WO2023165426A1 - 集成电路组件和电子设备 - Google Patents

集成电路组件和电子设备 Download PDF

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Publication number
WO2023165426A1
WO2023165426A1 PCT/CN2023/078197 CN2023078197W WO2023165426A1 WO 2023165426 A1 WO2023165426 A1 WO 2023165426A1 CN 2023078197 W CN2023078197 W CN 2023078197W WO 2023165426 A1 WO2023165426 A1 WO 2023165426A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
integrated circuit
assembly
chip
audio processing
Prior art date
Application number
PCT/CN2023/078197
Other languages
English (en)
French (fr)
Inventor
李发军
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2023165426A1 publication Critical patent/WO2023165426A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones

Definitions

  • the application belongs to the technical field of communication equipment, and in particular relates to an integrated circuit component and electronic equipment.
  • the microphone device in the wireless stereo noise-canceling earphone is relatively large in size, occupies a large layout space of the whole machine, affects the layout of various components in the earphone, and is not conducive to the miniaturization design of the earphone, and, due to the occupied space of the microphone device
  • the volume of the earphone is relatively large, so it is impossible to set more electrical components with other functions in the earphone, which affects the diversity of earphone functions.
  • the purpose of this application is to provide an integrated circuit component and electronic equipment, which at least solve the problem that the microphone occupies a large layout space of the whole machine and affects the multifunctional layout of the earphone.
  • an integrated circuit assembly including:
  • At least one second circuit board the at least one recess is covered with the second circuit board;
  • At least one first microphone assembly the first microphone assembly is located in the recess, the first microphone assembly includes: a first audio processing chip, arranged on the second circuit board; a first integrated circuit chip, arranged on the second circuit board, the first An integrated circuit chip is connected with the first audio processing chip.
  • an electronic device including:
  • the integrated circuit component as provided in the first aspect.
  • the integrated circuit assembly may include a first circuit board and a second circuit board, wherein at least one recess is provided on the first circuit board, so that the first microphone assembly can be disposed in the recess, and further Reduce the overall volume of the integrated circuit assembly. Further, by covering the second circuit board on the concave part, the first microphone assembly can be arranged on the second circuit board, so as to realize the fixing of the first microphone assembly, specifically, the first microphone assembly includes the first audio processing chip and a first integrated circuit chip adapted to the first audio processing chip, the first audio processing chip is arranged on the second circuit board; the first integrated circuit chip is arranged on the second circuit board, and the first integrated circuit The chip is connected with the first audio processing chip.
  • the overall volume of the integrated circuit assembly can be effectively reduced, which is beneficial to realize the miniaturization design of the integrated circuit assembly.
  • the cavity formed in the concave part can also be used as the sound pickup cavity of the first microphone assembly, thereby improving the collection effect of the first microphone assembly for audio signals, thereby ensuring the noise reduction effect of the first microphone assembly.
  • other electrical components can also be arranged, thereby realizing an increase in the layout area of the integrated circuit assembly, and further enabling the integrated circuit assembly to be provided with more electrical components, so that More functions can be added to the integrated circuit component, so that more functions can be added to the electronic equipment provided with the integrated circuit component, and the functionality of the electronic equipment can be improved.
  • FIG. 1 shows a schematic structural diagram of an integrated circuit assembly according to an embodiment of the present application
  • Fig. 2 shows a partial enlarged view of place A in Fig. 1;
  • Fig. 3 shows a partial enlarged view at B place in Fig. 1;
  • FIG. 4 shows a schematic structural view of a recess in an integrated circuit assembly according to an embodiment of the present application
  • FIG. 5 shows a schematic structural diagram of a recess in an integrated circuit assembly according to another embodiment of the present application.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.
  • the integrated circuit assembly 100 includes a first circuit board 102, and at least one recess 104 is provided on the first circuit board 102; At least one second circuit board 106, at least one recess 104 is covered with a second circuit board 106; at least one first microphone assembly 110, the first microphone assembly 110 is located in the recess 104, the first microphone assembly 110 includes: a first The audio processing chip 112 is disposed on the second circuit board 106 ; the first integrated circuit chip 114 is disposed on the second circuit board 106 , and the first integrated circuit chip 114 is connected to the first audio processing chip 112 .
  • the integrated circuit assembly 100 includes a first circuit board 102, a second circuit board 106 and a first microphone assembly 110, wherein at least one recess 104 is arranged on the first circuit board 102, and the first microphone assembly 110 It can be disposed in the concave portion 104 , so as to reduce the overall volume of the integrated circuit assembly 100 . Further, the second circuit board 106 is covered on the concave portion 104 , so that the first microphone assembly 110 can be disposed on the second circuit board 106 to achieve fixed installation of the first microphone assembly 110 .
  • first circuit board 102 may be provided with one or more recesses 104, correspondingly, each recess 104 is covered with a second circuit board 106, and each recess 104 may be provided with The number of first microphone assemblies 110 , that is to say, the number of second circuit boards 106 and the number of first microphone assemblies 110 is the same as the number of recesses 104 .
  • the first microphone assembly 110 can be arranged on the side panel of the second circuit board 106 facing the recess 104, so that the second circuit board 106 can be covered on the recess 104 of the first circuit board 102, and the set The first microphone component 110 on the second circuit board 106 is placed in the concave portion 104 to reduce the volume of the integrated circuit component 100 .
  • the first microphone assembly 110 disposed in the concave portion 104 can be connected to the second circuit board 106 , thereby realizing the fixed connection of the first microphone assembly 110 .
  • the side surface of the second circuit board 106 away from the concave portion 104 can also be used to install other electrical components, thereby increasing the function of the integrated circuit assembly 100, and then enabling the electronic equipment provided with the integrated circuit assembly 100 to increase more More functions, improve the functionality of electronic equipment.
  • the first circuit board 102 can be manufactured using a PCB Cavity (locally recessed printed circuit board) process, so as to realize the setting of the concave portion 104 on the first circuit board 102, and then ensure the reasonable setting of the wiring on the first circuit board 102.
  • PCB Cavity locally recessed printed circuit board
  • the first microphone assembly 110 includes a first audio processing chip 112 and a first integrated circuit chip 114 adapted to the first audio processing chip 112, wherein the first audio processing chip 112 is used to process the received audio Processing, according to the noise in the received audio, the noise sound wave signal is converted into a digital signal, and the sound wave opposite to the noise sound wave signal is further calculated according to the digital signal, and the noise sound wave signal is offset by the sound wave signal, So as to achieve the purpose of reducing noise.
