JP2000336438A - Metal-ceramics composite material and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a metal-ceramics composite material having high thermal conductivity and low thermal expansion and useful for heat dispersion parts such as heat radiating substrate and heat sink member for semiconductor device, and its manufacturing method. SOLUTION: This composite material can be formed by impregnating a molten matrix metal under pressure into the pores in a porous ceramic sintered body of 7-50 μm pore diameter and has a composite structure consisting of a ceramic skeletal structure and a matrix metal. The volume ratio of the matrix metal is, e.g. 20-40 vol.%. The ceramic sintered body is disposed in a metal mold and impregnation treatment is performed in a short time (generally within several tens seconds) under controlled pressure casting conditions. By the strength design of the ceramic sintered body, the form of distribution of the ceramics and metal which form a composite structure can be controlled, by which higher heat radiating property can be provided while maintaining low thermal expansion property. Further, the integral forming of radiation fin can be facilitated in the step of pressure impregnation of the molten metal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device circuit board, a heat dissipation board, and a semiconductor element which are required to have high thermal conductivity and low thermal expansion.
The present invention relates to a metal-ceramic composite material useful as a material for electronic devices such as a heat sink and a package base, and a method for producing the same.

[0002]

2. Description of the Related Art In the field of semiconductors, the heat generation density of semiconductor elements is increasing steadily with the high-density integration of integrated circuit chips and high-speed operation. The rise in the temperature of the element causes malfunction and destruction of the circuit (peeling of the interface between the element and the substrate due to thermal stress, etc.). In order to prevent such inconveniences and maintain stable operating characteristics, a circuit board and a heat radiating board arranged in contact with the circuit board,
It is necessary that components such as a heat sink such as a heat sink have high heat dissipation and a low coefficient of thermal expansion close to the chip material. Conventionally, ceramic substrates and resin substrates have been used as circuit boards, and metal materials having a low coefficient of thermal expansion such as FeNi alloy, FeNiCo alloy, and stainless steel have been used as heat sinks and heat sinks.
Both have low thermal conductivity and insufficient heat radiation characteristics.

[0003] As a remedy, application of a composite material composed of a metal and a ceramic has been attempted. This is intended to enhance the heat radiation characteristics by using a metal having high thermal conductivity and to provide low thermal expansion as a composite effect of the ceramic particles. As a composite material, a sintered body manufactured using a mixture of a metal (alloy) powder such as aluminum or copper and a ceramic powder as a raw material has been proposed (JP-A-7-90413, JP-A-9-232483). Gazette, JP-A-10-
No. 231175). In addition, Japanese Patent No. 2801302,
801303 discloses that a porous material of ceramics is used as a preform and impregnated with a molten metal by spontaneous impregnation to obtain a composite material.

[0004]

The method for producing a composite material using a powder mixture of metal and ceramics as a sintering raw material requires complicated and complicated equipment and processing operations, and also has the effect of reducing the coefficient of thermal expansion by compounding the ceramics. Not enough.
On the other hand, the production method of spontaneously impregnating a porous metal body with a molten metal has the advantage of not requiring equipment and processing operations such as pressurization and vacuum. However, it requires the coexistence of a penetration enhancer and the formation of a permeation atmosphere. For example, 10Hr (preform: aluminum nitride, 38 × 19 × 13 (mm), metal: aluminum alloy, Patent No. 2801302) Gazette Column 30 39
Line to 32 columns, 6 lines). In view of the above, the present invention provides a metal having high thermal conductivity and low thermal expansion property using a porous ceramic sintered body as a preform.
A ceramic composite material and a method for efficiently producing the same are provided.

[0005]

The metal-ceramic composite material of the present invention is formed by impregnating a molten metal of a matrix metal into the pores of a porous ceramic sintered body having a pore diameter of 7 to 50 μm under pressure. It has a composite structure composed of a skeletal structure, which is a ceramic sintered body, and a matrix metal.

