JP2000357710A - 半導体装置の実装構造および実装方法 - Google Patents
半導体装置の実装構造および実装方法Info
- Publication number
- JP2000357710A JP2000357710A JP2000109040A JP2000109040A JP2000357710A JP 2000357710 A JP2000357710 A JP 2000357710A JP 2000109040 A JP2000109040 A JP 2000109040A JP 2000109040 A JP2000109040 A JP 2000109040A JP 2000357710 A JP2000357710 A JP 2000357710A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor
- electrode
- anisotropic conductive
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/15—
-
- H10W90/724—
-
- H10W90/734—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000109040A JP2000357710A (ja) | 1999-04-16 | 2000-04-11 | 半導体装置の実装構造および実装方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-109201 | 1999-04-16 | ||
| JP10920199 | 1999-04-16 | ||
| JP2000109040A JP2000357710A (ja) | 1999-04-16 | 2000-04-11 | 半導体装置の実装構造および実装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000357710A true JP2000357710A (ja) | 2000-12-26 |
| JP2000357710A5 JP2000357710A5 (enExample) | 2007-05-24 |
Family
ID=26448996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000109040A Pending JP2000357710A (ja) | 1999-04-16 | 2000-04-11 | 半導体装置の実装構造および実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000357710A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250618A (ja) * | 2006-03-14 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 電子部品実装構造体およびその製造方法 |
| US8119449B2 (en) | 2006-03-14 | 2012-02-21 | Panasonic Corporation | Method of manufacturing an electronic part mounting structure |
-
2000
- 2000-04-11 JP JP2000109040A patent/JP2000357710A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250618A (ja) * | 2006-03-14 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 電子部品実装構造体およびその製造方法 |
| US8119449B2 (en) | 2006-03-14 | 2012-02-21 | Panasonic Corporation | Method of manufacturing an electronic part mounting structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070330 |
|
| A521 | Request for written amendment filed |
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| A977 | Report on retrieval |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090407 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20090804 |