  • the first integrated circuit chip 114 can be an ASIC chip compatible with the first audio processing chip 112, that is to say, the first integrated circuit chip 114 is specially designed to meet the working process of the first audio processing chip 112
  • the integrated circuit chip reduces the volume of the first integrated circuit chip 114 on the basis of realizing the control of the first audio processing chip 112 .
  • both the first audio processing chip 112 and the first integrated circuit chip 114 are disposed on the second circuit board 106 , and both are inside the concave portion 104 .
  • the overall volume of the integrated circuit assembly 100 can be effectively reduced, which is beneficial to realize the miniaturization design of the integrated circuit assembly 100 .
  • the cavity formed in the recess 104 can also serve as the first microphone assembly 110 The sound pickup cavity improves the collection effect of the first microphone assembly 110 on audio signals, thereby ensuring the noise reduction effect of the first microphone assembly 110 .
  • the side panel away from the first audio processing chip 112 and the first integrated circuit chip 114 on the second circuit board 106 can also be used to arrange other electrical components, so that the electrical components on the integrated circuit assembly 100 can be increased.
  • the setting quantity of the integrated circuit assembly 100 is further increased, so that the electronic equipment provided with the integrated circuit assembly 100 can add more functions and improve the functionality of the electronic equipment.
  • the first audio processing chip 112 may be a Micro-Electro-Mechanical System (Micro-Electro-Mechanical System, MEMS) chip
  • the first integrated circuit chip 114 may be an Application Specific Integrated Circuit (ASIC) compatible with the MEMS chip. Circuit, ASIC) chip.
  • MEMS Micro-Electro-Mechanical System
  • ASIC Application Specific Integrated Circuit
  • the integrated circuit assembly 100 also includes a first sound pickup hole 116, the first sound pickup hole 116 is opened on the first circuit board 102, the first sound pickup hole 116 communicates with the concave portion 104 .
  • the first sound pickup hole 116 can be opened on the first circuit board 102 and located on the bottom wall of the recess 104, that is, the first sound pickup hole 116 is opened on the bottom wall of the recess 104 of the first circuit board 102 , the first sound pickup hole 116 is a through-hole structure, through the setting of the first sound pickup hole 116, the audio signal can be effectively transmitted to the recess 104 through the first sound pickup hole 116, that is, through the first sound pickup hole 116 The audio signal is transmitted to the sound pickup cavity where the first microphone assembly 110 is located, so as to ensure the sound pickup effect of the first microphone assembly 110 and further ensure the noise reduction effect of the first microphone assembly 110 .
  • the integrated circuit assembly 100 further includes an isolation part 136 disposed in at least one recess 104 , and the isolation part 136 divides the recess 104 into a first cavity 132 and a second cavity 134 .
  • an isolation portion 136 is provided in the recess 104 of the first circuit board 102, so that the space in the recess 104 can be divided into a first cavity 132 and a second cavity 134, thereby The volume of the accommodating space in the concave portion 104 can be reduced, so that the propagation path of the audio signal in the concave portion 104 is shorter, thereby improving the transmission of higher frequency audio signals in the concave portion 104
  • the effect is to prevent the signal source of the high-frequency signal with a higher frequency from interfering in the process of audio signal transmission and cause the audio signal to attenuate, and ensure the induction strength of the first microphone assembly 110 arranged in the concave portion 104 for the audio signal, thereby ensuring the integrated circuit
  • the processing effect of the component 100 on the audio signal is to prevent the signal source of the high-frequency signal with a higher frequency from interfering in the process of audio signal transmission and cause the audio signal to attenuate, and ensure the induction strength of the first microphone assembly 110 arranged in
  • the isolation portion 136 may be disposed on at least one of the plurality of concave portions 104 to reduce the processing cost of the integrated circuit assembly 100, or in all the concave portions 104
  • the isolation part 136 is provided to improve the audio processing effect of the integrated circuit assembly 100 .
  • the first audio processing chip 112 of the first microphone assembly 110 can be arranged in the first cavity 132, and the first sound pickup hole 116 is communicated with the first cavity 132, so that the first audio frequency can be reduced.
  • the volume of the sound pickup cavity where the processing chip 112 is located can further improve the sound pickup effect of the first audio processing chip 112 .
  • the first integrated circuit chip 114 compatible with the first audio processing chip 112 can be disposed in the second cavity 134 to ensure auxiliary control of the first audio processing chip 112 .
  • the isolation portion 136 may not be provided in the concave portion 104 where the first microphone assembly 110 is located.
  • the position of the isolation portion 136 can be reserved, and then the first circuit board 102 is processed on both sides of the isolation portion 136 using the PCB Cavity process, and the concave portion is processed. 104 , an isolation portion 136 between the first cavity 132 and the second cavity 134 is formed. Further, when setting the second circuit board 106 , the spacer column can be welded to the surface of the second circuit board 106 to ensure the airtightness of the first cavity 132 and the second cavity 134 .
  • the integrated circuit assembly 100 further includes at least one second microphone assembly 118 located in the recess 104, and the second microphone assembly 118 includes: a second audio processing chip 120, Set on the second circuit board 106 and located in the first cavity Inside the body 132 ; the second integrated circuit chip 122 is disposed on the second circuit board 106 and located in the second cavity 134 , the second integrated circuit chip 122 is connected to the second audio processing chip 120 .
  • the integrated circuit assembly 100 may further include a second microphone assembly 118, and the second microphone assembly 118 is used to process audio, so as to process the audio information input by the user during a call, that is, the second microphone assembly 118 may be a call microphone.
  • the second microphone assembly 118 is used to convert the audio signal during the user's call into a digital signal, and other relevant electrical components on the integrated circuit assembly 100 can transmit the digital signal to the target device for identification by the target device , and then realize the call process.
  • the second microphone assembly 118 includes a second audio processing chip 120 and a second integrated circuit chip 122 adapted to the second audio processing chip 120, wherein the second audio processing chip 120 is used for audio signals input by the user Collect and convert the audio signal into a digital signal, and then transmit the digital signal to realize the call function.
  • the second integrated circuit chip 122 is an integrated circuit chip specially designed to meet the working process of the second audio processing chip 120. On the basis of realizing the control of the second audio processing chip 120, the volume of the second integrated circuit chip 122 is reduced. .