The composite material of the present invention comprises a porous ceramic sintered body having a predetermined pore size as a preform, which is placed in a cavity of a pressure casting mold to supply a matrix metal melt into the cavity. It is manufactured by doing. Under a controlled pressure impregnation condition such as the temperature of the molten metal, the pressure and the impregnation rate of the matrix metal, a dense metal-ceramic composite structure (having almost no residual air bubbles) is formed. The time required for the treatment is as short as about several tens of seconds, including the pressure holding time after the impregnation.

[0007] The composite material of the present invention formed by impregnating a porous ceramic sintered body with a matrix metal under pressure has an improved high thermal conductivity and low thermal expansion as an effect of having a dense composite structure. Has thermal properties.
In other words, the adhesion between the skeleton structure (ceramic sintered body) and the matrix metal is good, and the matrix metal has a continuous form along the impregnation path, thereby providing high thermal conductivity. In addition, the skeletal structure has a continuous form of a three-dimensional network structure composed of interconnected ceramic particles, and the matrix metal is surrounded and constrained by the matrix structure. Thermal expansion of the metal is suppressed, and low thermal expansion is ensured.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION A ceramic sintered body to be a skeleton structure of a composite material is a porous body having a pore diameter of 7 to 50 μm. FIG. 5 shows an example of a porous structure of a ceramic sintered body (preform of test material No. 7 in an example described later). In the figure, dark gray portions are ceramics, and white portions are pores. The pores communicate with each other in a three-dimensional direction, and open on the surface of the sintered body. In addition, if there are independent pores in the ceramic sintered body used as the preform, it remains as a void in the formed composite material as it is, which lowers the thermal conductivity of the composite material. It is preferable to use a sintered body having no independent pores.

The porous ceramic sintered body has a pore diameter of 7 μm.
The reason for stipulating that it is m or more is that if the pore size is smaller than that, the impregnation resistance when the matrix metal is impregnated under pressure is large, and it is difficult or impossible to fill the matrix metal so as not to leave voids. is there. However, if the pore diameter is too large, the strength of the sintered body decreases, and the sintered body is likely to be broken (cracked or collapsed) by the action of the molten metal during the pressure impregnation of the matrix metal. In order to avoid this, it is necessary to have a bending strength of at least 5 MPa. If the pore diameter exceeds 50 μm, it is difficult or impossible to secure bending strength. For this reason, the pore diameter needs to be 50 μm or less. A more preferable pore diameter is 10 to 30 μm.

The grades of ceramics are carbide, nitride,
Oxides, silicides, borides and the like are selected over a wide range. In particular, silicon carbide (SiC), silicon nitride (Si
₃ N ₄ ), aluminum nitride (AlN), alumina (A
Since l ₂ O ₃ ) has a low thermal expansion property and a relatively high thermal conductivity, it is suitable as a heat dissipation board for a semiconductor circuit. As a typical example of the matrix metal, a high heat conductive metal such as aluminum or an alloy thereof, copper or an alloy thereof is given. The amount ratio between the ceramics (skeleton structure) and the matrix metal constituting the composite material is controlled by the porosity of the ceramic sintered body used as the preform. The amount ratio (volume ratio) of the matrix metal in the composite structure is equal to the porosity of the ceramic sintered body. The thermal conductivity and the coefficient of thermal expansion of the composite material are determined by the types of ceramics and matrix metal and the ratios thereof.

For example, a composite material provided for a heat dissipation substrate for a semiconductor circuit or the like is made of aluminum (thermal conductivity: about 234 W / m · K, thermal expansion coefficient: about 23.
In the case of using 5 × 10 ⁻⁶ / K), the amount ratio of aluminum in the composite structure is preferably set to 20% by volume or more. However, if the ratio is excessively large, the effect of suppressing the thermal expansion is reduced with a relative decrease in the skeletal structure (ceramics). Therefore, the upper limit should be 40% by volume. By adjusting the amount ratio of aluminum in this way, a high thermal conductivity of 170 W / m · K or more and 4 × 10
It can have a low coefficient of thermal expansion of ^{−6 to} 8 to × 10 ⁻⁶ / K.

