JP2001035994A5 - - Google Patents

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Publication number
JP2001035994A5
JP2001035994A5 JP1999201965A JP20196599A JP2001035994A5 JP 2001035994 A5 JP2001035994 A5 JP 2001035994A5 JP 1999201965 A JP1999201965 A JP 1999201965A JP 20196599 A JP20196599 A JP 20196599A JP 2001035994 A5 JP2001035994 A5 JP 2001035994A5
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JP
Japan
Prior art keywords
chip
conductivity type
printed wiring
semiconductor integrated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999201965A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001035994A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11201965A priority Critical patent/JP2001035994A/ja
Priority claimed from JP11201965A external-priority patent/JP2001035994A/ja
Publication of JP2001035994A publication Critical patent/JP2001035994A/ja
Publication of JP2001035994A5 publication Critical patent/JP2001035994A5/ja
Pending legal-status Critical Current

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JP11201965A 1999-07-15 1999-07-15 半導体集積回路装置およびシステム基板 Pending JP2001035994A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11201965A JP2001035994A (ja) 1999-07-15 1999-07-15 半導体集積回路装置およびシステム基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11201965A JP2001035994A (ja) 1999-07-15 1999-07-15 半導体集積回路装置およびシステム基板

Publications (2)

Publication Number Publication Date
JP2001035994A JP2001035994A (ja) 2001-02-09
JP2001035994A5 true JP2001035994A5 (de) 2005-06-23

Family

ID=16449708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11201965A Pending JP2001035994A (ja) 1999-07-15 1999-07-15 半導体集積回路装置およびシステム基板

Country Status (1)

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JP (1) JP2001035994A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140037A (ja) 2002-10-15 2004-05-13 Oki Electric Ind Co Ltd 半導体装置、及びその製造方法
JP4408832B2 (ja) * 2005-05-20 2010-02-03 Ｎｅｃエレクトロニクス株式会社 半導体装置
JP2007188916A (ja) 2006-01-11 2007-07-26 Renesas Technology Corp 半導体装置
TWI390497B (zh) * 2008-06-20 2013-03-21 Novatek Microelectronics Corp 源極驅動器與液晶顯示器
JP2014082245A (ja) 2012-10-15 2014-05-08 J Devices:Kk 半導体記憶装置及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5737867A (en) * 1980-08-18 1982-03-02 Mitsubishi Electric Corp Semiconductor device
JPH05109978A (ja) * 1991-10-17 1993-04-30 Fujitsu Ltd 半導体装置
JPH07273275A (ja) * 1994-03-29 1995-10-20 Toshiba Corp 半導体装置
JPH09260441A (ja) * 1996-03-26 1997-10-03 Mitsubishi Electric Corp 半導体装置
JPH1070243A (ja) * 1996-05-30 1998-03-10 Toshiba Corp 半導体集積回路装置およびその検査方法およびその検査装置
JPH10256483A (ja) * 1997-03-11 1998-09-25 Toshiba Corp Ｍｏｓ型半導体集積回路
JPH113969A (ja) * 1997-06-13 1999-01-06 Matsushita Electric Ind Co Ltd チップ部品が積層された基板部品
JP3111312B2 (ja) * 1997-10-29 2000-11-20 ローム株式会社 半導体装置
JP3399808B2 (ja) * 1997-10-21 2003-04-21 ローム株式会社 多層チップの組み立て方法

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