  • the second audio processing chip 120 and the second integrated circuit chip 122 are both disposed on the second circuit board 106 and located in the concave portion 104 .
  • the overall volume of the integrated circuit assembly 100 can be effectively reduced, which is beneficial to realize the miniaturization design of the integrated circuit assembly 100 .
  • the cavity formed in the recess 104 can also be used as the sound pickup cavity of the second microphone assembly 118, thereby improving the collection effect of the second microphone assembly 118 for audio signals, and then ensuring the noise reduction of the second microphone assembly 118 Effect.
  • the side panel away from the second audio processing chip 120 and the second integrated circuit chip 122 on the second circuit board 106 can also be used to arrange other electrical components, so that the electrical components on the integrated circuit assembly 100 can be increased.
  • the setting quantity of the integrated circuit assembly 100 is further increased, so that the electronic equipment provided with the integrated circuit assembly 100 can add more functions and improve the functionality of the electronic equipment.
  • the second audio processing The chip 120 has higher requirements on the frequency of the audio signal, and a higher frequency audio signal source will cause interference to the audio signal during the propagation of the audio signal and cause the audio signal to attenuate, thereby affecting the collection effect of the second microphone component 118 on the audio signal , thereby affecting the call quality.
  • the second audio processing chip 120 is arranged in the first cavity 132, thereby reducing the volume of the sound pickup cavity where the second audio processing chip 120 is located, so that the audio signal is transmitted in the first cavity
  • the transmission path in the body 132 is shorter, thereby improving the transmission effect of audio signals with higher frequencies, avoiding interference, and ensuring the sensitivity of the second audio processing chip 120 to audio signals, thereby ensuring the call effect.
  • the first audio processing chip 112 may be a MEMS chip
  • the first integrated circuit chip 114 may be an ASIC chip compatible with the MEMS chip.
  • the second circuit board 106 open the wire groove;
  • the two audio processing chips 120 are connected, and the other end is connected to the second integrated circuit chip 122 .
  • the space in the concave part 104 is divided into relatively independent first cavity 132 and second cavity 134, and the second audio processing chip 120 is located in the first cavity 132, and the second integrated circuit chip 122 is located in the second cavity 134, by opening a wire slot on the second circuit board 106, the wires for connecting the second audio processing chip 120 and the second integrated circuit chip 122 can be arranged in the wire slot, While ensuring the effective connection between the second audio processing chip 120 and the second integrated circuit chip 122, the airtightness of the first cavity 132 and the second cavity 134 is guaranteed, thereby ensuring the second audio processing chip 120 for audio processing effect.
  • a wire passage can also be set inside the second circuit board 106, and the openings at both ends of the wire passage are respectively located in the first cavity 132 and the second cavity 134, so that the wires can be passed through the wire passage Inside, the two ends of the wire are respectively connected with the second audio processing chip 120 located in the first cavity 132 and the second integrated circuit chip 122 located in the second cavity 134, thereby realizing the second audio processing chip 120 and the second audio processing chip 120.
  • the connection between the two integrated circuit chips 122 is not limited to the wire passage inside the two ends of the wire are respectively connected with the second audio processing chip 120 located in the first cavity 132 and the second integrated circuit chip 122 located in the second cavity 134, thereby realizing the second audio processing chip 120 and the second audio processing chip 120.
  • the integrated circuit assembly 100 also includes a second sound pickup hole 124, the second sound pickup hole 124 is opened on the first circuit board 102, and the second sound pickup hole 124 The sound hole 124 communicates with the first cavity 132 .
  • the space in the concave part 104 is divided into relatively independent first cavity 132 and second cavity 134, and the second audio processing chip 120 is located in the first cavity 132, and the second integrated circuit chip 122 is located in the second cavity 134 .
  • the second isolation hole can be opened on the first circuit board 102 and communicated with the first cavity 132, that is, the second sound pickup hole 124 is set opposite to the second audio processing chip 120, so that the audio frequency can be effectively
  • the signal is transmitted to the first cavity 132 through the second sound pickup hole 124 , thereby ensuring the sound pickup effect of the second audio processing chip 120 , and further ensuring the call effect of the second microphone assembly 118 .
  • a metal layer 126 is laid on the inner wall of the concave portion 104 .
  • the metal layer 126 can be used to achieve a shielding effect on interference signals, so as to avoid interference signals generated by other electrical components of the integrated circuit assembly 100 during operation.
  • the audio signal causes interference to ensure the effect of the first microphone assembly 110 in the recess 104 on audio signal processing.
  • the metal layer 126 is laid on the inner wall of the recess 104 and the side walls on both sides of the isolation portion 136 to ensure that the inner walls of the first cavity 132 and the second cavity 134
  • the metal layer 126 is laid on both, so as to ensure the shielding effect of the first cavity 132 and the second cavity 134 against interference.
  • the metal layer 126 may be laid with copper, and the metal copper is laid on the surface of the inner wall of the concave portion 104 through an electroplating process.
  • the first circuit board 102 is provided with a first wiring; the second circuit board 106 is provided with a second wiring, and the second wiring is connected to the first wiring.
  • a first wiring is provided, and through the setting of the first wiring, the connection between the various electrical components installed on the first circuit board 102 can be realized, thereby ensuring the connection between the various electrical components.
  • the corresponding functions of the integrated circuit assembly 100 can be realized by mating connections.
  • a second wiring is provided, and through the setting of the second wiring, the connection between the various electrical components installed on the second circuit board 106 can be realized, thereby ensuring the connection between the various electrical components.
  • the corresponding functions of the integrated circuit assembly 100 can be realized by mating connections.
  • Step one the first wiring on the first circuit board 102 and the second wiring on the second circuit board 106 are connected to each other, by connecting the first wiring and the second wiring to each other, it is realized that the first circuit board 102 and the second circuit board 106 are combined and taken as a whole, so as to arrange the electrical components, and then realize the increase of the layout area of the integrated circuit assembly 100, and then increase the function of the integrated circuit assembly 100, so that the integrated circuit assembly 100 is provided with 100's of electronic equipment can add more functions and improve the functionality of the electronic equipment.
  • both the first wiring and the second wiring can be arranged in multiple layers, and according to the specific connection requirements of the electrical components on the first circuit board 102 and the second circuit board 106, the first wiring of each layer and the first wiring of each layer are arranged.