In addition, copper (thermal conductivity: about 393 W / m ·
K, coefficient of thermal expansion: about 17 × 10^-6/ K) to the matrix
In a composite material to be a metal, the amount ratio of copper is set to about 20 to
It is preferable to adjust to a range of 45% by volume. For this quantity ratio adjustment
Thus, 240 W /
High thermal conductivity of mK or more and 4 × 10^-6~ 8 ~ × 10
^-6/ K low thermal expansion coefficient. What
Note that the upper limit of the amount of copper is less than that of the composite material (matrix gold).
Genus: aluminum) is higher than that of copper
Is lower than the coefficient of thermal expansion of aluminum.

The composite material of the present invention is provided with a composite structure in which the skeletal structure and the distribution of the matrix metal are different by adjusting the strength of the preform (ceramic sintered body). This is shown in Fig. 6 and Fig. 7 (Fig. 6: Test material No. 7 in Example column described later, Fig. 7: Test material No. 11). In each of the figures, the dark gray portion is a skeletal structure composed of a combination of ceramic particles, and the gray-white portion is an impregnated matrix metal. The composite structure in FIG. 6 is a skeletal structure (dark gray part)
And a matrix metal (gray-white portion) have an isotropic distribution form in which they are uniformly dispersed. This composite structure is formed by impregnating and filling a matrix metal in a state where the bonding state of the particles of the ceramic sintered body is maintained substantially as it is. A composite material having this composite structure can be obtained by using a ceramic sintered body having a relatively high bending strength (10 MPa or more).

On the other hand, the composite structure shown in FIG. 7 has a distribution form in which a skeletal structure (dark gray portion) and a matrix metal (gray-white portion) are mixed in a streak along the same direction. In this composite structure, during the pressure impregnation of the matrix metal, the particle bonding of the ceramic sintered body is microscopically cut off by the pressure action of the intruding molten metal, and the molten metal becomes fine streaky voids along the impregnation direction. Is a structure formed by being impregnated while forming. This composite material is a ceramic sintered body (10 MPa) having a relatively low bending strength as a preform.
Less than) is used.

Next, the process of impregnating a matrix metal by pressure casting will be described with reference to the drawings. In FIG. 1, reference numeral (10) denotes a pressure casting die, and a lower die (11) and an upper die (12) are combined to form a cavity (17). The mold (10) has a runner (13) for supplying the molten metal to the cavity (17), and a gas vent hole (+) for discharging residual air in the cavity (17) and gas generated from the molten metal to the outside. 14).
(20) is a preform (the figure is an example of a plate-like body) installed in the cavity (17). The preform (20) has a pin (15 ₁ ) arranged at a corner of the lower mold (11) and the upper mold (12) to hold the corners of the plate surface from above and below, and to form the lower mold (11). Pins (15
₂ ) It is supported from the lower surface side and held in the cavity space.

In the operation of pouring the molten metal, the mold (1
0) and the preform (20) are heated and held (for example,
By keeping the mold: about 250 ° C. and the preform: about 400 ° C.), the temperature of the molten metal (increase in the impregnation resistance to the preform due to an increase in viscosity) is suppressed, and the temperature of the preform (20) with respect to the pores is reduced. Facilitates impregnation of the metal melt field,
In addition, impurities such as moisture of the preform (20) are removed, which is effective for stabilizing the quality of the obtained composite material.

The molten metal is preferably filled into the cavity by a slow pouring operation, and then a pressure is applied to promote impregnation of the molten metal into the preform. Controlling the pressing force in this way avoids the local pressure action of the molten metal on the preform (20) (which causes damage to the preform), makes the molten metal uniformly contact, and allows the molten metal to permeate. This is effective in preventing partial unevenness.

