
| JP6299913B1 (ja) | 2017-03-30 | 2018-03-28 | 栗田工業株式会社 | pH・酸化還元電位調整水の製造装置 |
| JP6471816B2 (ja) * | 2018-02-14 | 2019-02-20 | 栗田工業株式会社 | pH・酸化還元電位調整水の製造装置 |
| JP7087444B2 (ja) * | 2018-02-27 | 2022-06-21 | 栗田工業株式会社 | pH・酸化還元電位調整水の製造装置 |
| JP7147898B2 (ja) * | 2021-03-11 | 2022-10-05 | 栗田工業株式会社 | 水質調整水の製造方法及び装置 |
| CN113406176B (zh) * | 2021-07-05 | 2022-03-22 | 深圳科瑞德健康科技有限公司 | 一种附带机械搅拌的水溶液氧化还原电位值快速测试装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3332323B2 (ja) * | 1996-10-29 | 2002-10-07 | オルガノ株式会社 | 電子部品部材類の洗浄方法及び洗浄装置 |
| JPH1129795A (ja) * | 1997-07-08 | 1999-02-02 | Kurita Water Ind Ltd | 電子材料用洗浄水、その製造方法及び電子材料の洗浄方法 |
| JP3444473B2 (ja) * | 1998-02-02 | 2003-09-08 | 栗田工業株式会社 | 電子材料洗浄方法及び電子材料用洗浄水 |
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2000
- 2000-08-31 JP JP2000305498A patent/JP2001157879A/ja active Pending
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