JP2000513151A - Rfコンポーネントを有する電気機器たとえば移動無線通信機器のための配線基板 - Google Patents
Rfコンポーネントを有する電気機器たとえば移動無線通信機器のための配線基板Info
- Publication number
- JP2000513151A JP2000513151A JP10539033A JP53903398A JP2000513151A JP 2000513151 A JP2000513151 A JP 2000513151A JP 10539033 A JP10539033 A JP 10539033A JP 53903398 A JP53903398 A JP 53903398A JP 2000513151 A JP2000513151 A JP 2000513151A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- layer
- printed wiring
- board according
- micro via
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1438—Treating holes after another process, e.g. coating holes after coating the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.RF回路、非RF回路、RF導体路構造、ならびに非RF導体路構造がプリ ント配線板上に配置されている形式の、RFコンポーネントを備えた電気機器た とえば移動無線通信機器のためのプリント配線板において、 a)第1の外側層(LPL2;図6、図8)と第2の外側層(LPL5;図6 、図8)を備えた支持体(LPT1,LPT2;図2および図5)が設けられて おり、該支持体は、前記の外側層を貫通する複数のホール(DB1LPT3,4,DB 2LPT3,4;図6、図8)を有しており、 b)マイクロビア層(LPL1,LPL2;図6、図8)が設けられており、 該マイクロビア層は両方の外側層のうち少なくとも一方の外側層の上において少 なくとも平面の一部分に被着されており、 c)前記マイクロビア層の上および/または前記マイクロビア層によりそれぞ れ覆われた外側層の上に設けられた支持体のRFグラウンド層(LPL3;図6 、図8)に関係して、RF回路およびRF導体路構造のRF特性を保護するため に、非RF回路および非RF導体路構造に対する阻止領域(SB3,SB4;図 6、図8)が設けられてお り、 d)前記マイクロビア層の上に配置された回路のコンポーネントと、 e)少なくとも前記マイクロビア層の上および/または前記マイクロビア層に よりそれぞれ覆われた外側層の上に配置された回路の配線と、 f)少なくとも前記マイクロビア層の上および/または前記マイクロビア層に よりそれぞれ覆われた外側層の上に配置された導体路構造が設けられていること を特徴とする、 RFコンポーネントを備えた電気機器のためのプリント配線板。 2.前記の外側層とマイクロビア層との間の間隔は、マイクロビア層がシーケン シャルビルトアッププロセス(SBUプロセス、Sequential Built Up Process )によって製造できるように選定されている、 請求項1記載のプリント配線板。 3.前記の外側層とマイクロビア層との間の間隔は、マイクロビア層がCO2レ ーザによるレーザドリリングによって製造できるように選定されている、請求項 1記載のプリント配線板。 4.前記の外側層とマイクロビア層との間の間隔は、マイクロビア層がシルバー バンププロセス(SBプロセス、Silver Bump Process)によって製造できるよ うに選定されている、請求項1記載のプリント 配線板。 5.前記の外側層とマイクロビア層との間の間隔は50μmである、請求項2、 3または4記載のプリント配線板。 6.第1のホール(DB1LPT3,4;図6、図8)は、阻止領域の設けられていな いマイクロビア層により覆われており、該第1のホールを覆うマイクロビア層の 上にRF回路が取り付けられており、および/またはRFシールドのために金属 層が被着されている、請求項1から5のいずれか1項記載のプリント配線板。 7.前記第1のホールは充填材料で充填されている、請求項6記載のプリント配 線板。 8.前記支持体は多層支持体である、請求項1〜7のいずれか1項記載のプリン ト配線板。 9.前記多層支持体はハイブリッドマスラムプロセス(Hybrid-Masslam Process )によって形成されている、請求項8記載のプリント配線板。 10.DECT通信機器において使用する、請求項1〜9のいずれか1項記載のプ リント配線板の用途。 11.GSM通信機器において使用する、請求項1〜9のいずれか1項記載のプリ ント配線板の用途。 12.PHS通信機器において使用する、請求項1〜9のいずれか1項記載のプリ ント配線板の用途。 13.IS−95通信機器において使用する、請求項1 〜9のいずれか1項記載のプリント配線板の用途。 14.基本伝送方式FDMA,TDMA,CDMAのうち単一のまたは複合的な伝 送方式をベースとする無線通信機器において使用する、請求項1〜9のいずれか 1項記載のプリント配線板の用途。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/DE1997/000490 WO1998041066A1 (de) | 1997-03-12 | 1997-03-12 | Leiterplatte für elektrische geräte mit hf-komponenten, insbesondere für mobile funk-telekommunikationsgeräte |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003362195A Division JP2004119986A (ja) | 2003-10-22 | 2003-10-22 | Rfコンポーネントを備えた電気機器たとえば移動無線通信機器のためのプリント配線板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000513151A true JP2000513151A (ja) | 2000-10-03 |
JP4072207B2 JP4072207B2 (ja) | 2008-04-09 |
Family
ID=6918477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53903398A Expired - Lifetime JP4072207B2 (ja) | 1997-03-12 | 1997-03-12 | Rfコンポーネントを備えた電気機器たとえば移動無線通信機器のためのプリント配線板 |
Country Status (12)
Country | Link |
---|---|
US (1) | US6370034B1 (ja) |
EP (1) | EP0956747B1 (ja) |
JP (1) | JP4072207B2 (ja) |
KR (1) | KR100393243B1 (ja) |
AT (1) | ATE206579T1 (ja) |
AU (1) | AU725291B2 (ja) |
BR (1) | BR9714669B1 (ja) |
CA (1) | CA2283150C (ja) |
DE (1) | DE59704821D1 (ja) |
ES (1) | ES2166532T3 (ja) |
HK (1) | HK1026808A1 (ja) |
WO (1) | WO1998041066A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002164465A (ja) * | 2000-11-28 | 2002-06-07 | Kyocera Corp | 配線基板、配線ボード、それらの実装構造、ならびにマルチチップモジュール |
TWM248187U (en) * | 2003-01-15 | 2004-10-21 | Abocom Sys Inc | Printed circuit board structure of RF transmission device |