The impregnation of a molten metal such as aluminum or copper
It is successfully achieved by adjusting the pressure to 50-100 MPa and the impregnation speed to 1.0 m / sec or less. The impregnation speed is the speed at which the molten metal injected into the cavity passes through the gate. This pressure impregnation operation can be efficiently performed by applying, for example, a squeeze cast device, and the impregnation process is completed in an extremely short time. After the metal melt is solidified while maintaining the pressurized state, the die is removed and subjected to appropriate machining (such as cutting and removing the matrix metal remaining on the plate surface) to obtain a product composite material.

A radiating substrate for a semiconductor circuit or the like may be provided with a fin made of a metal having a high thermal conductivity such as aluminum as a radiating design for enhancing the heat radiating characteristic. Conventionally, it is manufactured by bonding a finned aluminum case to a substrate with heat conductive grease. According to the present invention, in the pressure casting step, the pressure impregnation of the preform with the molten metal (formation of the substrate having the composite structure) and the formation of the fins are simultaneously achieved, and the substrate and the fins are integrally manufactured. Can be. It is also possible to integrally mold members such as a heat sink and a package base.

FIGS. 2 and 3 (views taken along the line AA in FIG. 2)
Fig. 2 shows an example of a mold configuration and an arrangement of preforms for producing the composite material of the present invention as an integrally molded product of a substrate and fins. The cavity (1) of the mold (10)
In 7), a fin forming space portion (17 ₁ ) communicating with a space portion in which the preform (20) is installed is formed in a direction orthogonal to the plate surface of the preform (20). Except for having the fin forming space (17 ₁ ), the mold configuration and the installation mode of the preform (20) are the same as those shown in FIG.
No different from that of

When the matrix metal melt is supplied under pressure into the cavity of the mold (10), the melt is impregnated into the pores of the preform (20) and filled into the fin forming space (17 ₁ ). You. Thereby, the formation of the composite structure and the casting of the fins are simultaneously achieved in a single-step pressure casting operation. This pressure casting operation can be performed under the same conditions as those for producing the finless composite material described above. After solidification of the molten metal, pull it out of the mold,
Excess metal is removed by machining.

FIG. 4 shows an example of the composite material of the present invention as a finned heat dissipation substrate thus obtained. (2
1) is a main body (a composite structure composed of a porous ceramic sintered body and a matrix metal impregnated in pores thereof), and (22) is a fin projecting from a plate surface of the main body (21). It is. The fin (22) is connected to the main body (2).
It is formed as a completely integrated product having a continuous form with 1). Since the fins (22) are formed by pressure casting, the shape accuracy is good, and the shape is corrected (machining).
Do not need. In this composite material, since the main body portion (21) and the fins (22) have perfect continuous uniformity (described later, FIG. 8), the conventional material (heat conduction grease is interposed at the joint boundary). Fins), there is no barrier for heat transfer from the substrate to the fins, and higher heat dissipation.

The porous ceramic sintered body used as a preform for producing the composite material of the present invention includes various types such as spark plasma sintering, atmosphere sintering, recrystallization, and reaction sintering. Produced by the sintering method, by appropriately adjusting the ceramic powder particle size according to the sintering method,
A porous sintered body having a pore size (7 to 50 μm) suitable for pressure impregnation can be obtained. The porosity, strength, and the like of the ceramic sintered body are adjusted by the powder particle size and firing conditions.

In the atmosphere sintering method, a molding aid (for example, polyvinyl alcohol, etc.) and a sintering reaction promoting aid (for example, graphite, boron carbide) and the like are mixed with ceramic powder,
A compact is formed by press molding (about 10 to 200 MPa) with a press or the like, and after degreasing, sintering is performed. The ceramic particles preferably have a particle size of 10 to 300 μm. If the particle size is smaller than this, the pore size of the obtained porous sintered body is too small, while if the particle size is larger than this, a large number of large pores exceeding 50 μm occupy a large number and endure the pressure impregnation treatment of the matrix metal. It is difficult to obtain mechanical strength.

