JP2000269677A - High-frequency device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency device which eliminates the need of resist printing. SOLUTION: A high-frequency device is provided with a metal frame of substantially square shape, a printed-circuit board 22 that is fitted into the frame while an electronic circuit is mounted, and a metal partition plate 23 that divides the inside of the frame and at the same time has an insertion part 12 inserted into a slit 16, that is provided at the printed-circuit board 22. At the insertion part 12, a projecting part 13 that is formed while being partially cut, and flat parts 14 and 15 other than the projecting part 13 are formed. At the same time, a soldering land 18 is formed on the surface of the printed-circuit board 22 that is arranged opposite the projecting part 13, thus doing away with a resist printing process to the partition plate 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to terrestrial broadcasting and CATV.
The present invention relates to a high-frequency device for receiving radio waves and the like, and particularly relates to a partition plate of the high-frequency device.

[0002]

2. Description of the Related Art A conventional high-frequency device will be described below.

As shown in FIG. 3, a conventional high-frequency device comprises a frame 1, a partition plate 2 for partitioning the frame 1, and a printed circuit board 3 inserted into the frame 1 and having an electronic circuit mounted thereon. It had been.

The partition plate 2 and the printed circuit board 3
Had a shape as shown in FIG. That is, as shown in FIG. 4A, an insertion portion 4 was formed in the partition plate 2, and the insertion portion 4 was provided with projections 5, 6 in opposite directions. On the other hand, as shown in FIG. 4B, the printed board 3 is provided with a slit 11 into which the insertion portion 4 is inserted, and a concave portion 8 at a position facing the convex portion 5 and facing the convex portion 6. The recess 9 was provided at the position.

[0005] The insertion portion 4 is inserted into the slit 11 of the printed circuit board 3 configured as described above, and the projection 5 and the soldering land 10 and the projection 6 and the soldering land 10 are soldered by the reflow soldering method. Was attached. And
The resist 7 was printed at a place other than the soldering so that the solder did not flow out.

[0006]

However, in such a conventional structure, a resist printing step of always applying a resist 7 is required where soldering is not required.

An object of the present invention is to solve such a problem and to provide a high-frequency device which does not require a resist printing step.

[0008]

In order to achieve this object, a high-frequency device according to the present invention is characterized in that an insertion portion of a partition plate has a projection formed by cutting out a part thereof, and a flat portion other than the projection. And a soldering land formed on the surface of the printed circuit board corresponding to the projection. Thereby, the step of printing the resist on the partition plate becomes unnecessary.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention according to claim 1 of the present invention is directed to a substantially rectangular metal frame, a printed circuit board mounted in the frame and having an electronic circuit mounted thereon, And a metal partition plate having an insertion portion to be inserted into a slit provided on the printed circuit board, wherein the insertion portion has a projection formed by cutting out a part thereof, and a portion other than the projection. This is a high-frequency device in which a flat portion is formed and a soldering land is formed on the surface of the printed circuit board facing the convex portion, and since a portion of the insertion portion is cut out to form a convex portion, The cream solder is easy to come into contact with the convex part, and the solder has a step on the part other than the convex part, and since this cutout forms a rough surface, it does not flow, so it can be soldered securely. Along with the can, resist printing is not required. Therefore, the step of printing the resist on the partition plate can be eliminated. In addition, the slit shape can be simplified because only the protrusion protrudes to one side.

According to a second aspect of the present invention, there is provided the high-frequency device according to the first aspect, wherein the cutout amount of the projection is substantially the thickness of the partition plate. Therefore, no gap is generated at the boundary between the flat portion and the convex portion, and the shielding performance is improved. Further, since the cutout amount is substantially equal to the thickness of the plate, it becomes difficult for the solder to flow to portions other than the soldered portion.

According to a third aspect of the present invention, there is provided the high-frequency device according to the first aspect, wherein a soldering land is formed on the surface of the printed circuit board opposite to the flat portion on the back surface side of the convex portion. Since the soldering lands are also formed on the printed board facing the flat portion, the mechanical bonding strength between the printed board and the partition plate is improved. Also, the grounding of the electronic circuits on both sides of the partition plate is strengthened via the partition plate.

According to a fourth aspect of the present invention, in the insertion portion, a shield portion is formed in addition to the convex portion and the flat portion, and the convex portion and the flat portion are lower than the shield portion. Since this is a high-frequency device and the projections and flat portions are reduced in this way, a good solder fillet can be formed.

According to a fifth aspect of the present invention, there is provided the high-frequency device according to the first aspect, wherein the width of the soldering land is smaller than the width of the projection. The narrowing makes it difficult for the solder to flow to portions other than the convex portions.

According to a sixth aspect of the present invention, there is provided the high-frequency device according to the third aspect, wherein the width of the soldering land is smaller than the width of the flat portion. The narrowing makes it difficult for the solder to flow to portions other than the flat portion.

According to a seventh aspect of the present invention, the width of the slit is
2. The high-frequency device according to claim 1, wherein the thickness is larger than the sum of the thickness of the partition plate and the cutout amount of the projection. By setting the slit width as described above, the punch shape for punching the slit can be simplified.

The invention according to claim 8 is the high-frequency device according to claim 1, wherein the slit has a concave portion at a position facing the convex portion of the insertion portion. In addition, the dead space of the printed circuit board can be reduced and the degree of freedom in circuit design can be increased.

