JP2001102676A - 光集積ユニット、光ピックアップ及び光記録媒体駆動装置 - Google Patents

光集積ユニット、光ピックアップ及び光記録媒体駆動装置

Info

Publication number
JP2001102676A
JP2001102676A JP27338099A JP27338099A JP2001102676A JP 2001102676 A JP2001102676 A JP 2001102676A JP 27338099 A JP27338099 A JP 27338099A JP 27338099 A JP27338099 A JP 27338099A JP 2001102676 A JP2001102676 A JP 2001102676A
Authority
JP
Japan
Prior art keywords
optical
substrate
integrated unit
laser
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27338099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001102676A5 (https=
Inventor
Ichiro Uchisaki
崎 一 郎 内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Development and Engineering Corp
Original Assignee
Toshiba Corp
Toshiba Electronic Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Electronic Engineering Co Ltd filed Critical Toshiba Corp
Priority to JP27338099A priority Critical patent/JP2001102676A/ja
Priority to US09/670,858 priority patent/US6496469B1/en
Publication of JP2001102676A publication Critical patent/JP2001102676A/ja
Priority to US10/285,025 priority patent/US6693871B2/en
Publication of JP2001102676A5 publication Critical patent/JP2001102676A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/127—Lasers; Multiple laser arrays
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B2007/0003—Recording, reproducing or erasing systems characterised by the structure or type of the carrier
    • G11B2007/0006—Recording, reproducing or erasing systems characterised by the structure or type of the carrier adapted for scanning different types of carrier, e.g. CD & DVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Head (AREA)
JP27338099A 1999-09-27 1999-09-27 光集積ユニット、光ピックアップ及び光記録媒体駆動装置 Pending JP2001102676A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP27338099A JP2001102676A (ja) 1999-09-27 1999-09-27 光集積ユニット、光ピックアップ及び光記録媒体駆動装置
US09/670,858 US6496469B1 (en) 1999-09-27 2000-09-26 Integrated unit, optical pickup, and optical recording medium drive device
US10/285,025 US6693871B2 (en) 1999-09-27 2002-10-30 Integrated unit, optical pickup, and optical recording medium drive device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27338099A JP2001102676A (ja) 1999-09-27 1999-09-27 光集積ユニット、光ピックアップ及び光記録媒体駆動装置

Publications (2)

Publication Number Publication Date
JP2001102676A true JP2001102676A (ja) 2001-04-13
JP2001102676A5 JP2001102676A5 (https=) 2005-08-18

Family

ID=17527101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27338099A Pending JP2001102676A (ja) 1999-09-27 1999-09-27 光集積ユニット、光ピックアップ及び光記録媒体駆動装置

Country Status (2)

Country Link
US (2) US6496469B1 (https=)
JP (1) JP2001102676A (https=)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6868055B2 (en) 2000-07-13 2005-03-15 Sharp Kabushiki Kaisha Optical pickup
KR100492534B1 (ko) * 2002-11-29 2005-06-02 엘지전자 주식회사 광 발생기 모듈, 광 검출기 모듈, 그들을 결합한 광픽업장치 및 그들의 제조방법
US6983005B2 (en) 2001-01-24 2006-01-03 Sharp Kabushiki Kaisha Holographic laser and optical pickup
US7075960B2 (en) 2003-01-10 2006-07-11 Matsushita Electric Industrial Co., Ltd. Semiconductor laser apparatus and production method thereof
US7355933B2 (en) 2002-08-07 2008-04-08 Sharp Kabushiki Kaisha Optical pickup device
US7736923B2 (en) 2003-12-16 2010-06-15 Panasonic Corporation Optical semiconductor device and method for fabricating the same
JP2017032625A (ja) * 2015-07-29 2017-02-09 日亜化学工業株式会社 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置
JP2017045795A (ja) * 2015-08-25 2017-03-02 日亜化学工業株式会社 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置
JP2017069241A (ja) * 2015-09-28 2017-04-06 京セラ株式会社 半導体レーザ素子用パッケージおよび半導体レーザ装置
JP2018011080A (ja) * 2017-09-26 2018-01-18 日亜化学工業株式会社 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置

