JP2001035907A - 吸着装置 - Google Patents

吸着装置

Info

Publication number
JP2001035907A
JP2001035907A JP11210192A JP21019299A JP2001035907A JP 2001035907 A JP2001035907 A JP 2001035907A JP 11210192 A JP11210192 A JP 11210192A JP 21019299 A JP21019299 A JP 21019299A JP 2001035907 A JP2001035907 A JP 2001035907A
Authority
JP
Japan
Prior art keywords
electrodes
substrate
suction device
electrode
adsorption
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11210192A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001035907A5 (enExample
Inventor
Ko Fuwa
耕 不破
Ken Maehira
謙 前平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP11210192A priority Critical patent/JP2001035907A/ja
Priority to TW90101048A priority patent/TWI235448B/zh
Priority to US09/768,173 priority patent/US6781812B2/en
Publication of JP2001035907A publication Critical patent/JP2001035907A/ja
Publication of JP2001035907A5 publication Critical patent/JP2001035907A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
JP11210192A 1999-07-26 1999-07-26 吸着装置 Pending JP2001035907A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP11210192A JP2001035907A (ja) 1999-07-26 1999-07-26 吸着装置
TW90101048A TWI235448B (en) 1999-07-26 2001-01-17 Absorption device
US09/768,173 US6781812B2 (en) 1999-07-26 2001-01-24 Chuck equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11210192A JP2001035907A (ja) 1999-07-26 1999-07-26 吸着装置
US09/768,173 US6781812B2 (en) 1999-07-26 2001-01-24 Chuck equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005205730A Division JP2006054445A (ja) 2005-07-14 2005-07-14 吸着装置

Publications (2)

Publication Number Publication Date
JP2001035907A true JP2001035907A (ja) 2001-02-09
JP2001035907A5 JP2001035907A5 (enExample) 2005-12-02

Family

ID=26517905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11210192A Pending JP2001035907A (ja) 1999-07-26 1999-07-26 吸着装置

Country Status (2)

Country Link
US (1) US6781812B2 (enExample)
JP (1) JP2001035907A (enExample)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003037159A (ja) * 2001-07-25 2003-02-07 Toto Ltd 静電チャックユニット
JP2004047912A (ja) * 2002-07-16 2004-02-12 Ulvac Japan Ltd 吸着装置及び真空処理装置
JP2006066857A (ja) * 2004-07-26 2006-03-09 Creative Technology:Kk 双極型静電チャック
JP2007053152A (ja) * 2005-08-16 2007-03-01 Ulvac Japan Ltd 吸着装置、真空処理装置
JP2007059694A (ja) * 2005-08-25 2007-03-08 Ulvac Japan Ltd 吸着装置、その製造方法、真空処理装置
JP2007073892A (ja) * 2005-09-09 2007-03-22 Ulvac Japan Ltd 吸着装置、貼り合わせ装置、封着方法
KR100750835B1 (ko) * 2001-01-19 2007-08-22 가부시키가이샤 알박 흡착장치
JP2008135736A (ja) * 2006-10-31 2008-06-12 Taiheiyo Cement Corp 静電チャック
JP2010114396A (ja) * 2008-11-10 2010-05-20 Taiheiyo Cement Corp 静電チャック
JP2010161319A (ja) * 2009-01-09 2010-07-22 Nikon Corp 静電吸着保持装置、露光装置及びデバイスの製造方法
WO2011081046A1 (ja) * 2009-12-28 2011-07-07 株式会社アルバック 成膜装置及び成膜方法
JP2011181940A (ja) * 2011-04-13 2011-09-15 Ulvac Japan Ltd 吸着装置の製造方法
JP2012044200A (ja) * 2011-10-05 2012-03-01 Ulvac Japan Ltd 吸着装置
JP2012059858A (ja) * 2010-09-08 2012-03-22 Ulvac Japan Ltd 静電吸着装置
JP2015185529A (ja) * 2014-03-26 2015-10-22 株式会社アドバンテスト ステージ装置および電子線装置
JP2015185528A (ja) * 2014-03-26 2015-10-22 株式会社アドバンテスト ステージ装置および電子線装置

