JP2001102157A - セラミックスヒータ - Google Patents
セラミックスヒータInfo
- Publication number
- JP2001102157A JP2001102157A JP28111599A JP28111599A JP2001102157A JP 2001102157 A JP2001102157 A JP 2001102157A JP 28111599 A JP28111599 A JP 28111599A JP 28111599 A JP28111599 A JP 28111599A JP 2001102157 A JP2001102157 A JP 2001102157A
- Authority
- JP
- Japan
- Prior art keywords
- resistance heating
- ceramic
- heating element
- ceramic heater
- current introduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 101
- 238000010438 heat treatment Methods 0.000 claims abstract description 119
- 239000000758 substrate Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 3
- 230000020169 heat generation Effects 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 239000008187 granular material Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 15A Chemical compound 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28111599A JP2001102157A (ja) | 1999-10-01 | 1999-10-01 | セラミックスヒータ |
| TW089117459A TW483285B (en) | 1999-10-01 | 2000-08-29 | Ceramic heater |
| EP00308583A EP1089593A3 (en) | 1999-10-01 | 2000-09-29 | Ceramic heater |
| KR1020000057290A KR20010067260A (ko) | 1999-10-01 | 2000-09-29 | 세라믹 히터 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28111599A JP2001102157A (ja) | 1999-10-01 | 1999-10-01 | セラミックスヒータ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001102157A true JP2001102157A (ja) | 2001-04-13 |
Family
ID=17634573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28111599A Pending JP2001102157A (ja) | 1999-10-01 | 1999-10-01 | セラミックスヒータ |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1089593A3 (ko) |
| JP (1) | JP2001102157A (ko) |
| KR (1) | KR20010067260A (ko) |
| TW (1) | TW483285B (ko) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017377A (ja) * | 2001-06-29 | 2003-01-17 | Kyocera Corp | セラミックヒータ |
| US6646235B2 (en) | 1999-05-19 | 2003-11-11 | Applied Materials, Inc. | Multi-zone resistive heater |
| US6958462B2 (en) | 2002-03-18 | 2005-10-25 | Ngk Insulators, Ltd. | Ceramic heaters |
| US7053339B2 (en) | 2002-03-28 | 2006-05-30 | Ngk Insulators, Ltd. | Ceramic heater |
| US7173220B2 (en) | 2004-03-26 | 2007-02-06 | Ngk Insulators, Ltd. | Heating device |
| JP2007088484A (ja) * | 2006-10-11 | 2007-04-05 | Ngk Insulators Ltd | 加熱装置 |
| US7279661B2 (en) | 2001-10-24 | 2007-10-09 | Ngk Insulators, Ltd. | Heating apparatus |
| US7332694B2 (en) | 2004-01-07 | 2008-02-19 | Ngk Insulators, Ltd. | Heating resistances and heaters |
| US7417206B2 (en) | 2004-10-28 | 2008-08-26 | Kyocera Corporation | Heater, wafer heating apparatus and method for manufacturing heater |
| JP2010257956A (ja) * | 2009-03-30 | 2010-11-11 | Ngk Insulators Ltd | セラミックヒータ及びその製造方法 |
| JP2016054303A (ja) * | 2009-10-21 | 2016-04-14 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | 加熱プレートおよび基板支持体 |
| JP2017017079A (ja) * | 2015-06-29 | 2017-01-19 | 京セラ株式会社 | 試料保持具およびこれを備えた試料処理装置 |
| KR20170040617A (ko) | 2015-10-05 | 2017-04-13 | 주식회사 미코 | 온도 편차 특성이 개선된 기판 가열 장치 |
| JP2018509764A (ja) * | 2015-03-13 | 2018-04-05 | ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド | ワークピースの温度均一性を改善する装置 |
