JP2001102396A - 半導体チップを実装するための方法と装置 - Google Patents

半導体チップを実装するための方法と装置

Info

Publication number
JP2001102396A
JP2001102396A JP2000270719A JP2000270719A JP2001102396A JP 2001102396 A JP2001102396 A JP 2001102396A JP 2000270719 A JP2000270719 A JP 2000270719A JP 2000270719 A JP2000270719 A JP 2000270719A JP 2001102396 A JP2001102396 A JP 2001102396A
Authority
JP
Japan
Prior art keywords
semiconductor chip
bond head
knob
solder
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000270719A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001102396A5 (enExample
Inventor
Rushingaa Christoph
クリストフ・ルシンガー
Rimashaa Marcus
マルクス・リマシャー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Esec Trading AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Trading AG filed Critical Esec Trading AG
Publication of JP2001102396A publication Critical patent/JP2001102396A/ja
Publication of JP2001102396A5 publication Critical patent/JP2001102396A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP2000270719A 1999-09-10 2000-09-06 半導体チップを実装するための方法と装置 Pending JP2001102396A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99810816.1 1999-09-10
EP99810816 1999-09-10

Publications (2)

Publication Number Publication Date
JP2001102396A true JP2001102396A (ja) 2001-04-13
JP2001102396A5 JP2001102396A5 (enExample) 2007-11-08

Family

ID=8243019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000270719A Pending JP2001102396A (ja) 1999-09-10 2000-09-06 半導体チップを実装するための方法と装置

Country Status (1)

Country Link
JP (1) JP2001102396A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111162027A (zh) * 2019-12-27 2020-05-15 陈学军 一种轨道式运输基板封装作业用电动浮动夹紧装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111162027A (zh) * 2019-12-27 2020-05-15 陈学军 一种轨道式运输基板封装作业用电动浮动夹紧装置

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