JP2001093926A5 - - Google Patents

Download PDF

Info

Publication number
JP2001093926A5
JP2001093926A5 JP2000212613A JP2000212613A JP2001093926A5 JP 2001093926 A5 JP2001093926 A5 JP 2001093926A5 JP 2000212613 A JP2000212613 A JP 2000212613A JP 2000212613 A JP2000212613 A JP 2000212613A JP 2001093926 A5 JP2001093926 A5 JP 2001093926A5
Authority
JP
Japan
Prior art keywords
semiconductor element
resin sheet
resin
semiconductor
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000212613A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001093926A (ja
JP4179736B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2000212613A priority Critical patent/JP4179736B2/ja
Priority claimed from JP2000212613A external-priority patent/JP4179736B2/ja
Publication of JP2001093926A publication Critical patent/JP2001093926A/ja
Publication of JP2001093926A5 publication Critical patent/JP2001093926A5/ja
Application granted granted Critical
Publication of JP4179736B2 publication Critical patent/JP4179736B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000212613A 1999-07-16 2000-07-13 半導体素子実装済部品の製造方法及び半導体素子実装済完成品の製造方法 Expired - Fee Related JP4179736B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000212613A JP4179736B2 (ja) 1999-07-16 2000-07-13 半導体素子実装済部品の製造方法及び半導体素子実装済完成品の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-202847 1999-07-16
JP20284799 1999-07-16
JP2000212613A JP4179736B2 (ja) 1999-07-16 2000-07-13 半導体素子実装済部品の製造方法及び半導体素子実装済完成品の製造方法

Publications (3)

Publication Number Publication Date
JP2001093926A JP2001093926A (ja) 2001-04-06
JP2001093926A5 true JP2001093926A5 (enrdf_load_stackoverflow) 2005-06-09
JP4179736B2 JP4179736B2 (ja) 2008-11-12

Family

ID=26513604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000212613A Expired - Fee Related JP4179736B2 (ja) 1999-07-16 2000-07-13 半導体素子実装済部品の製造方法及び半導体素子実装済完成品の製造方法

Country Status (1)

Country Link
JP (1) JP4179736B2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4529319B2 (ja) * 2001-06-27 2010-08-25 日亜化学工業株式会社 半導体チップとその製造方法
JP5035580B2 (ja) * 2001-06-28 2012-09-26 ナガセケムテックス株式会社 弾性表面波デバイスおよびその製法
JP2003092310A (ja) * 2001-09-17 2003-03-28 Nagase & Co Ltd 封止樹脂付突起電極付ｉｃチップとその製造方法
JP2003092311A (ja) * 2001-09-17 2003-03-28 Nagase & Co Ltd 突起電極付ｉｃチップの実装方法
US7176055B2 (en) 2001-11-02 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component
DE10250541B9 (de) * 2002-10-29 2004-09-16 Infineon Technologies Ag Elektronisches Bauteil mit Unterfüllstoffen aus Thermoplasten und Verfahren zu dessen Herstellung
JP2004152982A (ja) 2002-10-30 2004-05-27 Matsushita Electric Ind Co Ltd 電子部品実装済部品の製造方法、及び該電子部品実装済部品を備えた電子部品実装済完成品の製造方法、並びに電子部品実装済完成品
EP3547380B1 (en) * 2010-02-09 2023-12-20 Nichia Corporation Light emitting device
WO2011145794A1 (ko) 2010-05-18 2011-11-24 서울반도체 주식회사 파장변환층을 갖는 발광 다이오드 칩과 그 제조 방법, 및 그것을 포함하는 패키지 및 그 제조 방법
CN103003966B (zh) * 2010-05-18 2016-08-10 首尔半导体株式会社 具有波长变换层的发光二级管芯片及其制造方法，以及包括其的封装件及其制造方法

Similar Documents

Publication Publication Date Title
US6780668B1 (en) Package of semiconductor device and method of manufacture thereof
US7989268B2 (en) Small form factor molded memory card and a method thereof
US11289265B2 (en) Inductor having conductive line embedded in magnetic material
KR101145535B1 (ko) 기판에 전자 조립품을 적용하는 방법 및 전자 조립품을적용하는 장치
SG102032A1 (en) Semiconductor device and method of its manufacture
CN1323505A (zh) 一种具有嵌入电子装置的物件及其制作方法
WO2007094167A1 (ja) 回路基板および回路基板の製造方法
JP2016103616A (ja) 電子部品、その製造方法及び製造装置
JP2001024145A (ja) 半導体装置及びその製造方法
JP2001093926A5 (enrdf_load_stackoverflow)
JP2009076497A5 (enrdf_load_stackoverflow)
JP3529657B2 (ja) 熱可塑性樹脂基板に半導体素子を取付ける方法、非接触ｉｃカードの製造方法及び半導体素子を取付けた熱可塑性樹脂基板
TW200729368A (en) Method of manufacturing electronic circuit device
US6559523B2 (en) Device for attaching a semiconductor chip to a chip carrier
SG141443A1 (en) A method of forming a surface mountable ic and its assembly
JP4179736B2 (ja) 半導体素子実装済部品の製造方法及び半導体素子実装済完成品の製造方法
WO2007057954A1 (ja) 半導体装置及びその製造方法
JP4209574B2 (ja) 半導体部品実装済部品の製造方法
CN210640175U (zh) 电子芯片封装结构
JP2004520722A (ja) 基体及び当該基体に付属するチップを有する製品
JP2001093934A (ja) 半導体部品実装済部品の製造方法、半導体部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP2001093934A5 (enrdf_load_stackoverflow)
KR100895815B1 (ko) 반도체 패키지 및 이의 제조 방법
JP2000332390A5 (enrdf_load_stackoverflow)
JP4436588B2 (ja) 半導体実装モジュール