| JP2018056331A (ja) * | 2016-09-29 | 2018-04-05 | 日本特殊陶業株式会社 | 加熱装置 |
| US10568163B2 (en) | 2010-10-22 | 2020-02-18 | Lam Research Corporation | Methods of fault detection for multiplexed heater array |
| WO2020075576A1 (ja) * | 2018-10-11 | 2020-04-16 | 日本発條株式会社 | ステージ、成膜装置、および膜加工装置 |
| JP2020064841A (ja) * | 2018-10-11 | 2020-04-23 | 日本発條株式会社 | ステージ、成膜装置、および膜加工装置 |
| JP2021504971A (ja) * | 2017-11-21 | 2021-02-15 | ワトロー エレクトリック マニュファクチュアリング カンパニー | ビアを有さない複数領域ペデスタルヒーター |
| CN112740830A (zh) * | 2018-10-16 | 2021-04-30 | 美科陶瓷科技有限公司 | 中间区域独立控制陶瓷加热器 |
| KR102437076B1 (ko) | 2021-08-30 | 2022-08-29 | 주식회사 미코세라믹스 | 온도 편차 특성이 개선된 기판 가열 장치 |
| KR102615529B1 (ko) * | 2023-09-19 | 2023-12-19 | 주식회사 제스코 | 이층 히터 패턴이 구비된 정전척 |
| KR20240025376A (ko) | 2022-08-18 | 2024-02-27 | 주식회사 미코세라믹스 | 미세 균열 발생이 억제된 기판 가열 장치 |
| US12127310B2 (en) | 2022-03-16 | 2024-10-22 | Watlow Electric Manufacturing Company | Multi-zone pedestal heater without vias |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6617553B2 (en) * | 1999-05-19 | 2003-09-09 | Applied Materials, Inc. | Multi-zone resistive heater |
| JP3293594B2 (ja) * | 1999-06-29 | 2002-06-17 | 住友電気工業株式会社 | 光ファイバ融着接続部の保護部材加熱装置及び加熱方法 |
| KR101177749B1 (ko) * | 2007-11-27 | 2012-08-29 | 주식회사 코미코 | 세라믹 히터, 이의 제조 방법 및 이를 갖는 박막 증착 장치 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326112A (ja) * | 1992-05-21 | 1993-12-10 | Shin Etsu Chem Co Ltd | 複層セラミックスヒーター |
| JPH08236599A (ja) * | 1995-02-28 | 1996-09-13 | Kyocera Corp | ウェハ保持装置 |
| JPH08274147A (ja) * | 1995-03-30 | 1996-10-18 | Kyocera Corp | ウェハ保持装置 |
-
1999
- 1999-10-01 JP JP28111599A patent/JP2001102157A/ja active Pending
-
2000
- 2000-08-29 TW TW089117459A patent/TW483285B/zh not_active IP Right Cessation
- 2000-09-29 KR KR1020000057290A patent/KR20010067260A/ko not_active Application Discontinuation
- 2000-09-29 EP EP00308583A patent/EP1089593A3/en not_active Withdrawn
Cited By (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6646235B2 (en) | 1999-05-19 | 2003-11-11 | Applied Materials, Inc. | Multi-zone resistive heater |
| JP2003017377A (ja) * | 2001-06-29 | 2003-01-17 | Kyocera Corp | セラミックヒータ |
| JP4744016B2 (ja) * | 2001-06-29 | 2011-08-10 | 京セラ株式会社 | セラミックヒータの製造方法 |
| US7279661B2 (en) | 2001-10-24 | 2007-10-09 | Ngk Insulators, Ltd. | Heating apparatus |
| US6958462B2 (en) | 2002-03-18 | 2005-10-25 | Ngk Insulators, Ltd. | Ceramic heaters |
| US7053339B2 (en) | 2002-03-28 | 2006-05-30 | Ngk Insulators, Ltd. | Ceramic heater |
| US7332694B2 (en) | 2004-01-07 | 2008-02-19 | Ngk Insulators, Ltd. | Heating resistances and heaters |
| US7173220B2 (en) | 2004-03-26 | 2007-02-06 | Ngk Insulators, Ltd. | Heating device |
| US7417206B2 (en) | 2004-10-28 | 2008-08-26 | Kyocera Corporation | Heater, wafer heating apparatus and method for manufacturing heater |
| JP2007088484A (ja) * | 2006-10-11 | 2007-04-05 | Ngk Insulators Ltd | 加熱装置 |
| JP4640842B2 (ja) * | 2006-10-11 | 2011-03-02 | 日本碍子株式会社 | 加熱装置 |
| JP2010257956A (ja) * | 2009-03-30 | 2010-11-11 | Ngk Insulators Ltd | セラミックヒータ及びその製造方法 |