  • the connection method between the second wires can be arranged in multiple layers, and according to the specific connection requirements of the electrical components on the first circuit board 102 and the second circuit board 106, the first wiring of each layer and the first wiring of each layer are arranged. The connection method between the second wires.
  • the integrated circuit assembly 100 further includes a connection portion 128, the number of the connection portion 128 is multiple, and the multiple connection portions 128 are arranged on the first circuit board 102, And distributed along the circumferential direction of the concave portion 104 , the second circuit board 106 is connected to the first circuit board 102 through a plurality of connecting portions 128 .
  • the first circuit board 102 and the second circuit board 106 may be connected through the connecting portion 128 .
  • the connection portion 128 can be arranged on the first circuit board 102, and the number of the connection portion 128 is multiple, and the plurality of connection portions 128 are distributed along the circumferential direction of the concave portion 104 on the first circuit board 102, thereby realizing the first
  • the multi-point connection between the circuit board 102 and the second circuit board 106 ensures the stability of the connection between the first circuit board 102 and the second circuit board 106 .
  • the connecting portion 128 may include a plurality of solder pads arranged on the surfaces of the first circuit board 102 and the second circuit board 106 , and be connected between the solder pads on the first circuit board 102 and the solder pads on the second circuit board 106 Between the metal tin. Specifically, metal tin is melted into solder balls by soldering equipment, and the solder balls are simultaneously in contact with the solder pads on the first circuit board 102 and the second circuit board 106, and the first solder balls can be cooled and solidified. The circuit board 102 is connected to a second circuit board 106 .
  • the first wiring is connected to the second wiring through at least one of the plurality of connecting portions 128 .
  • connection part 128 can not only realize the fixed connection of the relative position between the first circuit board 102 and the second circuit board 106, but also ensure the first the stability of the connection between the circuit board 102 and the second circuit board 106, at the same time, the connection part 128 can also realize the connection between the first wiring and the second wiring, so as to ensure the effective connection between the electrical components on the first circuit board 102 and the electrical components on the second circuit board 106, and ensure the integrated circuit assembly 100 can realize corresponding functions.
  • the structure of the integrated circuit assembly 100 is simplified, and the manufacturing cost of the integrated circuit assembly 100 is reduced.
  • the number of connecting parts 128 can be multiple, and at the same time, the number of the first wiring and the number of the second wiring can also be multiple.
  • the connecting part 1208 When connecting the first wiring and the second wiring through the connecting part 128, first determining the corresponding relationship between the plurality of first wirings and the plurality of second wirings, and then connecting the first wirings on the first circuit board 102 to the corresponding second wirings on the second circuit board 106 through the connecting portion 128, Thereby, the corresponding connection between the multiple first wirings and the multiple second wirings is realized, and the effective connection between the first circuit board 102 and the second circuit board 106 is ensured.
  • the integrated circuit assembly 100 further includes a plurality of other electrical components, and the plurality of other electrical components are disposed on the first circuit board 102 and/or the second circuit board 106 .
  • corresponding electrical components may be provided on the first circuit board 102 and/or the second circuit board 106 .
  • a plurality of electrical components may be arranged only on the first circuit board 102 or only on the second circuit board 106, while ensuring the functionality of the electronic equipment , which also satisfies the structural characteristics of the electronic device.
  • the functional requirements of the electronic equipment used by the integrated circuit assembly 100 for example, on the basis of ensuring the volume of the electronic equipment, in order to enable the electronic equipment to achieve more functions, at this time, multiple electrical components can be It is arranged on the first circuit board 102 and the second circuit board 106 at the same time, and at the same time, on the basis of the connection between the first wiring on the first circuit board 102 and the second wiring on the second circuit board 106, it can ensure that Corresponding connections between electrical components on the first circuit board 102 and the second circuit board 106 further realize the multi-functionality of the electronic device.
  • multiple electrical components can be divided into active electrical components and passive electrical components according to the realized functions and the volume of the occupied space.
  • passive electrical components can include electrical components such as capacitors, electronics, and inductors.
  • the volume is small and can be set in the second On the circuit board 106, since the second circuit board 106 has a certain thickness, the body of the second circuit board 106 protrudes from the surface of the first circuit board 102, therefore, smaller passive electrical components are arranged on the second circuit board 106 In fact, the overall height of the integrated circuit assembly 100 can be effectively avoided, and the miniaturization design of the integrated circuit assembly 100 can be ensured.
  • the active electrical components may include a Bluetooth module, a processor, and chips capable of realizing different functions. Such electrical components are relatively large in size and may be arranged on the first circuit board 102, thereby reducing the volume of such electrical components. The impact on the overall volume of the integrated circuit package 100 .
  • the present application provides an electronic device, including: the integrated circuit assembly 100 as provided in the first aspect.
  • the electronic device provided in this application includes the integrated circuit assembly 100 provided in any one of the above embodiments, and therefore has all the beneficial effects of the integrated circuit assembly 100 provided in any one of the above embodiments, and will not be stated here one by one.
  • electronic devices include earphones, watches, or terminal devices such as mobile phones, computers, and laptops.
  • the electronic device may include a casing, which is used to place the integrated circuit assembly 100 , so as to protect the integrated circuit assembly 100 .
  • the present application provides at least one concave portion 104 on the first circuit board 102 of the integrated circuit assembly 100, and the first microphone assembly 110 or the second microphone assembly 118 can be arranged in the concave portion 104, thereby reducing the size of the integrated circuit assembly 100.
  • a part of the second circuit board 106 away from the first microphone assembly 110 or the second microphone assembly 118 can also be Other electrical components are arranged on the side panel, thereby increasing the layout area of the integrated circuit assembly 100 , and then adding the electrical components on the integrated circuit assembly 100 can increase the functions of the electronic equipment and improve the functionality of the electronic equipment.
  • references to the terms “one embodiment,””someembodiments,””exemplaryembodiments,””example,””specificexamples,” or “some examples” are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present application.
  • schematic representations of the above terms do not necessarily refer to the same embodiment or example.
