JP2001024294A - プリント配線基板 - Google Patents
プリント配線基板Info
- Publication number
- JP2001024294A JP2001024294A JP11195923A JP19592399A JP2001024294A JP 2001024294 A JP2001024294 A JP 2001024294A JP 11195923 A JP11195923 A JP 11195923A JP 19592399 A JP19592399 A JP 19592399A JP 2001024294 A JP2001024294 A JP 2001024294A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pattern
- solder
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 230000001788 irregular Effects 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000005338 heat storage Methods 0.000 abstract description 2
- 239000013078 crystal Substances 0.000 description 22
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11195923A JP2001024294A (ja) | 1999-07-09 | 1999-07-09 | プリント配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11195923A JP2001024294A (ja) | 1999-07-09 | 1999-07-09 | プリント配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001024294A true JP2001024294A (ja) | 2001-01-26 |
| JP2001024294A5 JP2001024294A5 (enrdf_load_stackoverflow) | 2006-08-31 |
Family
ID=16349240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11195923A Withdrawn JP2001024294A (ja) | 1999-07-09 | 1999-07-09 | プリント配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001024294A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008026485A1 (en) * | 2006-08-31 | 2008-03-06 | Daikin Industries, Ltd. | Electric power converter |
-
1999
- 1999-07-09 JP JP11195923A patent/JP2001024294A/ja not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008026485A1 (en) * | 2006-08-31 | 2008-03-06 | Daikin Industries, Ltd. | Electric power converter |
| US8030661B2 (en) | 2006-08-31 | 2011-10-04 | Daikin Industries, Ltd. | Power conversion apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060704 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060704 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20060704 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070802 |