JP2001108706A - ハンダボール用コンタクタ - Google Patents

ハンダボール用コンタクタ

Info

Publication number
JP2001108706A
JP2001108706A JP28514099A JP28514099A JP2001108706A JP 2001108706 A JP2001108706 A JP 2001108706A JP 28514099 A JP28514099 A JP 28514099A JP 28514099 A JP28514099 A JP 28514099A JP 2001108706 A JP2001108706 A JP 2001108706A
Authority
JP
Japan
Prior art keywords
solder ball
probe
contactor
contact
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28514099A
Other languages
English (en)
Japanese (ja)
Inventor
Chikahito Yamasaka
力仁 山坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP28514099A priority Critical patent/JP2001108706A/ja
Priority to KR1020000057815A priority patent/KR100600230B1/ko
Priority to TW091221343U priority patent/TW539240U/zh
Publication of JP2001108706A publication Critical patent/JP2001108706A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP28514099A 1999-10-06 1999-10-06 ハンダボール用コンタクタ Pending JP2001108706A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP28514099A JP2001108706A (ja) 1999-10-06 1999-10-06 ハンダボール用コンタクタ
KR1020000057815A KR100600230B1 (ko) 1999-10-06 2000-10-02 납땜 볼용 접촉기
TW091221343U TW539240U (en) 1999-10-06 2000-10-05 Contactor for solder balls

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28514099A JP2001108706A (ja) 1999-10-06 1999-10-06 ハンダボール用コンタクタ

Publications (1)

Publication Number Publication Date
JP2001108706A true JP2001108706A (ja) 2001-04-20

Family

ID=17687628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28514099A Pending JP2001108706A (ja) 1999-10-06 1999-10-06 ハンダボール用コンタクタ

Country Status (3)

Country Link
JP (1) JP2001108706A (ko)
KR (1) KR100600230B1 (ko)
TW (1) TW539240U (ko)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002202322A (ja) * 2000-12-28 2002-07-19 Yokowo Co Ltd コンタクトプローブ
JP2006184061A (ja) * 2004-12-27 2006-07-13 Fujitsu Ltd 電気的接続部品及びその製造方法
JP2006184055A (ja) * 2004-12-27 2006-07-13 Japan Electronic Materials Corp コンタクトプローブ及びプローブカード
US7271015B2 (en) 2004-04-09 2007-09-18 Renesas Technology Corp. Manufacturing method of semiconductor integrated circuit device and probe card
JP2007322180A (ja) * 2006-05-30 2007-12-13 Nidec-Read Corp 基板検査治具
JP2008039457A (ja) * 2006-08-02 2008-02-21 Chugoku Electric Power Co Inc:The 計器用測定端子及び計器用測定端子操作具
US7901958B2 (en) 2003-10-31 2011-03-08 Renesas Electronics Corporation Fabrication method of semiconductor integrated circuit device
WO2012140925A1 (ja) * 2011-04-15 2012-10-18 株式会社村田製作所 バンプ電極検査方法およびバンプ電極検査システム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02119155A (ja) * 1988-10-27 1990-05-07 Nec Corp 半導体集積回路用試験装置
KR100276101B1 (ko) * 1998-07-08 2001-01-15 이석행 웨이퍼 검사기의 포고 핀과 블록의 결합구조

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002202322A (ja) * 2000-12-28 2002-07-19 Yokowo Co Ltd コンタクトプローブ
US7901958B2 (en) 2003-10-31 2011-03-08 Renesas Electronics Corporation Fabrication method of semiconductor integrated circuit device
US7517707B2 (en) 2004-04-09 2009-04-14 Renesas Technology Corp. Manufacturing method of semiconductor integrated circuit device and probe card
US7271015B2 (en) 2004-04-09 2007-09-18 Renesas Technology Corp. Manufacturing method of semiconductor integrated circuit device and probe card
JP2006184055A (ja) * 2004-12-27 2006-07-13 Japan Electronic Materials Corp コンタクトプローブ及びプローブカード
JP4486880B2 (ja) * 2004-12-27 2010-06-23 日本電子材料株式会社 コンタクトプローブ
JP2006184061A (ja) * 2004-12-27 2006-07-13 Fujitsu Ltd 電気的接続部品及びその製造方法
JP2007322180A (ja) * 2006-05-30 2007-12-13 Nidec-Read Corp 基板検査治具
TWI416112B (zh) * 2006-05-30 2013-11-21 Nidec Read Corp Substrate inspection method and substrate inspection device
KR101342174B1 (ko) * 2006-05-30 2013-12-16 니혼덴산리드가부시키가이샤 기판 검사 치구
JP2008039457A (ja) * 2006-08-02 2008-02-21 Chugoku Electric Power Co Inc:The 計器用測定端子及び計器用測定端子操作具
WO2012140925A1 (ja) * 2011-04-15 2012-10-18 株式会社村田製作所 バンプ電極検査方法およびバンプ電極検査システム
CN103299409A (zh) * 2011-04-15 2013-09-11 株式会社村田制作所 凸块电极检查方法及凸块电极检查系统
JP5348327B2 (ja) * 2011-04-15 2013-11-20 株式会社村田製作所 バンプ電極検査方法およびバンプ電極検査システム

Also Published As

Publication number Publication date
TW539240U (en) 2003-06-21
KR100600230B1 (ko) 2006-07-13
KR20010039971A (ko) 2001-05-15

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