  • the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

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  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
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Abstract

本申请公开了一种集成电路组件和电子设备，其中，集成电路组件包括：第一电路板，第一电路板上设置有至少一个凹部；至少一个第二电路板，至少一个凹部上均盖设有第二电路板；至少一个第一麦克风组件，第一麦克风组件位于凹部内，第一麦克风组件包括：第一音频处理芯片，设置于第二电路板上；第一集成电路芯片，设置于第二电路板上，第一集成电路芯片与第一音频处理芯片连接。

Description

集成电路组件和电子设备
相关申请的交叉引用
本申请要求于2022年3月01日提交的申请号为202210195397.9，发明名称为“集成电路组件和电子设备”的中国专利申请的优先权，其通过引用方式全部并入本申请。
技术领域
本申请属于通信设备技术领域，具体涉及一种集成电路组件和电子设备。
背景技术
相关技术中，无线立体声降噪耳机中的麦克风器件体积较大，占用较大的整机布局空间，影响耳机中各个元器件的布局，不利于耳机的小型化设计，并且，由于麦克风器件所占用的体积较大，因此无法在耳机中设置更多其他功能的电器元件，影响了耳机功能的多样性。
发明内容
本申请旨在提供一种集成电路组件和电子设备，至少解决麦克风占用较大的整机布局空间，影响耳机多功能性布局的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请提出了一种集成电路组件，包括：
第一电路板，所述第一电路板上设置有至少一个凹部；
至少一个第二电路板，所述至少一个凹部上均盖设有所述第二电路板；
至少一个第一麦克风组件，第一麦克风组件位于凹部内，第一麦克风组件包括：第一音频处理芯片，设置于第二电路板上；第一集成电路芯片，设置于第二电路板上，第一集成电路芯片与第一音频处理芯片连接。
第二方面，本申请提供了一种电子设备，包括：
如第一方面提供的集成电路组件。
在本申请的实施例中，集成电路组件可以包括第一电路板和第二电路板，其中，第一电路板上设置有至少一个凹部，从而可以将第一麦克风组件设置于凹部内，进而可以减小集成电路组件的整体体积。进一步地，通过将第二电路板盖设于凹部上，可以将第一麦克风组件设置于第二电路板上，从而实现第一麦克风组件的固定，具体地，第一麦克风组件包括第一音频处理芯片和与第一音频处理芯片相适配的第一集成电路芯片，第一音频处理芯片，设置于第二电路板上；第一集成电路芯片，设置于第二电路板上，第一集成电路芯片与第一音频处理芯片连接。一方面，通过将第一音频处理芯片和第一集成电路芯片设置于凹部内，可以有效地减小集成电路组件的整体体积，有利于实现集成电路组件的小型化设计。另一方面，凹部内所形成的腔体还可以作为第一麦克风组件的拾音腔体，从而提高第一麦克风组件对于音频信号的搜集效果，进而保证第一麦克风组件的降噪效果。
进一步地，在第二电路板背离凹部的一侧的板面上，还可以设置其他电器元件，从而实现了集成电路组件布局面积的增加，进而使得集成电路组件可以设置更多的电器元件，使得集成电路组件可以增加更多的功能，以使得设置有该集成电路组件的电子设备能够增加更多的功能，提高电子设备的功能性。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1示出了本申请实施例的集成电路组件的结构示意图；
图2示出了图1中A处的局部放大图；
图3示出了图1中B处的局部放大图；
图4示出了本申请一个实施例的集成电路组件中凹部的结构示意图；
图5示出了本申请另一个实施例的集成电路组件中凹部的结构示意图。
附图标记：
100集成电路组件，102第一电路板，104凹部，106第二电路板，
110第一麦克风组件，112第一音频处理芯片，114第一集成电路芯片，116第一拾音孔，118第二麦克风组件，120第二音频处理芯片，122第二集成电路芯片，124第二拾音孔，126金属层，128连接部，132第一腔体，134第二腔体，136隔离部。
具体实施方式
下面将详细描述本申请的实施例，实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了 便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
下面结合图1至图5描述根据本申请实施例的集成电路组件和电子设备。
结合图1、图2、图3、图4和图5所示，根据本申请一些实施例的集成电路组件100，包括第一电路板102，第一电路板102上设置有至少一个凹部104；至少一个第二电路板106，至少一个凹部104上均盖设有第二电路板106；至少一个第一麦克风组件110，第一麦克风组件110位于凹部104内，第一麦克风组件110包括：第一音频处理芯片112，设置于第二电路板106上；第一集成电路芯片114，设置于第二电路板106上，第一集成电路芯片114与第一音频处理芯片112连接。
根据本发明实施例的集成电路组件100，包括第一电路板102、第二电路板106和第一麦克风组件110，其中，第一电路板102上设置有至少一个凹部104，第一麦克风组件110可以设置于凹部104内，从而实现减小集成电路组件100整体的体积。进一步地，第二电路板106盖设于凹部104上，从而可以实现将第一麦克风组件110设置于第二电路板106上，以实现第一麦克风组件110的固定安装。
可以理解的是，第一电路板102上可以设置有一个或多个凹部104，相应地，每个凹部104上均盖设有第二电路板106，并且，每个凹部104内均可以设置有第一麦克风组件110，也就是说，第二电路板106的数量以及第一麦克风组件110的数量与凹部104的数量相同。
具体地，第一麦克风组件110可以设置在第二电路板106朝向凹部104的一侧面板上，从而可以将第二电路板106盖设于第一电路板102的凹部104上的同时，将设置于第二电路板106上的第一麦克风组件110置于凹部104内，以实现集成电路组件100体积的减小。
通过将第二电路板106盖设于凹部104上，一方面，可以将设置于凹部104内的第一麦克风组件110连接于第二电路板106上，从而实现第一麦克风组件110的固定连接。另一方面，第二电路板106背离凹部104的一侧板面还可以用于安装其他电器元件，从而增加集成电路组件100的功能，进而使得设置有该集成电路组件100的电子设备能够增加更多的功能，提高电子设备的功能性。