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JP3689296B2 (ja) * 2000-01-24 2005-08-31 パイオニア株式会社 光ピックアップ装置
US6693033B2 (en) * 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
US6392257B1 (en) 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
EP1160776A3 (en) * 2000-05-31 2004-07-14 Matsushita Electric Industrial Co., Ltd. Optical pick-up and information recording and reproducing apparatus
KR20030011083A (ko) 2000-05-31 2003-02-06 모토로라 인코포레이티드 반도체 디바이스 및 이를 제조하기 위한 방법
WO2002009187A2 (en) 2000-07-24 2002-01-31 Motorola, Inc. Heterojunction tunneling diodes and process for fabricating same
JP2002074719A (ja) * 2000-08-24 2002-03-15 Fujitsu Ltd 光学装置
WO2002054548A1 (en) * 2000-12-28 2002-07-11 Matsushita Electric Industrial Co., Ltd. Shorter wavelength laser module and method of manufacturing the laser module
US20020096683A1 (en) 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
US7092345B2 (en) * 2001-03-22 2006-08-15 Ricoh Company, Ltd. Optical module
WO2002082551A1 (en) 2001-04-02 2002-10-17 Motorola, Inc. A semiconductor structure exhibiting reduced leakage current
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US6992321B2 (en) 2001-07-13 2006-01-31 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US7019332B2 (en) 2001-07-20 2006-03-28 Freescale Semiconductor, Inc. Fabrication of a wavelength locker within a semiconductor structure
US6855992B2 (en) 2001-07-24 2005-02-15 Motorola Inc. Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same
US6639249B2 (en) * 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US20030026310A1 (en) * 2001-08-06 2003-02-06 Motorola, Inc. Structure and method for fabrication for a lighting device
US20030034491A1 (en) 2001-08-14 2003-02-20 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices for detecting an object
US6673667B2 (en) * 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
US20030071327A1 (en) 2001-10-17 2003-04-17 Motorola, Inc. Method and apparatus utilizing monocrystalline insulator
US6916717B2 (en) 2002-05-03 2005-07-12 Motorola, Inc. Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate
JPWO2003102938A1 (ja) * 2002-06-03 2005-09-29 ソニー株式会社 ２波長光素子
JP3800135B2 (ja) * 2002-06-18 2006-07-26 セイコーエプソン株式会社 光通信モジュール、光通信モジュールの製造方法および電子機器
US7169619B2 (en) * 2002-11-19 2007-01-30 Freescale Semiconductor, Inc. Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process
US6885065B2 (en) 2002-11-20 2005-04-26 Freescale Semiconductor, Inc. Ferromagnetic semiconductor structure and method for forming the same
US6806202B2 (en) 2002-12-03 2004-10-19 Motorola, Inc. Method of removing silicon oxide from a surface of a substrate
US6963090B2 (en) 2003-01-09 2005-11-08 Freescale Semiconductor, Inc. Enhancement mode metal-oxide-semiconductor field effect transistor
US6965128B2 (en) 2003-02-03 2005-11-15 Freescale Semiconductor, Inc. Structure and method for fabricating semiconductor microresonator devices
KR100612838B1 (ko) * 2004-02-07 2006-08-18 삼성전자주식회사 광학벤치, 이를 사용한 박형광픽업 및 그 제조방법
TWI273586B (en) * 2004-06-11 2007-02-11 Hon Hai Prec Ind Co Ltd Optical recording/reproducing system
DE102004035494A1 (de) * 2004-07-22 2006-02-09 Giesecke & Devrient Gmbh Vorrichtung und Verfahren zur Prüfung von Wertdokumenten
US20060092642A1 (en) * 2004-10-29 2006-05-04 Hideki Nakata Light emitting module, optical head, and optical disc recording and reproducing apparatus
JP2007004900A (ja) * 2005-06-23 2007-01-11 Matsushita Electric Ind Co Ltd 光半導体装置及びその製造方法
JP2007058902A (ja) * 2005-08-22 2007-03-08 Funai Electric Co Ltd 光ピックアップ
US8050167B2 (en) * 2009-03-04 2011-11-01 Victor Company Of Japan, Limited Optical device

