JP2000517457A - 等方性導電接着剤を使用して電気的相互接続を形成する方法およびそれにより形成される接続 - Google Patents

等方性導電接着剤を使用して電気的相互接続を形成する方法およびそれにより形成される接続

Info

Publication number
JP2000517457A
JP2000517457A JP09526973A JP52697397A JP2000517457A JP 2000517457 A JP2000517457 A JP 2000517457A JP 09526973 A JP09526973 A JP 09526973A JP 52697397 A JP52697397 A JP 52697397A JP 2000517457 A JP2000517457 A JP 2000517457A
Authority
JP
Japan
Prior art keywords
substrate
conductive adhesive
conductive
adhesive
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP09526973A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000517457A5 (enExample
Inventor
シャール，ウェイン．シー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2000517457A publication Critical patent/JP2000517457A/ja
Publication of JP2000517457A5 publication Critical patent/JP2000517457A5/ja
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W74/012—
    • H10W74/15—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H10W72/072—
    • H10W72/07236—
    • H10W72/073—
    • H10W72/07331—
    • H10W72/241—
    • H10W72/325—
    • H10W72/352—
    • H10W72/353—
    • H10W72/354—
    • H10W72/856—
    • H10W90/724—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP09526973A 1996-01-26 1997-01-23 等方性導電接着剤を使用して電気的相互接続を形成する方法およびそれにより形成される接続 Ceased JP2000517457A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/592,042 1996-01-26
US08/592,042 US5842273A (en) 1996-01-26 1996-01-26 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
PCT/US1997/001026 WO1997027646A2 (en) 1996-01-26 1997-01-23 Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby

Publications (2)

Publication Number Publication Date
JP2000517457A true JP2000517457A (ja) 2000-12-26
JP2000517457A5 JP2000517457A5 (enExample) 2004-11-11

Family

ID=24369037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP09526973A Ceased JP2000517457A (ja) 1996-01-26 1997-01-23 等方性導電接着剤を使用して電気的相互接続を形成する方法およびそれにより形成される接続

Country Status (5)

Country Link
US (1) US5842273A (enExample)
EP (1) EP0876689B1 (enExample)
JP (1) JP2000517457A (enExample)
DE (1) DE69700591T2 (enExample)
WO (1) WO1997027646A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023024438A (ja) * 2018-01-31 2023-02-16 三国電子有限会社 接続構造体および接続構造体の作製方法

