JP2001038615A - ポリッシング装置 - Google Patents

ポリッシング装置

Info

Publication number
JP2001038615A
JP2001038615A JP21094999A JP21094999A JP2001038615A JP 2001038615 A JP2001038615 A JP 2001038615A JP 21094999 A JP21094999 A JP 21094999A JP 21094999 A JP21094999 A JP 21094999A JP 2001038615 A JP2001038615 A JP 2001038615A
Authority
JP
Japan
Prior art keywords
polishing
wafer
top ring
pusher
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21094999A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001038615A5 (enExample
Inventor
Kunihiko Sakurai
邦彦 桜井
Satoshi Wakabayashi
聡 若林
Tetsuji Togawa
哲二 戸川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP21094999A priority Critical patent/JP2001038615A/ja
Priority to US09/625,490 priority patent/US6358131B1/en
Publication of JP2001038615A publication Critical patent/JP2001038615A/ja
Publication of JP2001038615A5 publication Critical patent/JP2001038615A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP21094999A 1999-07-26 1999-07-26 ポリッシング装置 Pending JP2001038615A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP21094999A JP2001038615A (ja) 1999-07-26 1999-07-26 ポリッシング装置
US09/625,490 US6358131B1 (en) 1999-07-26 2000-07-25 Polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21094999A JP2001038615A (ja) 1999-07-26 1999-07-26 ポリッシング装置

Publications (2)

Publication Number Publication Date
JP2001038615A true JP2001038615A (ja) 2001-02-13
JP2001038615A5 JP2001038615A5 (enExample) 2004-12-24

Family

ID=16597777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21094999A Pending JP2001038615A (ja) 1999-07-26 1999-07-26 ポリッシング装置

Country Status (2)

Country Link
US (1) US6358131B1 (enExample)
JP (1) JP2001038615A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113118938A (zh) * 2019-12-31 2021-07-16 浙江芯晖装备技术有限公司 一种抛光设备
US20210323119A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
JP2023022905A (ja) * 2021-08-04 2023-02-16 アプライド マテリアルズ インコーポレイテッド 高スループット研磨研磨モジュール及びモジュール研磨システム
CN116749021A (zh) * 2023-08-18 2023-09-15 太原理工大学 一种双百叶轮对称抛磨装置及方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7097544B1 (en) * 1995-10-27 2006-08-29 Applied Materials Inc. Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion
EP1080840A3 (en) * 1999-08-30 2004-01-02 Mitsubishi Materials Corporation Polishing apparatus, polishing method and method of conditioning polishing pad
US20030022498A1 (en) * 2001-07-27 2003-01-30 Jeong In Kwon CMP system and method for efficiently processing semiconductor wafers
US6780083B2 (en) * 2002-04-19 2004-08-24 Peter Wolters Cmp-Systeme Gmbh & Co. Kg Apparatus and method for the chemical mechanical polishing of the surface of circular flat workpieces, in particular semi-conductor wafers
JP4838614B2 (ja) * 2006-03-29 2011-12-14 株式会社岡本工作機械製作所 半導体基板の平坦化装置および平坦化方法
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
US7987014B2 (en) * 2008-05-15 2011-07-26 Texas Instruments Incorporated Systems and methods for selecting wafer processing order for cyclical two pattern defect detection
KR101298358B1 (ko) * 2008-12-19 2013-08-20 엘지디스플레이 주식회사 액정표시장치 제조용 연마장치 및 연마방법
US20220111485A1 (en) * 2020-10-08 2022-04-14 Kctech Co., Ltd. Substrate processing system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
US5329732A (en) 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5649854A (en) 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
DE69719847T2 (de) * 1996-05-16 2004-02-05 Ebara Corp. Verfahren und Vorrichtung zum Polieren von Werkstücken
US5738573A (en) 1997-01-29 1998-04-14 Yueh; William Semiconductor wafer polishing apparatus
US5928062A (en) * 1997-04-30 1999-07-27 International Business Machines Corporation Vertical polishing device and method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113118938A (zh) * 2019-12-31 2021-07-16 浙江芯晖装备技术有限公司 一种抛光设备
US20210323119A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US20210323118A1 (en) * 2020-04-16 2021-10-21 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US12394651B2 (en) * 2020-04-16 2025-08-19 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
US12400892B2 (en) * 2020-04-16 2025-08-26 Applied Materials, Inc. High throughput polishing modules and modular polishing systems
JP2023022905A (ja) * 2021-08-04 2023-02-16 アプライド マテリアルズ インコーポレイテッド 高スループット研磨研磨モジュール及びモジュール研磨システム
CN116749021A (zh) * 2023-08-18 2023-09-15 太原理工大学 一种双百叶轮对称抛磨装置及方法
CN116749021B (zh) * 2023-08-18 2023-11-07 太原理工大学 一种双百叶轮对称抛磨装置及方法

Also Published As

Publication number Publication date
US6358131B1 (en) 2002-03-19

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