具体地，第一电路板102可以采用PCB Cavity(印刷电路板局部凹陷)工艺进行制作，以实现第一电路板102上的凹部104的设置，进而保证第一电路板102上布线的合理设置。
进一步地，第一麦克风组件110包括第一音频处理芯片112和与第一音频处理芯片112相适配的第一集成电路芯片114，其中，第一音频处理芯片112用于对接收到的音频进行处理，根据接收到的音频中存在的噪音，将噪音的声波信号转换为数字信号，进一步根据该数字信号计算得到与噪音的声波信号相反的声波，通过该声波信号将噪音的声波信号进行抵消，从而达到降低噪音的目的。第一集成电路芯片114可以为与第一音频处理芯片112相适配的专用集成电路芯片，也就是说，第一集成电路芯片114是为满足第一音频处理芯片112的工作过程而专门设计的集成电路芯片，在实现第一音频处理芯片112的控制的基础上，减小第一集成电路芯片114的体积。
进一步地，第一音频处理芯片112和第一集成电路芯片114均设置与第二电路板106上，并且均为与凹部104内。一方面，通过将第一音频处理芯片112和第一集成电路芯片114设置于凹部104内，可以有效地减小集成电路组件100的整体体积，有利于实现集成电路组件100的小型化设计。另一方面，凹部104内所形成的腔体还可以作为第一麦克风组件110 的拾音腔体，从而提高第一麦克风组件110对于音频信号的搜集效果，进而保证第一麦克风组件110的降噪效果。再一方面，在第二电路板106上背离第一音频处理芯片112和第一集成电路芯片114的一侧面板，还可以用于设置其他电器元件，从而可以增加集成电路组件100上的电器元件的设置数量，进而增加集成电路组件100的功能，使得设置有该集成电路组件100的电子设备能够增加更多的功能，提高电子设备的功能性。
具体地，第一音频处理芯片112可以为微电子机械系统(Micro-Electro-Mechanical System，MEMS)芯片，第一集成电路芯片114可以为与该MEMS芯片相适配的专用集成电路(Application Specific Integrated Circuit，ASIC)芯片。
如图2和图4所示，作为一种可能的实施方式，集成电路组件100还包括第一拾音孔116，第一拾音孔116开设于第一电路板102上，第一拾音孔116与凹部104相连通。
具体地，第一拾音孔116可以开设于第一电路板102上并且位于凹部104的底壁上，也即，在第一电路板102的凹部104的底壁上开设第一拾音孔116，第一拾音孔116为通孔结构，通过第一拾音孔116的设置，可以有效地将音频信号通过第一拾音孔116传递至凹部104内，也即通过第一拾音孔116将音频信号传递至第一麦克风组件110所在的拾音腔内，从而保证第一麦克风组件110的拾音效果，进而保证第一麦克风组件110的降噪效果。
作为一种可能的实施方式，集成电路组件100还包括隔离部136，设置于至少一个凹部104内，隔离部136将凹部104分割为第一腔体132和第二腔体134。
如图3和图5所示，具体地，在第一电路板102的凹部104内设置隔离部136，从而可以将凹部104内的空间分割为第一腔体132和第二腔体134，从而可以减小凹部104内的容纳空间的体积，从而使得凹部104内音频信号的传播路径更短，进而提升频率较高的频信号在凹部104内的传递 效果，避免频率较高的频信号的信号源在音频信号传递的过程中产生干扰而造成音频信号衰减，保证设置于凹部104内的第一麦克风组件110对于音频信号的感应强度，进而保证集成电路组件100对于音频信号的处理效果。
其中，在第一电路板102上包括多个凹部104时，隔离部136可以设置于多个凹部104中的至少一个上，以减小集成电路组件100的加工成本，或者在所有的凹部104中均设置隔离部136，以提高集成电路组件100对于音频的处理效果。
具体地，第一麦克风组件110的第一音频处理芯片112可以设置于第一腔体132内，并且，第一拾音孔116与第一腔体132相连通，从而可以实现减小第一音频处理芯片112所在的拾音腔的体积，进而提高第一音频处理芯片112的拾音效果。相应地，与第一音频处理芯片112相适配的第一集成电路芯片114可以设置于第二腔体134内，以保证对于第一音频处理芯片112进行辅助控制。
需要说明的是，在第一麦克风组件110用于对音频进行降噪处理时，频率较高的音频信号的音频信号对于第一麦克风组件110所包括的微电子机械系统芯片的影响较小，因此，第一麦克风组件110所处的凹部104内可以不设置隔离部136，以减小集成电路组件100的制造成本。
具体地，在进行凹部104的加工的过程中，可以将隔离部136所在的位置进行预留，然后在隔离部136两侧分别采用PCB Cavity工艺对第一电路板102进行加工，在加工出凹部104的同时，形成第一腔体132和第二腔体134之间的隔离部136。进一步地，在设置第二电路板106时，可以将隔离柱与第二电路板106的表面进行焊接，保证第一腔体132和第二腔体134的密闭性。
如图3和图5所示，作为一种可能的实施方式，集成电路组件100还包括至少一个第二麦克风组件118，位于凹部104内，第二麦克风组件118包括：第二音频处理芯片120，设置于第二电路板106上，且位于第一腔 体132内；第二集成电路芯片122，设置于第二电路板106上，且位于第二腔体134内，第二集成电路芯片122与第二音频处理芯片120连接。
具体地，集成电路组件100还可以包括第二麦克风组件118，第二麦克风组件118用于对音频进行处理，以实现将用户通话过程中所输入的音频信息进行处理，也即，第二麦克风组件118可以为通话麦克风。具体地，第二麦克风组件118用于将用户通话过程中的音频信号转化为数字信号，集成电路组件100上的其他相关电器元件可以将该数字信号传递至目标设备上，以供目标设备进行识别，进而实现通话过程。
其中，第二麦克风组件118包括第二音频处理芯片120以及与第二音频处理芯片120相适配的第二集成电路芯片122，其中，第二音频处理芯片120用于对用户所输入的音频信号进行收集，并将该音频信号转化为数字信号，进而将该数字信号进行传递，以实现通话功能。第二集成电路芯片122是为满足第二音频处理芯片120的工作过程而专门设计的集成电路芯片，在实现第二音频处理芯片120的控制的基础上，减小第二集成电路芯片122的体积。