In the spark plasma sintering method, a ceramic powder is charged between electrodes and an appropriate pressure (about 30 to 50 MPa) is applied.
This is a method of sintering by applying a current under the action of a) and heating to a predetermined temperature. The sintering mechanism has the advantage that the degree of freedom in controlling the pore distribution is large. The ceramic particles preferably have a particle size of 10 to 300 μm. If the particle diameter is smaller than this, the pore diameter of the sintered body becomes too small, and if the particle diameter is larger than this, the number of coarse pores increases, so that it is difficult to secure the mechanical strength to withstand the pressure impregnation treatment.

In the recrystallization method, an appropriate molding aid is added to a ceramic powder and mixed, followed by pressure molding (about 10 to 200 MPa).
a) Then, after the molded body is degreased, it is sintered. A method of pouring a slurry of the powder mixture into a mold and drying is also applied to a method of forming the formed body. This sintering method can control the sintering temperature and the pore size by heat treatment after sintering. Even if the ceramic powder has a fine particle size, the sintering temperature can be increased to 7 μm or more. The pore diameter can be realized. However, if the pore diameter exceeds 50 μm, the mechanical strength of the sintered body rapidly decreases, and it becomes difficult to secure the strength to withstand the pressure impregnation treatment of the molten metal. Good.

In the reaction sintering method, a mixture of ceramic powder and a molding aid is subjected to pressure molding (about 10 to 200 MPa),
After degreasing, a sintering process is performed, and then a substance having reactivity with the ceramic (for example, Si powder in the case of silicon carbide ceramics) is brought into contact with the ceramic to cause a reaction. The pore distribution and mechanical strength of the sintered body can be controlled by this reaction. The reactive substance may be blended in the sintering raw material powder. The applied ceramic particles are 5
Particle sizes of ~ 200 [mu] m are preferred. If the particle size is smaller than this, the sintering reaction proceeds too much, and the pore size becomes smaller. If the particle size is larger than this, the strength of the sintered body is greatly reduced and the required mechanical strength cannot be obtained.

[0028]

[Example] Preform A porous sintered body (thickness 5 mm, width 1
00 mm, 150 mm long plate). [Atmospheric sintering] Silicon carbide (SiC) 1900-2200 ° C Aluminum nitride (AlN) 1400-1800 ° C Silicon nitride (Si ₃ N ₄ ) 1600-1800 ° C

[Spark plasma sintering] (However, pressure: 30
～50MPa) silicon carbide (SiC) 1600 to 1800 ° C. Aluminum nitride (AlN) 1200 to 1600 ° C. silicon nitride (Si ₃ N ₄₎ 1200~1400 ℃

[Recrystallization method] Silicon carbide (SiC) 1600-2200 ° C

[Reaction sintering method] Silicon carbide (SiC) 1400-1700 ° C Reaction material Si powder addition

Matrix metal Aluminum [JIS H4000 alloy number 1100] (Al ≥ 99.0%) Aluminum alloy [JIS H5302 ADC12] [JIS H5202 AC4C] Copper [JIS H5100 CuCl] (Cu 99.5%) Copper alloy (brass) [JIS H5101 YBC2]

Pressure impregnation treatment of molten matrix metal Pressure casting machine: Squeeze cast machine (“VSC315” manufactured by Ube Industries, Ltd.) Melt temperature: Aluminum: 750 to 850 ° C. Aluminum alloy: 700 to 800 ° C. Copper: 1100 ~ 1200 ° C Copper alloy ... 800 ~ 1100 ° C Pressing force: 100 MPa Impregnation speed: 1.0 m / sec or less Pressurization holding time: 5 to 15 sec

Tables 1 and 2 show the manufacturing conditions of each test material and the physical properties of the composite material. Invention Examples No. 11, 17, 20
Has relatively low flexural strength (<10 M
Pa), and the other invention examples have higher bending strength. No.8
Is an example in which fins are integrally cast (using the molds of FIGS. 2 and 3) during pressure impregnation of a matrix metal to form a finned composite material (FIG. 4). Boundary part (2) between composite structure part) and fin (metal part)
Shows the measured thermal conductivity for 3 ₁₎ samples taken from (see Figure 9).

