JP2001102396A5 - - Google Patents

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Publication number
JP2001102396A5
JP2001102396A5 JP2000270719A JP2000270719A JP2001102396A5 JP 2001102396 A5 JP2001102396 A5 JP 2001102396A5 JP 2000270719 A JP2000270719 A JP 2000270719A JP 2000270719 A JP2000270719 A JP 2000270719A JP 2001102396 A5 JP2001102396 A5 JP 2001102396A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000270719A
Other languages
Japanese (ja)
Other versions
JP2001102396A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2001102396A publication Critical patent/JP2001102396A/ja
Publication of JP2001102396A5 publication Critical patent/JP2001102396A5/ja
Pending legal-status Critical Current

Links

JP2000270719A 1999-09-10 2000-09-06 半導体チップを実装するための方法と装置 Pending JP2001102396A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP99810816 1999-09-10
EP99810816.1 1999-09-10

Publications (2)

Publication Number Publication Date
JP2001102396A JP2001102396A (ja) 2001-04-13
JP2001102396A5 true JP2001102396A5 (enExample) 2007-11-08

Family

ID=8243019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000270719A Pending JP2001102396A (ja) 1999-09-10 2000-09-06 半導体チップを実装するための方法と装置

Country Status (1)

Country Link
JP (1) JP2001102396A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111162027B (zh) * 2019-12-27 2025-02-11 陈学军 一种轨道式运输基板封装作业用电动浮动夹紧装置

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