进一步地，第二音频处理芯片120和第二集成电路芯片122均设置与第二电路板106上，并且均位于凹部104内。一方面，通过将第二音频处理芯片120和第二集成电路芯片122设置于凹部104内，可以有效地减小集成电路组件100的整体体积，有利于实现集成电路组件100的小型化设计。另一方面，凹部104内所形成的腔体还可以作为第二麦克风组件118的拾音腔体，从而提高第二麦克风组件118对于音频信号的搜集效果，进而保证第二麦克风组件118的降噪效果。再一方面，在第二电路板106上背离第二音频处理芯片120和第二集成电路芯片122的一侧面板，还可以用于设置其他电器元件，从而可以增加集成电路组件100上的电器元件的设置数量，进而增加集成电路组件100的功能，使得设置有该集成电路组件100的电子设备能够增加更多的功能，提高电子设备的功能性。
进一步地，基于第二麦克风组件118风用于进行通话，第二音频处理 芯片120对于音频信号的频率要求较高，较高频率的音频信号源会在音频信号传播的过程中对音频信号造成干扰而导致音频信号衰减，从而影响第二麦克风组件118对于音频信号的搜集效果，进而影响通话质量。因此，如图3中箭头所示，将第二音频处理芯片120设置于第一腔体132内，从而减小第二音频处理芯片120所在的拾音腔的体积，使得音频信号在第一腔体132内的传播路径更短，进而提升频率较高的音频信号的传递效果，避免干扰，保证第二音频处理芯片120对于音频信号的感应强度，进而保证通话效果。
具体地，第一音频处理芯片112可以为MEMS芯片，第一集成电路芯片114可以为与该MEMS芯片相适配的ASIC芯片。
如图3和图5所示，作为一种可能的实施方式，第二电路板106上开设有过线槽；第二麦克风组件118还包括导线，导线位于过线槽内，导线的一端与第二音频处理芯片120连接，另一端与第二集成电路芯片122连接。
具体地，基于隔离部136将凹部104内的空间分割为相对独立的第一腔体132和第二腔体134，并且第二音频处理芯片120位于第一腔体132内，第二集成电路芯片122位于第二腔体134内，通过在第二电路板106上开设过线槽，从而可以将用于连接第二音频处理芯片120和第二集成电路芯片122的导线设置于过线槽内，在保证第二音频处理芯片120与第二集成电路芯片122之间的有效连接的同时，保证第一腔体132和第二腔体134的密闭性，进而保证第二音频处理芯片120对于音频的处理效果。
进一步地，还可以在第二电路板106的内部开设过线通道，过线通道的两端开口分别位于第一腔体132和第二腔体134内，从而可以将导线穿设于过线通道内，导线的两端分别与位于第一腔体132内的第二音频处理芯片120和位于第二腔体134内的第二集成电路芯片122相连接，进而实现第二音频处理芯片120和第二集成电路芯片122之间的连接。
如图3和图5所示，作为一种可能的实施方式，集成电路组件100还包括第二拾音孔124，第二拾音孔124开设于第一电路板102上，第二拾 音孔124与第一腔体132相连通。
具体地，基于隔离部136将凹部104内的空间分割为相对独立的第一腔体132和第二腔体134，并且第二音频处理芯片120位于第一腔体132内，第二集成电路芯片122位于第二腔体134内。第二隔离孔可以开设于第一电路板102上，并且与第一腔体132相连通，也即，将第二拾音孔124与第二音频处理芯片120相对设置，从而可以有效地将音频信号通过第二拾音孔124传递至第一腔体132，从而保证第二音频处理芯片120的拾音效果，进而保证第二麦克风组件118的通话效果。
如图4和图5所示，作为一种可能的实施方式，凹部104的内壁铺设有金属层126。
具体地，通过在凹部104的内壁铺设金属层126，从而可以利用金属层126实现对于干扰信号的屏蔽效果，避免集成电路组件100在运行过程中其他电器元件所产生的干扰信号对凹部104内的音频信号造成干扰，以保证凹部104内的第一麦克风组件110对于音频信号处理的效果。
进一步地，基于凹部104内设置有隔离部136，在凹部104的内壁以及隔离部136的两侧的侧壁上均铺设金属层126，以保证第一腔体132和第二腔体134的内壁均铺设有金属层126，进而保证第一腔体132和第二腔体134对于干扰的屏蔽效果。
其中，金属层126可以采用铜进行铺设，并且，通过电镀工艺将金属铜铺设于凹部104的内壁的表面。
作为一种可能的实施方式，第一电路板102上设置有第一布线；第二电路板106上设置有第二布线，第二布线与第一布线连接。
具体地，在第一电路板102上，设置有第一布线，通过第一布线的设置，可以实现安装于第一电路板102上的各个电器元件之间的连接，从而保证各个电器元件之间的配合连接以实现集成电路组件100相应的功能。进一步地，在第二电路板106上，设置有第二布线，通过第二布线的设置，可以实现安装于第二电路板106上的各个电器元件之间的连接，从而保证各个电器元件之间的配合连接以实现集成电路组件100相应的功能。进一 步的，第一电路板102上的第一布线与第二电路板106上的第二布线之间相互连接，通过将第一布线与第二布线之间相互连接，实现了将第一电路板102和第二电路板106相结合并且作为一个整体，从而进行电器元件的布置，进而实现了集成电路组件100布局面积的增大，进而增加集成电路组件100的功能，使得设置有该集成电路组件100的电子设备能够增加更多的功能，提高电子设备的功能性。
具体地，第一布线和第二布线均可以设置为多层，根据需要设置于第一电路板102和第二电路板106上的电器元件的具体连接需求，设置每层第一布线和每层第二布线之间的连接方式。
如图2至图5所示，作为一种可能的实施方式，集成电路组件100还包括连接部128，连接部128的数量为多个，多个连接部128设置于第一电路板102上，且沿凹部104的周向分布，第二电路板106通过多个连接部128与第一电路板102连接。
具体地，第一电路板102和第二电路板106之间，可以通过连接部128相连接。其中，连接部128可以设置于第一电路板102上，并且，连接部128的数量为多个，多个连接部128沿第一电路板102上的凹部104的周向分布，从而实现第一电路板102和第二电路板106之间的多点连接，保证第一电路板102和第二电路板106之间连接的稳定性。
其中，连接部128可以包括设置于第一电路板102和第二电路板106表面的多个焊盘，以及连接于第一电路板102上的焊盘与第二电路板106上的焊盘之间的金属锡。具体地，通过焊接设备将金属锡融化成锡球，并且将锡球同时与第一电路板102和第二电路板106上的焊盘相接触，待锡球冷却凝固，即可以实现将第一电路板102与第二电路板106相连接。
作为一种可能的实施方式，第一布线通过多个连接部128中的至少一个与第二布线连接。
具体地，通过将第一布线和第二布线之间通过连接部128相连接，使得连接部128不仅可以实现第一电路板102和第二电路板106之间相对位置的固定连接，保证第一电路板102和第二电路板106之间连接的稳定性， 同时，连接部128还可以实现第一布线与第二布线之间的连接，保证第一电路板102上的电器元件与第二电路板106上的电器元件之间的有效连接，保证集成电路组件100能够实现相应的功能。简化了集成电路组件100的结构，降低集成电路组件100的制造成本。