In the comparative examples, No. 51 and No. 52
Examples of using porous sintered bodies having fine pores (pore diameter <7 μm) as preforms, No. 53 and No. 54
Is an example using a porous sintered body having a coarse pore diameter (> 50 μm). No. 55 is an example of a composite material including a sintered body manufactured using a powder mixture of a ceramic and a matrix metal as a raw material.

No. 56 is a composite material (composite structure is Invention Example N).
This is an example of a conventional type finned composite material in which fins (the same aluminum alloy as the fins of Invention Example No. 8) are bonded to a fin with an adhesive (thermal grease).
Its thermal conductivity column, main body sample taken from (composite structure portion) and the fin boundary portion (metal portion) (23 ₂₎ (Figure 1
0) are shown.

FIG. 6 is a composite structure (magnification × 50) of Invention Example No. 7 (preform bending strength ≧ 10 MPa), and FIG. 7 is Invention Example No. 11 (preform bending strength <10 MPa).
Are shown (magnification × 40). In the figure, the light gray portion is the matrix metal, and the black portion is the ceramics (skeleton structure). FIG. 8 shows FIG.
2 shows the vicinity of the boundary between the composite structure portion and the fins in the composite material of No. 2 (upper half (dispersed mixed portion of dark gray portion and gray white portion): composite structure portion / lower half portion (grey white portion): fin (metal single unit) Phase part), magnification × 50).

As shown, the composite material of the present invention has a dense composite structure in which the matrix metal is impregnated and filled without leaving voids in the porous sintered body (FIGS. 6 and 7). Further, in the finned composite material obtained by simultaneously performing the pressure impregnation of the matrix metal and the casting of the fin, the composite structure portion and the fin have complete integral continuity (FIG. 8).

As shown in Tables 1 and 2, the composite material of the invention has higher and higher thermal conductivity and lower thermal expansion than the composite of the comparative example. This improved thermal property is due to the dense composite structure, as described above, and has good adhesion at the interface between the skeleton structure (ceramic sintered body) and the matrix metal, and the continuity of the skeleton structure. A high thermal conductivity is given as an effect of the form and the like, and a thermal expansion coefficient of the matrix metal is suppressed and a low thermal expansion coefficient is given as a restraining effect of the skeleton structure on the matrix metal.

For No. 8 and No. 56 having fins (the composition and composition of the composite structure and the fin material are the same), the fin (metal part) and the main body (composite structure) Comparing the thermal conductivity of the boundary part, the No.
The thermal conductivity of No. 8 (the fin and the main body are integrally formed by pressure casting) is significantly larger than that of the conventional material No. 56 (the fin is adhered to the main body), and the difference between the two is obvious. This significant difference occurs, No.56 in (main body and the bonding structure of the fins), whereas adhesive interposed boundary portion (23 ₂₎ is a barrier to thermal conduction, No.8 boundary Part (23 ₁ )
Because there is no such barrier and the body and the fin have perfect continuous integrity.

Accordingly, Invention Example No. 8 (having an integrally formed structure of the main body and the fin) and No. 56 of the conventional material were used.
In the case where each of the main body and the fin was used for actual use as a heat dissipation board for a semiconductor circuit (forcibly cooled through the fins with cooling water), the invention example No. 8 It has an outstanding heat radiation effect that cannot be obtained with the conventional material No. 56.

In Comparative Examples No. 51 and No. 52, the pore diameter of the preform (porous sintered body) was too small, and the impregnation of the matrix metal melt was incomplete (there were many residual pores). As a result, the thermal conductivity of the composite material remains at a low level. No. 53 and No. 54 have coarse pores (> 50 μm) and insufficient preform strength (<5M).
Pa), the skeletal structure of the preform is broken by the pressure of the molten metal during the pressure impregnation of the matrix metal, and the coefficient of thermal expansion is increased. Therefore, in order to obtain a sound composite material having improved thermal properties by impregnating a ceramic sintered body under pressure with a matrix metal, it is necessary to use a sintered body having a pore size of 7 to 50 μm.

