JPS6141269Y2 - - Google Patents

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Publication number
JPS6141269Y2
JPS6141269Y2 JP1978090010U JP9001078U JPS6141269Y2 JP S6141269 Y2 JPS6141269 Y2 JP S6141269Y2 JP 1978090010 U JP1978090010 U JP 1978090010U JP 9001078 U JP9001078 U JP 9001078U JP S6141269 Y2 JPS6141269 Y2 JP S6141269Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
metal piece
copper foil
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1978090010U
Other languages
Japanese (ja)
Other versions
JPS557368U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1978090010U priority Critical patent/JPS6141269Y2/ja
Publication of JPS557368U publication Critical patent/JPS557368U/ja
Application granted granted Critical
Publication of JPS6141269Y2 publication Critical patent/JPS6141269Y2/ja
Expired legal-status Critical Current

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Description

【考案の詳細な説明】 〔考案の目的〕 (産業上の利用分野) 本考案は電気機器に使用される印刷基板の補強
構造の改良に関する。
[Detailed Description of the Invention] [Purpose of the Invention] (Field of Industrial Application) The present invention relates to an improvement in the reinforcing structure of printed circuit boards used in electrical equipment.

(従来の技術) テレビジヨン受像機など電気機器に使用される
印刷基板の補強構造としては、従来よりシヤーシ
を使用する構造が知られている。
(Prior Art) As a reinforcement structure for printed circuit boards used in electrical equipment such as television receivers, a structure using a chassis is conventionally known.

すなわち、第1図、第2図に示すように印刷基
板1を部分的にシヤーシ2に密着させて、さらに
ネジ3等で固定した構造で、シヤーシ2としては
変形防止のため、厚板を曲げ加工したものが使わ
れている。
That is, as shown in Figs. 1 and 2, the printed circuit board 1 is partially attached to the chassis 2 and fixed with screws 3, etc., and the chassis 2 has a thick plate bent to prevent deformation. Processed products are used.

しかしながら、この構造で補強効果を上げるた
めには、印刷基板1とシヤーシ2の接触部4の面
積を広くする必要があり、印刷基板1は電気性能
として要求される基板面積よりさらに大きな基板
面積が必要である。
However, in order to increase the reinforcing effect with this structure, it is necessary to increase the area of the contact portion 4 between the printed circuit board 1 and the chassis 2, and the printed circuit board 1 has a board area that is even larger than the board area required for electrical performance. is necessary.

また、印刷基板1とシヤーシ2はネジ3のみで
固定され、ネジ部を除く他の部分は変形可能であ
るため、振動や落下のシヨツクによつてネジ部近
辺が破損し易い欠点があつた。
In addition, since the printed circuit board 1 and the chassis 2 are fixed only with the screws 3, and the other parts except the screw portions are deformable, there is a drawback that the vicinity of the screw portions is easily damaged by vibration or shock from falling.

又、他の構造としては、実開昭50−20167号に
記載されているように、平板、L字形、コ字形の
補強材を印刷基板の周囲端部に合せ銅箔部と面接
触させて配置し、補強材の一部と印刷基板の銅箔
部を半田付により固定したものが知られている。
In addition, as another structure, as described in Utility Model Application Publication No. 50-20167, a flat plate, L-shaped, or U-shaped reinforcing material is placed around the peripheral edge of the printed circuit board and brought into surface contact with the copper foil part. It is known that a part of the reinforcing material and a copper foil part of the printed circuit board are fixed by soldering.

(考案が解決しようとする問題点) しかしこの様に平板の補強材を面接触させて使
用する場合は、強度的な理由で厚板の金属板を使
用しなければ強度が得られない。その結果補強材
と印刷基板が半田付されるには補強材が充分に熱
せられなければならず、それ迄に長時間を要し印
刷基板の絶縁材部分が熱で変色し、劣化すると云
う重大な欠点があつた。
(Problem to be solved by the invention) However, when using flat reinforcing materials in surface contact like this, strength cannot be obtained unless a thick metal plate is used for strength reasons. As a result, in order for the reinforcing material to be soldered to the printed circuit board, the reinforcing material must be sufficiently heated, which takes a long time, and the heat can discolor and deteriorate the insulating material of the printed board, which is a serious problem. There was a drawback.