RU2009111002A (ru) * | 2006-08-27 | 2010-10-10 | Май Мобайл Вотч Лимитед (Cn) | Мобильный телефон-часы для системы gsm |
US8994182B2 (en) | 2012-12-21 | 2015-03-31 | Cree, Inc. | Dielectric solder barrier for semiconductor devices |
US8970010B2 (en) | 2013-03-15 | 2015-03-03 | Cree, Inc. | Wafer-level die attach metallization |
EP3011810A4 (en) * | 2013-06-21 | 2017-04-05 | Sanmina Corporation | Method of forming a laminate structure having a plated through-hole using a removable cover layer |
CN108538799B (zh) | 2017-03-02 | 2024-02-27 | 弗莱克斯有限公司 | 互连部件和互连组件 |
US10535845B1 (en) | 2017-07-14 | 2020-01-14 | Flex Ltd. | Flexible and stretchable chain battery |
US10426029B1 (en) * | 2018-01-18 | 2019-09-24 | Flex Ltd. | Micro-pad array to thread flexible attachment |
US10687421B1 (en) | 2018-04-04 | 2020-06-16 | Flex Ltd. | Fabric with woven wire braid |
US10575381B1 (en) | 2018-06-01 | 2020-02-25 | Flex Ltd. | Electroluminescent display on smart textile and interconnect methods |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4402998A (en) * | 1982-01-04 | 1983-09-06 | Western Electric Co., Inc. | Method for providing an adherent electroless metal coating on an epoxy surface |
US5768109A (en) * | 1991-06-26 | 1998-06-16 | Hughes Electronics | Multi-layer circuit board and semiconductor flip chip connection |
US5357225A (en) * | 1992-12-23 | 1994-10-18 | Alcatel Network Systems, Inc. | Method and apparatus for adjusting the impedance of a microstrip transmission line |
CN1034044C (zh) * | 1993-03-31 | 1997-02-12 | 摩托罗拉公司 | 转换电路及其方法 |
US5451720A (en) * | 1994-03-23 | 1995-09-19 | Dell Usa, L.P. | Circuit board thermal relief pattern having improved electrical and EMI characteristics |
FI102121B1 (fi) * | 1995-04-07 | 1998-10-15 | Lk Products Oy | Radiotietoliikenteen lähetin/vastaanotin |
US5568107A (en) * | 1995-05-01 | 1996-10-22 | Apple Computer, Inc. | Transmission line having impedance set by reference plane fenestration |
JP3275632B2 (ja) * | 1995-06-15 | 2002-04-15 | 株式会社村田製作所 | 無線通信装置 |
US6112060A (en) * | 1997-09-15 | 2000-08-29 | Motorola, Inc. | Communication device with a signal switch assembly |
-
1997
- 1997-03-12 ES ES97916344T patent/ES2166532T3/es not_active Expired - Lifetime
- 1997-03-12 WO PCT/DE1997/000490 patent/WO1998041066A1/de active IP Right Grant
- 1997-03-12 DE DE59704821T patent/DE59704821D1/de not_active Expired - Lifetime
- 1997-03-12 KR KR10-1999-7008216A patent/KR100393243B1/ko not_active IP Right Cessation
- 1997-03-12 CA CA002283150A patent/CA2283150C/en not_active Expired - Lifetime
- 1997-03-12 EP EP97916344A patent/EP0956747B1/de not_active Expired - Lifetime
- 1997-03-12 BR BRPI9714669-2A patent/BR9714669B1/pt not_active IP Right Cessation
- 1997-03-12 US US09/381,041 patent/US6370034B1/en not_active Expired - Lifetime
- 1997-03-12 AT AT97916344T patent/ATE206579T1/de active
- 1997-03-12 JP JP53903398A patent/JP4072207B2/ja not_active Expired - Lifetime
- 1997-03-12 AU AU64803/98A patent/AU725291B2/en not_active Expired
-
2000
- 2000-09-18 HK HK00105862A patent/HK1026808A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1998041066A1 (de) | 1998-09-17 |
ATE206579T1 (de) | 2001-10-15 |
KR100393243B1 (ko) | 2003-07-31 |
EP0956747A1 (de) | 1999-11-17 |
HK1026808A1 (en) | 2000-12-22 |
AU725291B2 (en) | 2000-10-12 |
CA2283150C (en) | 2003-09-30 |
JP4072207B2 (ja) | 2008-04-09 |
US6370034B1 (en) | 2002-04-09 |
BR9714669B1 (pt) | 2011-02-08 |
ES2166532T3 (es) | 2002-04-16 |
EP0956747B1 (de) | 2001-10-04 |
BR9714669A (pt) | 2000-06-27 |
DE59704821D1 (de) | 2001-11-08 |
CA2283150A1 (en) | 1998-09-17 |
AU6480398A (en) | 1998-09-29 |
KR20000076127A (ko) | 2000-12-26 |
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