JP2000331977A5 - - Google Patents

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Publication number
JP2000331977A5
JP2000331977A5 JP1999139536A JP13953699A JP2000331977A5 JP 2000331977 A5 JP2000331977 A5 JP 2000331977A5 JP 1999139536 A JP1999139536 A JP 1999139536A JP 13953699 A JP13953699 A JP 13953699A JP 2000331977 A5 JP2000331977 A5 JP 2000331977A5
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JP
Japan
Prior art keywords
hydrogen gas
dissolved
water
ozone
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999139536A
Other languages
English (en)
Japanese (ja)
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JP2000331977A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11139536A priority Critical patent/JP2000331977A/ja
Priority claimed from JP11139536A external-priority patent/JP2000331977A/ja
Publication of JP2000331977A publication Critical patent/JP2000331977A/ja
Publication of JP2000331977A5 publication Critical patent/JP2000331977A5/ja
Pending legal-status Critical Current

Links

JP11139536A 1999-05-20 1999-05-20 電子材料の洗浄方法 Pending JP2000331977A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11139536A JP2000331977A (ja) 1999-05-20 1999-05-20 電子材料の洗浄方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11139536A JP2000331977A (ja) 1999-05-20 1999-05-20 電子材料の洗浄方法

Publications (2)

Publication Number Publication Date
JP2000331977A JP2000331977A (ja) 2000-11-30
JP2000331977A5 true JP2000331977A5 (enExample) 2006-05-25

Family

ID=15247573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11139536A Pending JP2000331977A (ja) 1999-05-20 1999-05-20 電子材料の洗浄方法

Country Status (1)

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JP (1) JP2000331977A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3535820B2 (ja) 2000-10-06 2004-06-07 エム・エフエスアイ株式会社 基板処理方法および基板処理装置
JP4039662B2 (ja) * 2002-08-13 2008-01-30 株式会社Sumco 半導体基板又は素子の洗浄方法
JP2011035300A (ja) * 2009-08-05 2011-02-17 Asahi Sunac Corp 洗浄装置、及び洗浄方法
JP2011039339A (ja) * 2009-08-13 2011-02-24 Canon Inc 剥離液の再生方法
CN101972753B (zh) * 2010-07-21 2011-12-21 河北工业大学 镁铝合金化学机械抛光后表面清洗方法
CN102039283B (zh) * 2010-07-21 2012-04-18 河北工业大学 Ti阻挡层材料化学机械抛光后的表面洁净方法

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