| US8481892B2 (en) | 2009-03-30 | 2013-07-09 | Ngk Insulators, Ltd. | Ceramic heater and method for producing same |
| KR101525634B1 (ko) * | 2009-03-30 | 2015-06-03 | 엔지케이 인슐레이터 엘티디 | 세라믹 히터 및 그 제조 방법 |
| TWI501684B (zh) * | 2009-03-30 | 2015-09-21 | 日本碍子股份有限公司 | 陶瓷加熱器及其製造方法 |
| US10720346B2 (en) | 2009-10-21 | 2020-07-21 | Lam Research Corporation | Substrate support with thermal zones for semiconductor processing |
| JP2016054303A (ja) * | 2009-10-21 | 2016-04-14 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | 加熱プレートおよび基板支持体 |
| US9646861B2 (en) | 2009-10-21 | 2017-05-09 | Lam Research Corporation | Heating plate with heating zones for substrate processing and method of use thereof |
| US9392643B2 (en) | 2009-10-21 | 2016-07-12 | Lam Research Corporation | Heating plate with planar heater zones for semiconductor processing |
| US10236193B2 (en) | 2009-10-21 | 2019-03-19 | Lam Research Corporation | Substrate supports with multi-layer structure including independent operated heater zones |
| US10568163B2 (en) | 2010-10-22 | 2020-02-18 | Lam Research Corporation | Methods of fault detection for multiplexed heater array |
| JP2018509764A (ja) * | 2015-03-13 | 2018-04-05 | ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド | ワークピースの温度均一性を改善する装置 |
| JP2017017079A (ja) * | 2015-06-29 | 2017-01-19 | 京セラ株式会社 | 試料保持具およびこれを備えた試料処理装置 |
| KR20170040617A (ko) | 2015-10-05 | 2017-04-13 | 주식회사 미코 | 온도 편차 특성이 개선된 기판 가열 장치 |
| US11133202B2 (en) | 2015-10-05 | 2021-09-28 | Mico Ceramics Ltd. | Substrate heating apparatus with enhanced temperature uniformity characteristic |
| CN107889288B (zh) * | 2016-09-29 | 2021-12-28 | 日本特殊陶业株式会社 | 加热装置 |
| CN107889288A (zh) * | 2016-09-29 | 2018-04-06 | 日本特殊陶业株式会社 | 加热装置 |
| JP2018056331A (ja) * | 2016-09-29 | 2018-04-05 | 日本特殊陶業株式会社 | 加熱装置 |
| JP7303820B2 (ja) | 2017-11-21 | 2023-07-05 | ワトロー エレクトリック マニュファクチュアリング カンパニー | ビアを有さない複数領域ペデスタルヒーター |
| JP2021504971A (ja) * | 2017-11-21 | 2021-02-15 | ワトロー エレクトリック マニュファクチュアリング カンパニー | ビアを有さない複数領域ペデスタルヒーター |
| WO2020075576A1 (ja) * | 2018-10-11 | 2020-04-16 | 日本発條株式会社 | ステージ、成膜装置、および膜加工装置 |
| JP2020064841A (ja) * | 2018-10-11 | 2020-04-23 | 日本発條株式会社 | ステージ、成膜装置、および膜加工装置 |
| CN112740830A (zh) * | 2018-10-16 | 2021-04-30 | 美科陶瓷科技有限公司 | 中间区域独立控制陶瓷加热器 |
| CN112740830B (zh) * | 2018-10-16 | 2024-06-11 | 美科陶瓷科技有限公司 | 中间区域独立控制陶瓷加热器 |
| KR102437076B1 (ko) | 2021-08-30 | 2022-08-29 | 주식회사 미코세라믹스 | 온도 편차 특성이 개선된 기판 가열 장치 |
| KR20230032890A (ko) | 2021-08-30 | 2023-03-07 | 주식회사 미코세라믹스 | 온도 편차 특성이 개선된 기판 가열 장치 |
| US12127310B2 (en) | 2022-03-16 | 2024-10-22 | Watlow Electric Manufacturing Company | Multi-zone pedestal heater without vias |
| KR20240025376A (ko) | 2022-08-18 | 2024-02-27 | 주식회사 미코세라믹스 | 미세 균열 발생이 억제된 기판 가열 장치 |
| KR102615529B1 (ko) * | 2023-09-19 | 2023-12-19 | 주식회사 제스코 | 이층 히터 패턴이 구비된 정전척 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1089593A3 (en) | 2002-08-28 |
| TW483285B (en) | 2002-04-11 |
| EP1089593A2 (en) | 2001-04-04 |
| KR20010067260A (ko) | 2001-07-12 |
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