According to a ninth aspect of the present invention, there is provided the high-frequency device according to the first aspect, wherein the top surface of the convex portion and the flat portion is chamfered. Thereby, the printed circuit board can be easily inserted.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

In FIG. 1A, reference numeral 23 denotes a partition plate made of metal. The partition plate 23 has the same function as the partition plate 2 provided in the frame 1 as shown in the related art. Reference numeral 12 denotes an insertion portion provided on the partition plate 23. Reference numeral 13 denotes a convex portion cut out by a mold, and reference numerals 14 and 15 denote flat portions formed on both sides of the convex portion 13.

On the other hand, FIG. 1B shows a printed circuit board 22 mounted in the frame 1, and 16 is a slit.
The slit 16 has a concave portion 17 into which the convex portion 13 is fitted. The slit 16 formed as described above
Then, the insertion part 12 is inserted.

Here, reference numeral 18 denotes a soldering land provided on the surface of the printed circuit board 22 so as to face the convex portion 13. The width 18a of the soldering land 18 is
Is smaller than the width 13a. As a result, the flow of solder to portions other than the protrusions 13 is prevented. In addition, by making the cutout amount 13b of the convex portion 13 substantially equal to the plate thickness 23a of the partition plate 23, the gap between the flat portion 14 and the convex portion 13 is eliminated, and the high-frequency shielding performance increases. In addition, by making the cutout amount 13b of the convex portion 13 substantially equal to the plate thickness 23a, the flow of solder to portions other than the soldered portion is prevented.

Reference numeral 19 denotes a soldering land provided on the surface of the printed circuit board 22 so as to face the flat portion 14 on the back surface side of the convex portion 13. Are soldering lands provided on the surface of the substrate.

Similarly, the width 19a of the soldering land 19 is smaller than the width 14a of the flat portion 14.

The width 20a of the soldering land 20
Are also narrower than the width 15a of the flat portion 15.

The insertion part 12 of the partition plate 23 may be provided with a shield part in addition to the flat parts 14, 15 or the convex part 13. When this shield portion is formed, it is desirable that the top surfaces of the flat portions 14 and 15 and the top surface of the convex portion 13 be lower than the top surface of the shield portion. The width 14a of the flat portion 14 is 3 mm, and the width 13a of the projection 13 is also 3 mm. With such a size, a good soldering state can be obtained.

FIG. 2 is a sectional view of a main part of FIG. 1. As shown, the top surface 13c of the projection 13 is lower than the top surface 21a of the shield portion 21 by 1.2 mm. This makes it difficult for the solder to flow to portions other than the soldered portion. The clearance between the slit 16 and the insertion portion 12 is 0.05 mm. By providing such a small clearance, the soldering is performed well. Further, the flat portions 14, 15 and the top surface side surfaces of the convex portions 13 are chamfered so that the printed circuit board 2 can be formed with a small clearance.
The second slit 16 can be easily inserted. In the present embodiment, the slit 16 is provided with the concave portion 17, but may be formed in a rectangular shape without providing the concave portion 17.
In this case, the shape of the punch for slit punching can be facilitated, so that the cost of the mold can be reduced and the maintenance can be easily performed.

[0027]

As described above, according to the present invention, the insertion portion of the partition plate has a projection formed by cutting out a part thereof,
Since a flat portion is formed in addition to the projecting portion and a soldering land is formed on the surface of the printed circuit board corresponding to the projecting portion, the resist printing step on the partition plate can be omitted.

Further, it is possible to simplify a punch shape and a slit shape for slit punching of a mold, and it is possible to provide an efficient ground arrangement.

[Brief description of the drawings]

FIG. 1A is a perspective view of a main part of a partition plate of a high-frequency device according to an embodiment of the present invention; FIG.

FIG. 2 is a sectional view of a main part of a partition plate and a printed circuit board.

FIG. 3 is a perspective view of a conventional high-frequency device.

FIG. 4A is a perspective view of a main part of a partition plate of a conventional high-frequency device. FIG. 4B is a perspective view of a main part of the printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 Insert part 13 Convex part 14 Flat part 15 Flat part 16 Slit 18 Soldering land 22 Printed circuit board 23 Partition plate

Continued on the front page (72) Inventor Hitoshi Hirano 1006 Kazuma Kadoma, Kazuma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. F term (reference) 5E321 AA11 CC12 GG01 GG05

Claims (9)

[Claims] 1. A substantially rectangular metal frame, a printed circuit board mounted in the frame and having an electronic circuit mounted thereon, and partitioning the inside of the frame and being inserted into a slit provided in the printed circuit board. A metal partition plate having an insertion portion to be inserted,
A high-frequency device in which a convex portion formed by cutting out a part thereof, a flat portion other than the convex portion, and a soldering land are formed on a surface of a printed circuit board facing the convex portion. 2. The high-frequency device according to claim 1, wherein the cutout amount of the projection is substantially the thickness of the partition plate. 3. The high-frequency device according to claim 1, wherein a soldering land is formed on the surface of the printed circuit board opposite to the flat portion on the rear surface side of the convex portion. 4. The high-frequency device according to claim 3, wherein a shield portion is formed in the insertion portion in addition to the convex portion and the flat portion, and the convex portion and the flat portion are lower than the shield portion. 5. The high-frequency device according to claim 1, wherein the width of the soldering land is smaller than the width of the projection. 6. The high-frequency device according to claim 3, wherein the width of the soldering land is smaller than the width of the flat portion. 7. The high-frequency device according to claim 1, wherein the width of the slit is larger than the sum of the thickness of the partition plate and the cutout amount of the projection. 8. The high-frequency device according to claim 1, wherein the slit is provided with a concave portion at a position facing the convex portion of the insertion portion. 9. The high-frequency device according to claim 1, wherein the convex portion and the flat portion have chamfered outer sides of the top surface.