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6063701A (en) * 1996-09-14 2000-05-16 Ricoh Company, Ltd. Conductive particle transferring method
US6635514B1 (en) * 1996-12-12 2003-10-21 Tessera, Inc. Compliant package with conductive elastomeric posts
US6534724B1 (en) * 1997-05-28 2003-03-18 International Business Machines Corporation Enhanced design and process for a conductive adhesive
US6396712B1 (en) 1998-02-12 2002-05-28 Rose Research, L.L.C. Method and apparatus for coupling circuit components
US6589376B1 (en) * 1998-04-28 2003-07-08 International Business Machines Corporation Method and composition for mounting an electronic component and device formed therewith
FR2778308B1 (fr) * 1998-04-30 2006-05-26 Schlumberger Systems & Service Procede de realisation d'un composant electronique et composant electronique
US6329832B1 (en) * 1998-10-05 2001-12-11 Micron Technology, Inc. Method for in-line testing of flip-chip semiconductor assemblies
CN1374993A (zh) * 1999-03-02 2002-10-16 摩托罗拉公司 电子标签组件及其方法
US6230400B1 (en) 1999-09-17 2001-05-15 George Tzanavaras Method for forming interconnects
US6399892B1 (en) * 2000-09-19 2002-06-04 International Business Machines Corporation CTE compensated chip interposer
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
US6866741B2 (en) * 2001-01-08 2005-03-15 Fujitsu Limited Method for joining large substrates
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
US6802918B1 (en) * 2001-05-09 2004-10-12 Raytheon Company Fabrication method for adhesive pressure bonding two components together with closed-loop control
GB0123676D0 (en) * 2001-10-02 2001-11-21 Poly Flex Circuits Ltd Method of manufacturing circuits
JP2003139593A (ja) * 2001-11-07 2003-05-14 Hitachi Ltd 車載電子機器および熱式流量計
US6622380B1 (en) * 2002-02-12 2003-09-23 Micron Technology, Inc. Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US6916181B2 (en) * 2003-06-11 2005-07-12 Neoconix, Inc. Remountable connector for land grid array packages
US7628617B2 (en) 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7244125B2 (en) 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US20070020960A1 (en) 2003-04-11 2007-01-25 Williams John D Contact grid array system
US7113408B2 (en) 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US7597561B2 (en) 2003-04-11 2009-10-06 Neoconix, Inc. Method and system for batch forming spring elements in three dimensions
US7056131B1 (en) 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US6869290B2 (en) * 2003-06-11 2005-03-22 Neoconix, Inc. Circuitized connector for land grid array
US7070419B2 (en) * 2003-06-11 2006-07-04 Neoconix Inc. Land grid array connector including heterogeneous contact elements
US7245022B2 (en) * 2003-11-25 2007-07-17 International Business Machines Corporation Semiconductor module with improved interposer structure and method for forming the same
US7025601B2 (en) 2004-03-19 2006-04-11 Neoconix, Inc. Interposer and method for making same
TWI309094B (en) 2004-03-19 2009-04-21 Neoconix Inc Electrical connector in a flexible host and method for fabricating the same
US7347698B2 (en) 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
US7090503B2 (en) 2004-03-19 2006-08-15 Neoconix, Inc. Interposer with compliant pins
US7695053B1 (en) * 2004-04-16 2010-04-13 Bae Systems Survivability Systems, Llc Lethal threat protection system for a vehicle and method
US7354276B2 (en) 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
US7291842B2 (en) * 2005-06-14 2007-11-06 Varian Medical Systems Technologies, Inc. Photoconductor imagers with sandwich structure
US7357644B2 (en) 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
TWI434119B (zh) 2006-06-28 2014-04-11 Creator Technology Bv 用於可撓性顯示器之改良的共同接點佈局
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
US11495560B2 (en) * 2015-08-10 2022-11-08 X Display Company Technology Limited Chiplets with connection posts
US10468363B2 (en) 2015-08-10 2019-11-05 X-Celeprint Limited Chiplets with connection posts
CN111629519B (zh) * 2020-05-18 2021-04-09 微智医疗器械有限公司 芯片与电路板的连接方法、电路板组件及电子设备
CN111933706B (zh) * 2020-06-16 2022-07-26 华南理工大学 一种基于导电凝胶的GaN基HEMT传感器及其制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1985004980A1 (en) * 1984-04-19 1985-11-07 Amp Incorporated Anisotropically conductive adhesive composition
US4588456A (en) * 1984-10-04 1986-05-13 Amp Incorporated Method of making adhesive electrical interconnecting means
US4642421A (en) * 1984-10-04 1987-02-10 Amp Incorporated Adhesive electrical interconnecting means
US4729809A (en) * 1985-03-14 1988-03-08 Amp Incorporated Anisotropically conductive adhesive composition
US5068714A (en) * 1989-04-05 1991-11-26 Robert Bosch Gmbh Method of electrically and mechanically connecting a semiconductor to a substrate using an electrically conductive tacky adhesive and the device so made
JP2895872B2 (ja) * 1989-09-26 1999-05-24 触媒化成工業株式会社 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JPH0738502B2 (ja) * 1989-10-17 1995-04-26 シャープ株式会社 回路基板の接続方法
DE4130637A1 (de) * 1990-10-11 1992-04-16 Abb Patent Gmbh Verfahren zur herstellung eines verbindungselements fuer eine verwendung in leistungshalbleitermodulen
JPH04323290A (ja) * 1991-02-25 1992-11-12 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
US5225966A (en) * 1991-07-24 1993-07-06 At&T Bell Laboratories Conductive adhesive film techniques
US5258577A (en) * 1991-11-22 1993-11-02 Clements James R Die mounting with uniaxial conductive adhesive
US5397685A (en) * 1992-02-03 1995-03-14 Shipley Company Inc. Light-sensitive composition and process
US5221417A (en) * 1992-02-20 1993-06-22 At&T Bell Laboratories Conductive adhesive film techniques
US5304460A (en) * 1992-09-30 1994-04-19 At&T Bell Laboratories Anisotropic conductor techniques
JPH06275678A (ja) * 1993-03-18 1994-09-30 Fujitsu Ltd リペア性を向上させた導電性接着剤によるチップと基板との接続方法
US5616206A (en) * 1993-06-15 1997-04-01 Ricoh Company, Ltd. Method for arranging conductive particles on electrodes of substrate
US5637176A (en) * 1994-06-16 1997-06-10 Fry's Metals, Inc. Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023024438A (ja) * 2018-01-31 2023-02-16 三国電子有限会社 接続構造体および接続構造体の作製方法
JP7628712B2 (ja) 2018-01-31 2025-02-12 三国電子有限会社 接続構造体

Also Published As

Publication number Publication date
EP0876689A2 (en) 1998-11-11
WO1997027646A2 (en) 1997-07-31
WO1997027646A3 (en) 1997-10-23
DE69700591D1 (de) 1999-11-11
US5842273A (en) 1998-12-01
DE69700591T2 (de) 2000-02-10
EP0876689B1 (en) 1999-10-06

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