Further, Comparative Example No. 55 was replaced with Invention Example No. 1,
Compared to 4,5 etc., both have the same material type and quantity ratio of ceramics and matrix metal (SiC / Al,
Although the volume ratio is 70/30), there is a clear difference in thermal characteristics. No. 55 has a higher coefficient of thermal expansion and lower thermal conductivity than those of the invention examples. This is considered to be because the sintered body manufactured using the powder mixture of the ceramic and the metal as a raw material does not provide the effects based on the above-described composite structure of the present invention.

[0044]

[Table 1]

[0045]

[Table 2]

[0046]

The composite material of the present invention is suitable as a component of a semiconductor device required to have both high thermal conductivity and low thermal expansion characteristics, for example, a heat radiating substrate and a heat sink substrate attached to a semiconductor circuit board. Further, by providing an insulating layer on the surface, it can be used as a circuit board on which a semiconductor element is mounted. According to the present invention, there is no need for complicated steps as in the case of the powder metallurgy technique, and no long-term treatment as in the technique of spontaneously impregnating the matrix metal is required. It can be manufactured well and is cost effective. Further, fins and the like can be easily formed, and since they are manufactured as an integrally molded product, higher heat dissipation can be provided as compared with a conventional bonding structure.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing an example of pressure casting for producing a composite material of the present invention.

FIG. 2 is an explanatory sectional view showing another example of pressure casting for producing the composite material of the present invention.

FIG. 3 is a view as viewed in the direction of arrows AA in FIG. 2;

FIG. 4 is a front view showing an example of the composite material of the present invention.

FIG. 5 is a photomicrograph (magnification ××) showing the particle structure (porous structure) of a preform (before matrix metal impregnation).
50).

FIG. 6 is a micrograph (magnification × 50) showing a structure of the composite material of the present invention, which is a drawing-substituting micrograph.

FIG. 7 is a micrograph (magnification × 40) showing a structure of the composite material of the present invention, which is a drawing-substituting micrograph.

FIG. 8 is a micrograph (magnification × 50) showing a structure of the composite material of the present invention, which is a drawing-substituting micrograph.

FIG. 9 is an explanatory view of a sampling position of a sample for measuring thermal conductivity at a boundary between a main body (composite structure) and a fin (metal) of a test material in an example.

FIG. 10 is a diagram showing a main body portion (composite structure) of a test material in an embodiment.
FIG. 5 is an explanatory diagram of a sampling position of a sample for measuring thermal conductivity at a boundary between a fin and a fin (metal).

[Explanation of symbols]

10: Mold for pressure casting 11: Lower die 12: Upper die 13: Molten metal supply path 14: Gas vent hole 151, 152: Preform support pin 17: Cavity 171: Fin forming space of cavity 20: Preform 21: main body portion (a metal - ceramic composite structure) 22: fin (metal part) ₂₃ 1, 23 _2: main body - of the fin boundary TP: thermal conductivity measurements to be taken from the boundary portion between the main body and the fins Test specimen

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) F28F 21/08 F28F 21/08 E (72) Inventor Akira Kosaka 1-1-1 Nakamiya Oike, Hirakata City, Osaka Prefecture No. 1 Kubota Hirakata Factory (72) Inventor Souichi Asano 1-1-1, Nakamiya Oike, Hirakata City, Osaka Prefecture F-term (reference) 4K020 AA22 AA27 AC01 AC04 BA02 BB26

Claims (16)

