JP2000357710A - 半導体装置の実装構造および実装方法 - Google Patents

半導体装置の実装構造および実装方法

Info

Publication number
JP2000357710A
JP2000357710A JP2000109040A JP2000109040A JP2000357710A JP 2000357710 A JP2000357710 A JP 2000357710A JP 2000109040 A JP2000109040 A JP 2000109040A JP 2000109040 A JP2000109040 A JP 2000109040A JP 2000357710 A JP2000357710 A JP 2000357710A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
electrode
anisotropic conductive
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000109040A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000357710A5 (enExample
Inventor
Noboru Taguchi
昇 田口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP2000109040A priority Critical patent/JP2000357710A/ja
Publication of JP2000357710A publication Critical patent/JP2000357710A/ja
Publication of JP2000357710A5 publication Critical patent/JP2000357710A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Wire Bonding (AREA)
JP2000109040A 1999-04-16 2000-04-11 半導体装置の実装構造および実装方法 Pending JP2000357710A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000109040A JP2000357710A (ja) 1999-04-16 2000-04-11 半導体装置の実装構造および実装方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-109201 1999-04-16
JP10920199 1999-04-16
JP2000109040A JP2000357710A (ja) 1999-04-16 2000-04-11 半導体装置の実装構造および実装方法

Publications (2)

Publication Number Publication Date
JP2000357710A true JP2000357710A (ja) 2000-12-26
JP2000357710A5 JP2000357710A5 (enExample) 2007-05-24

Family

ID=26448996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000109040A Pending JP2000357710A (ja) 1999-04-16 2000-04-11 半導体装置の実装構造および実装方法

Country Status (1)

Country Link
JP (1) JP2000357710A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250618A (ja) * 2006-03-14 2007-09-27 Matsushita Electric Ind Co Ltd 電子部品実装構造体およびその製造方法
US8119449B2 (en) 2006-03-14 2012-02-21 Panasonic Corporation Method of manufacturing an electronic part mounting structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007250618A (ja) * 2006-03-14 2007-09-27 Matsushita Electric Ind Co Ltd 電子部品実装構造体およびその製造方法
US8119449B2 (en) 2006-03-14 2012-02-21 Panasonic Corporation Method of manufacturing an electronic part mounting structure

Similar Documents

Publication Publication Date Title
JP3313547B2 (ja) チップサイズパッケージの製造方法
TW492120B (en) Semiconductor device and its manufacturing method, stacked type semiconductor device, circuit substrate and electronic machine
US20050142835A1 (en) Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed
JP2002261190A (ja) 半導体装置、その製造方法及び電子機器
KR20010070217A (ko) 반도체 장치 및 그 제조 방법
JP2002184904A (ja) 半導体装置の製造方法及び半導体装置
TW200903763A (en) Inter-connecting structure for semiconductor device package and method of the same
JPH10135404A (ja) 半導体チップモジュール及びその製造方法
US6339247B1 (en) Structure for mounting a semiconductor device on a liquid crystal display, and semiconductor device
WO2009016495A1 (en) Semiconductor device having a bump electrode and method for its manufacture
CN101188204B (zh) 半导体器件及其制造方法
JP2004327480A (ja) 半導体装置及びその製造方法、電子装置及びその製造方法並びに電子機器
WO2000057469A1 (en) Structure for mounting semiconductor device and mounting method
JPWO1994024699A1 (ja) 半導体装置
WO1994024699A1 (fr) Dispositif semi-conducteur
JP4465891B2 (ja) 半導体装置
JP2000357710A (ja) 半導体装置の実装構造および実装方法
TW200535982A (en) Semiconductor device and its manufacturing method, circuit board, and electronic apparatus
JP2002134541A (ja) 半導体装置とその製造方法ならびに半導体装置の実装構造
JP3148202B2 (ja) 半導体パッケージ及びその製造方法
JP3283947B2 (ja) 半導体装置およびその製造方法
JP2001351947A (ja) 半導体装置の製造方法およびその実装方法
JP2002076587A (ja) 半導体装置の製造方法およびその実装方法
JP2008177404A (ja) 半導体装置、半導体モジュールおよびその製造方法
JPWO2000057469A1 (ja) 半導体装置の実装構造および実装方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070330

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070331

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090303

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090407

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090804