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
WO2005089176A2 (en) 2004-03-12 2005-09-29 Sri International Mechanical meta-materials
US20060012939A1 (en) * 2004-04-09 2006-01-19 Varian Semiconductor Equipment Associates, Inc. Clamp for use in processing semiconductor workpieces
US7126091B1 (en) 2005-03-23 2006-10-24 Eclipse Energy Systems, Inc. Workpiece holder for vacuum processing
US7554787B2 (en) * 2006-06-05 2009-06-30 Sri International Wall crawling devices
US7551419B2 (en) * 2006-06-05 2009-06-23 Sri International Electroadhesion
KR100763532B1 (ko) * 2006-08-17 2007-10-05 삼성전자주식회사 웨이퍼 지지장치, 웨이퍼 노광 장치 및 웨이퍼 지지방법
US20080151466A1 (en) * 2006-12-26 2008-06-26 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chuck and method of forming
WO2008082978A2 (en) * 2006-12-26 2008-07-10 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chuck and method of forming
KR101923174B1 (ko) * 2011-05-11 2018-11-29 삼성디스플레이 주식회사 정전 척, 상기 정전 척을 포함하는 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
WO2013027584A1 (ja) * 2011-08-19 2013-02-28 株式会社アルバック 真空処理装置及び真空処理方法
US10388493B2 (en) * 2011-09-16 2019-08-20 Lam Research Corporation Component of a substrate support assembly producing localized magnetic fields
DE102012212465B3 (de) * 2012-07-17 2013-11-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Elektroadhäsionsgreifer zum Halten von Werkstücken
WO2015013142A1 (en) 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
KR101876501B1 (ko) 2013-08-05 2018-07-10 어플라이드 머티어리얼스, 인코포레이티드 인-시츄 제거 가능한 정전 척
KR102139682B1 (ko) 2013-08-05 2020-07-30 어플라이드 머티어리얼스, 인코포레이티드 얇은 기판 취급을 위한 정전 캐리어
KR20180110213A (ko) * 2013-08-06 2018-10-08 어플라이드 머티어리얼스, 인코포레이티드 국부적으로 가열되는 다-구역 기판 지지부
WO2015042302A1 (en) 2013-09-20 2015-03-26 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck
US9460950B2 (en) 2013-12-06 2016-10-04 Applied Materials, Inc. Wafer carrier for smaller wafers and wafer pieces
WO2015171207A1 (en) 2014-05-09 2015-11-12 Applied Materials, Inc. Substrate carrier system and method for using the same
CN106575720B (zh) 2014-05-09 2019-01-15 应用材料公司 具有保护覆盖物的基板载体系统
US9959961B2 (en) 2014-06-02 2018-05-01 Applied Materials, Inc. Permanent magnetic chuck for OLED mask chucking
WO2016195945A1 (en) 2015-06-04 2016-12-08 Applied Materials, Inc. Transparent electrostatic carrier
KR102513443B1 (ko) 2016-03-15 2023-03-24 삼성전자주식회사 정전 척 및 그를 포함하는 기판 처리 장치
FR3054930B1 (fr) 2016-08-02 2018-07-13 Soitec Utilisation d'un champ electrique pour detacher une couche piezo-electrique a partir d'un substrat donneur
US11562913B2 (en) * 2019-04-25 2023-01-24 Watlow Electric Manufacturing Company Multi-zone azimuthal heater
EP4041835A1 (en) * 2019-09-10 2022-08-17 OnRobot A/S Dual electrode electroadhesion and dust mitigation/cleaning system
KR20210089375A (ko) * 2020-01-08 2021-07-16 주식회사 미코세라믹스 정전척

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
JP2535663B2 (ja) * 1990-10-02 1996-09-18 株式会社アビサレ 掲示装置
US5847918A (en) * 1995-09-29 1998-12-08 Lam Research Corporation Electrostatic clamping method and apparatus for dielectric workpieces in vacuum processors
US5751537A (en) * 1996-05-02 1998-05-12 Applied Materials, Inc. Multielectrode electrostatic chuck with fuses
JP3805134B2 (ja) 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100750835B1 (ko) * 2001-01-19 2007-08-22 가부시키가이샤 알박 흡착장치
JP2003037159A (ja) * 2001-07-25 2003-02-07 Toto Ltd 静電チャックユニット
JP2004047912A (ja) * 2002-07-16 2004-02-12 Ulvac Japan Ltd 吸着装置及び真空処理装置
JP2006066857A (ja) * 2004-07-26 2006-03-09 Creative Technology:Kk 双極型静電チャック
JP2007053152A (ja) * 2005-08-16 2007-03-01 Ulvac Japan Ltd 吸着装置、真空処理装置
JP2007059694A (ja) * 2005-08-25 2007-03-08 Ulvac Japan Ltd 吸着装置、その製造方法、真空処理装置
JP2007073892A (ja) * 2005-09-09 2007-03-22 Ulvac Japan Ltd 吸着装置、貼り合わせ装置、封着方法
JP2008135736A (ja) * 2006-10-31 2008-06-12 Taiheiyo Cement Corp 静電チャック
JP2010114396A (ja) * 2008-11-10 2010-05-20 Taiheiyo Cement Corp 静電チャック
JP2010161319A (ja) * 2009-01-09 2010-07-22 Nikon Corp 静電吸着保持装置、露光装置及びデバイスの製造方法
WO2011081046A1 (ja) * 2009-12-28 2011-07-07 株式会社アルバック 成膜装置及び成膜方法
CN102686764A (zh) * 2009-12-28 2012-09-19 株式会社爱发科 成膜装置以及成膜方法
JP5506824B2 (ja) * 2009-12-28 2014-05-28 株式会社アルバック 成膜装置及び成膜方法
JP2012059858A (ja) * 2010-09-08 2012-03-22 Ulvac Japan Ltd 静電吸着装置
JP2011181940A (ja) * 2011-04-13 2011-09-15 Ulvac Japan Ltd 吸着装置の製造方法
JP2012044200A (ja) * 2011-10-05 2012-03-01 Ulvac Japan Ltd 吸着装置
JP2015185529A (ja) * 2014-03-26 2015-10-22 株式会社アドバンテスト ステージ装置および電子線装置
JP2015185528A (ja) * 2014-03-26 2015-10-22 株式会社アドバンテスト ステージ装置および電子線装置

Also Published As

Publication number Publication date
US20020135967A1 (en) 2002-09-26
US6781812B2 (en) 2004-08-24

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