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JPS60140775A (ja) 1983-12-27 1985-07-25 Nec Corp 半導体素子用ステム
JPS61153360A (ja) 1984-12-26 1986-07-12 清水建設株式会社 氷蓄熱式岩盤内低温貯蔵庫
JP2892812B2 (ja) 1990-10-19 1999-05-17 松下電子工業株式会社 半導体レーザ装置
JP2892820B2 (ja) 1990-11-26 1999-05-17 松下電子工業株式会社 半導体レーザ装置
JP2776487B2 (ja) 1992-01-28 1998-07-16 シャープ株式会社 光学式情報記録再生装置
JPH1166590A (ja) 1997-08-15 1999-03-09 Toshiba Corp 光集積ユニット、光ピックアップ装置およびｄｖｄシステム
JP3804231B2 (ja) 1997-11-18 2006-08-02 ソニー株式会社 光学ピックアップ
US6072579A (en) * 1998-08-27 2000-06-06 Ricoh Company, Ltd. Optical pickup apparatus having improved holographic optical element and photodetector

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6868055B2 (en) 2000-07-13 2005-03-15 Sharp Kabushiki Kaisha Optical pickup
US7106682B2 (en) 2000-07-13 2006-09-12 Sharp Kabushiki Kaisha Optical pickup
US6983005B2 (en) 2001-01-24 2006-01-03 Sharp Kabushiki Kaisha Holographic laser and optical pickup
US7355933B2 (en) 2002-08-07 2008-04-08 Sharp Kabushiki Kaisha Optical pickup device
KR100492534B1 (ko) * 2002-11-29 2005-06-02 엘지전자 주식회사 광 발생기 모듈, 광 검출기 모듈, 그들을 결합한 광픽업장치 및 그들의 제조방법
US6965553B2 (en) 2002-11-29 2005-11-15 Lg Electronics Inc. Light emitting module, optical detecting module, optical pickup apparatus and manufacturing methods thereof
EP1424690A3 (en) * 2002-11-29 2006-05-24 Lg Electronics Inc. Light emitting module, optical detecting module, optical pickup apparatus and manufacturing methods thereof
US7362785B2 (en) 2003-01-10 2008-04-22 Matsushita Electric Industrial Co., Ltd. Semiconductor laser apparatus and production method thereof
US7075960B2 (en) 2003-01-10 2006-07-11 Matsushita Electric Industrial Co., Ltd. Semiconductor laser apparatus and production method thereof
US7736923B2 (en) 2003-12-16 2010-06-15 Panasonic Corporation Optical semiconductor device and method for fabricating the same
JP2017032625A (ja) * 2015-07-29 2017-02-09 日亜化学工業株式会社 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置
US10122147B2 (en) 2015-07-29 2018-11-06 Nichia Corporation Method for manufacturing optical member and method for manufacturing semiconductor laser device
US10581219B2 (en) 2015-07-29 2020-03-03 Nichia Corporation Semiconductor laser device
JP2017045795A (ja) * 2015-08-25 2017-03-02 日亜化学工業株式会社 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置
JP2017069241A (ja) * 2015-09-28 2017-04-06 京セラ株式会社 半導体レーザ素子用パッケージおよび半導体レーザ装置
JP2018011080A (ja) * 2017-09-26 2018-01-18 日亜化学工業株式会社 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置

Also Published As

Publication number Publication date
US20030063552A1 (en) 2003-04-03
US6496469B1 (en) 2002-12-17
US6693871B2 (en) 2004-02-17

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