具体地，连接部128的数量可以为多个，同时，第一布线的数量以及第二不想的数量也可以为多个，在通过连接部128将第一布线和第二不想相连接时，首先确定多个第一布线与多个第二布线之间的对应关系，然后通过连接部128，将第一电路板102上的第一布线与第二电路板106上相应的第二布线相连接，从而实现多个第一布线与多个第二布线之间的对应连接，保证第一电路板102与第二电路板106之间的有效连接。
进一步地，如图1至图3所示，集成电路组件100还包括多个其他电器元件，多个其他电器元件设置于第一电路板102和/或第二电路板106上。
具体地，根据集成电路组件100所应用的电子设备的具体结构以及电子设备所需要实现的具体功能，可以在第一电路板102和/或第二电路板106上设置相应的电器元件。
其中，根据集成电路组件100所应用的电子设备的结构特征，多个电器元件可以只设置于第一电路板102上或者只设置于第二电路板106上，在保证电子设备的功能性的同时，也满足该电子设备的结构特征。相应地，根据集成电路组件100所应用的电子设备的功能需求，例如，在保证电子设备的体积的基础上，为了使得该电子设备能够实现更多的功能，此时，可以将多个电器元件同时设置于第一电路板102和第二电路板106上，同时，在第一电路板102上的第一布线与第二电路板106上的第二布线之间相连接的基础上，能够保证第一电路板102和第二电路板106上的电器元件之间的相应连接，进而实现该电子设备的多功能性。
具体地，可以根据实现的作用以及占用空间的体积不同，将多个电器元件分为主动电器元件和被动电器元件，例如，被动电器元件可以包括电容、电子和电感等电器元件，这类电器元件的体积较小，可以设置于第二 电路板106上，由于第二电路板106具有一定厚度，第二电路板106的本体凸出于第一电路板102的表面，因此，将体积较小的被动电器元件设置于第二电路板106上，可以有效地避免集成电路组件100的整体高度过高，保证集成电路组件100的小型化设计。相应地，主动电器元件可以包括蓝牙模块、处理器以及能够实现不同功能的芯片等，这类电器元件体积相对较大，可以设置于第一电路板102上，从而减小这类电器元件的体积对于集成电路组件100整体体积的影响。
本申请提供了一种电子设备，包括：如第一方面提供的集成电路组件100。
本申请提供的电子设备，因包括如上述任一实施例提供的集成电路组件100，因此，具有如上述任一实施例提供的集成电路组件100的全部有益效果，在此不再一一陈述。
其中，电子设备包括耳机、手表或者手机、电脑和笔记本电脑等终端设备。
作为一种可能的实施方式，电子设备可以包括壳体，壳体用于放置集成电路组件100，以实现对集成电路组件100的保护。并且，本申请通过在集成电路组件100的第一电路板102上设置至少一个凹部104，可以将第一麦克风组件110或第二麦克风组件118设置于凹部104内，从而实现减小集成电路组件100整体的体积，进而在保证了电子设备能够实现相关的功能的基础上，减小电子设备的壳体的体积，以实现电子设备的小型化设计。进一步地，通过将集成电路组件100的第二电路板106盖设于第一电路板102的凹部104上，还可以在第二电路板106远离第一麦克风组件110或第二麦克风组件118的一侧面板上设置其他电器元件，从而增加了集成电路组件100的布局面积，进而可以通过增加集成电路组件100上的电器元件来实现增加电子设备的功能，提高电子设备的功能性。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施 例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (11)

  1. 一种集成电路组件，包括：
    第一电路板，所述第一电路板上设置有至少一个凹部；
    至少一个第二电路板，所述至少一个凹部上均盖设有所述第二电路板；
    至少一个第一麦克风组件，所述第一麦克风组件位于所述凹部内，所述第一麦克风组件包括：
    第一音频处理芯片，设置于所述第二电路板上；
    第一集成电路芯片，设置于所述第二电路板上，所述第一集成电路芯片与所述第一音频处理芯片连接。
  2. 根据权利要求1所述的集成电路组件，其中，还包括：
    第一拾音孔，所述第一拾音孔开设于第一电路板上，所述第一拾音孔与所述凹部相连通。
  3. 根据权利要求1所述的集成电路组件，其中，还包括：
    隔离部，设置于所述至少一个凹部内，所述隔离部将所述凹部分割为第一腔体和第二腔体。
  4. 根据权利要求3所述的集成电路组件，其中，还包括至少一个第二麦克风组件，位于所述凹部内，所述第二麦克风组件包括：
    第二音频处理芯片，设置于所述第二电路板上，且位于所述第一腔体内；
    第二集成电路芯片，设置于所述第二电路板上，且位于所述第二腔体内，所述第二集成电路芯片与所述第二音频处理芯片连接。
  5. 根据权利要求4所述的集成电路组件，其中，
    所述第二电路板上开设有过线槽；
    所述第二麦克风组件还包括导线，所述导线位于所述过线槽内，所述导线的一端与所述第二音频处理芯片连接，另一端与所述第二集成电路芯片连接。
  6. 根据权利要求3所述的集成电路组件，其中，还包括：
    第二拾音孔，所述第二拾音孔开设于所述第一电路板上，所述第二拾 音孔与所述第一腔体相连通。
  7. 根据权利要求1至6中任一项所述的集成电路组件，其中，
    所述凹部的内壁铺设有金属层。
  8. 根据权利要求1至6中任一项所述的集成电路组件，其中，
    所述第一电路板上设置有第一布线；
    所述第二电路板上设置有第二布线，所述第二布线与所述第一布线连接。
  9. 根据权利要求8所述的集成电路组件，其中，还包括：
    连接部，所述连接部的数量为多个，多个所述连接部设置于所述第一电路板上，且沿所述凹部的周向分布，所述第二电路板通过多个所述连接部与所述第一电路板连接。
  10. 根据权利要求9所述的集成电路组件，其中，
    所述第一布线通过多个所述连接部中的至少一个与所述第二布线连接。
  11. 一种电子设备，包括：
    如权利要求1至10中任一项所述的集成电路组件。
PCT/CN2023/078197 2022-03-01 2023-02-24 集成电路组件和电子设备 WO2023165426A1 (zh)

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