[Claims] 1. A skeletal structure, which is a ceramic sintered body, formed by impregnating a molten metal of a matrix metal into pores of a porous ceramic sintered body having a pore diameter of 7 to 50 μm, and a matrix. A metal-ceramic composite material having a composite structure composed of a metal. 2. The composite structure according to claim 1, wherein the composite structure comprises a skeletal structure having substantially the same particle bonding form as the ceramic sintered body before the matrix metal is impregnated with pressure, and the impregnated matrix metal. Metal-ceramic composite material. 3. A skeletal structure having fine streaky gaps formed by partially breaking particle bonding of a ceramic sintered body by a molten metal pressure during pressure impregnation of a matrix metal melt. The metal-ceramic composite material according to claim 1, comprising a matrix metal impregnated along the streaky gap. 4. The metal-ceramic according to claim 1, wherein the ceramic sintered body comprises one or a mixture of two or more selected from silicon carbide, silicon nitride, aluminum nitride, and alumina. Composite materials. 5. The matrix metal is aluminum or an aluminum alloy, and the matrix metal is 20 to 40.
5. The metal-ceramic composite material according to claim 4, which has a composite structure composed of a volume% and a balance of ceramics. 6. The thermal conductivity of 170 W / m · K or higher, and the thermal expansion coefficient of 4 × ^{10 -} having 6 ~8 × ^{10 -6} / K, a metal according to claim 5 which is a heat dissipating member for a semiconductor circuit - Ceramic composite materials. 7. The metal according to claim 4, wherein the matrix metal is copper or a copper alloy, and has a composite structure comprising 20 to 45% by volume of the matrix metal and the balance ceramics.
Ceramic composite materials. 8. The thermal conductivity of 240 W / m · K or higher, and the thermal expansion coefficient of 4 × ^{10 -} having 6 ~8 × ^{10 -6} / K, a metal according to claim 7 is a heat dissipating member for a semiconductor circuit - Ceramic composite materials. 9. The metal-ceramic composite material according to claim 1, wherein fins made of the same material as the matrix metal are formed on one plate surface of the composite material. 10. The pressure casting mold has a cavity in a cavity.
A porous ceramics sintered body having a bending strength of not less than MPa and a pore diameter of 7 to 50 μm is installed, and a molten metal of a matrix metal is applied at a pressure of 50 to 100 MPa and an impregnation speed of 1.0 m.
A method for producing a metal-ceramic composite material having a composite structure composed of a skeletal structure, which is a ceramic sintered body, and a matrix metal, wherein the metal-ceramic composite material is injected into a cavity at a rate of not more than / sec and held under pressure for 5 seconds or more. 11. A porous ceramic sintered body having a bending strength of 10 MPa or more is impregnated with a skeletal structure maintaining substantially the same particle bonding form as that of the ceramic sintered body before pressure matrix impregnation with a matrix metal. 11. The metal according to claim 10, which forms a composite structure comprising a matrix metal and
Manufacturing method of ceramic composite material. 12. A porous ceramic sintered body having a bending strength of less than 10 MPa is used, and the particle bonding of the ceramic sintered body is partially cut by the pressure of the molten metal during the pressure impregnation of the molten matrix metal. 2. A composite structure comprising a skeletal structure having fine streaked gaps and a matrix metal impregnated along the streaked gaps.
0. The method for producing a metal-ceramic composite material according to item 0. 13. The ceramic sintered body according to claim 10, wherein the ceramic sintered body is made of one or a mixture of two or more of silicon carbide, silicon nitride, aluminum nitride, and alumina.
13. The method for producing a metal-ceramic composite material according to the above item. 14. The porosity of the ceramic sintered body is 20 to
The method for producing a metal-ceramic composite material according to claim 13, wherein the matrix metal is aluminum or an aluminum alloy. 15. The porosity of the ceramic sintered body is 20 to
The method for producing a metal-ceramic composite material according to claim 13, wherein the matrix metal is 45%, and the matrix metal is copper or a copper alloy. 16. A porous ceramic sintered body is installed in a cavity of a pressure casting mold having a fin forming space provided in the cavity, and pores of the sintered body are impregnated with a matrix metal melt, 2. A fin made of a matrix metal is cast on a surface of a composite material to be formed.
16. The method for producing a metal-ceramic composite material according to any one of 0 to 15.