CN204180270U - 一种小尺寸高灵敏度高信噪比的mems硅麦克风 - Google Patents
一种小尺寸高灵敏度高信噪比的mems硅麦克风 Download PDFInfo
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- CN204180270U CN204180270U CN201420688765.4U CN201420688765U CN204180270U CN 204180270 U CN204180270 U CN 204180270U CN 201420688765 U CN201420688765 U CN 201420688765U CN 204180270 U CN204180270 U CN 204180270U
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- mems
- pcb board
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 29
- 239000010703 silicon Substances 0.000 title claims abstract description 29
- 230000035945 sensitivity Effects 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 64
- 239000004568 cement Substances 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims description 42
- 230000010354 integration Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 208000034189 Sclerosis Diseases 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
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CN201420688765.4U CN204180270U (zh) | 2014-11-18 | 2014-11-18 | 一种小尺寸高灵敏度高信噪比的mems硅麦克风 |
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CN201420688765.4U CN204180270U (zh) | 2014-11-18 | 2014-11-18 | 一种小尺寸高灵敏度高信噪比的mems硅麦克风 |
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CN204180270U true CN204180270U (zh) | 2015-02-25 |
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CN201420688765.4U Active CN204180270U (zh) | 2014-11-18 | 2014-11-18 | 一种小尺寸高灵敏度高信噪比的mems硅麦克风 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104394496A (zh) * | 2014-11-18 | 2015-03-04 | 上海微联传感科技有限公司 | 一种小尺寸高灵敏度高信噪比的mems硅麦克风 |
CN108807657A (zh) * | 2017-04-26 | 2018-11-13 | 矽品精密工业股份有限公司 | 封装结构及其制法 |
CN114615594A (zh) * | 2022-03-01 | 2022-06-10 | 维沃移动通信有限公司 | 集成电路组件和电子设备 |
-
2014
- 2014-11-18 CN CN201420688765.4U patent/CN204180270U/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104394496A (zh) * | 2014-11-18 | 2015-03-04 | 上海微联传感科技有限公司 | 一种小尺寸高灵敏度高信噪比的mems硅麦克风 |
CN104394496B (zh) * | 2014-11-18 | 2018-03-13 | 上海微联传感科技有限公司 | 一种小尺寸高灵敏度高信噪比的mems硅麦克风 |
CN108807657A (zh) * | 2017-04-26 | 2018-11-13 | 矽品精密工业股份有限公司 | 封装结构及其制法 |
TWI660466B (zh) * | 2017-04-26 | 2019-05-21 | 矽品精密工業股份有限公司 | 封裝結構及其製法 |
CN108807657B (zh) * | 2017-04-26 | 2022-01-04 | 矽品精密工业股份有限公司 | 封装结构及其制法 |
CN114615594A (zh) * | 2022-03-01 | 2022-06-10 | 维沃移动通信有限公司 | 集成电路组件和电子设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190122 Address after: Room 118, Building 20, No. 83 Lane 1-42, Hongxiang North Road, Wanxiang Town, Pudong New Area, Shanghai, 201318 Patentee after: Maigan Microelectronics (Shanghai) Co.,Ltd. Address before: 201203 2, 3 building, 439 Chunchun Road, Pudong New Area, Shanghai. Patentee before: MICROLINK SENSTECH SHANGHAI Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240510 Address after: 214135 China Sensor Network International Innovation Park F2, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee after: SV SENSTECH (WUXI) CO.,LTD. Country or region after: China Address before: Room 118, Building 20, No. 83 Lane 1-42, Hongxiang North Road, Wanxiang Town, Pudong New Area, Shanghai, 201318 Patentee before: Maigan Microelectronics (Shanghai) Co.,Ltd. Country or region before: China |