又、平板、L字形の補強材を収用した場合は、
印刷基板に取付けて半田付する為に何らかの方法
で補強材と印刷基板を仮止めしてから半田付しな
ければならない欠点があつた。更にこの仮止めを
不要とするには、印刷基板の銅箔面側を上面側に
して補強材を載置し半田鏝を使用して半田付する
と云う手作業の取付になり、補強材付の印刷基板
を半田槽内に入れて半田付することは不可能であ
つた。
In addition, if a flat plate or L-shaped reinforcement material is expropriated,
In order to attach and solder the reinforcing material to the printed circuit board, there was a drawback that the reinforcing material and the printed circuit board had to be temporarily attached by some method before soldering. Furthermore, in order to eliminate the need for temporary fixing, the reinforcing material must be placed on the printed circuit board with the copper foil side facing up, and then soldered using a soldering iron. It was impossible to put the printed circuit board into a solder bath and solder it.

この対策として補強材をコ字形に折曲して印刷
基板周囲の端部に挟み込んで仮止めすることも考
えられるが一般に板厚1.0mm乃至1.6mm位の印刷基
板を使用しているので間隔の狭いコ字形の補強材
をプレス加工するには金型が弱くなり量産的でな
かつた。更に製品のコ字形間の間隔の許容差によ
つては補強材を印刷基板に取付けると補強材の取
付ガタ、取付不可、等の事故が発生し取付作業性
が良くないと云う欠点があつた。
As a countermeasure to this problem, it is possible to temporarily fix the reinforcing material by bending it into a U-shape and inserting it into the edges around the printed circuit board, but generally, since printed circuit boards with a thickness of about 1.0 mm to 1.6 mm are used, the spacing is limited. Pressing the narrow U-shaped reinforcing material made the mold weak, making it difficult to mass-produce. Furthermore, depending on the tolerance of the spacing between the U-shaped parts of the product, when the reinforcing material is attached to the printed circuit board, accidents may occur such as the reinforcing material becoming loose or not being able to be attached, resulting in poor installation workability. .

又、印刷基板と補強材はいずれの形状において
も面接触させて取付けられる為、補強材が取付け
られるパターン幅を広げなければならず、このパ
ターン面上には電気部品を配置することは不可能
なので、高価な印刷基板面積を有効に活用するに
は不適当な印刷基板の補強構造があつた。
In addition, since the printed circuit board and the reinforcing material are attached in surface contact in any shape, the width of the pattern to which the reinforcing material is attached must be widened, and it is impossible to place electrical components on this pattern surface. Therefore, there was a reinforcement structure for the printed circuit board that was inappropriate for effectively utilizing the area of the expensive printed circuit board.

本考案は上述した欠点を解消するためになされ
たものであり、簡単な作業で高い補強効果が得ら
れるシヤーシ不要の印刷基板の補強構造を提供す
ることを目的とするものである。
The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide a reinforcing structure for a printed circuit board that does not require a chassis and can obtain a high reinforcing effect with a simple operation.

〔考案の構成〕[Structure of the idea]

(問題点を解決するための手段) この目的を達成するために、この考案は次のよ
うな構成としている。印刷基板のアースパターン
に金属片を略直角に配置して半田付したものであ
る。
(Means for solving the problem) In order to achieve this purpose, this invention has the following structure. A metal piece is placed approximately perpendicular to the ground pattern of the printed circuit board and soldered.

(作 用) 金属片をアースパターンと直角に配置すること
により、金属片全体が両面から半田付され厚板状
態になるので、金属片は薄板を使用することがで
きる。金属片は印刷基板の板厚方向に配置して半
田により両者が断面T字形に固着されるので印刷
基板の板厚が極端に増加されたと同一の作用をも
つものである。
(Function) By arranging the metal piece at right angles to the ground pattern, the entire metal piece is soldered from both sides and becomes a thick plate, so a thin metal piece can be used. Since the metal pieces are arranged in the thickness direction of the printed circuit board and are fixed together with solder so that they have a T-shaped cross section, the same effect is obtained as if the thickness of the printed circuit board were extremely increased.

(実施例) この考案の実施例を図面を参照しながら説明す
る。第3図は本考案を示す印刷基板の側面図、第
4図は同じく印刷基板の銅箔側からみた分解斜視
図である。
(Example) An example of this invention will be described with reference to the drawings. FIG. 3 is a side view of a printed circuit board illustrating the present invention, and FIG. 4 is an exploded perspective view of the printed circuit board viewed from the copper foil side.

印刷基板1の銅箔側外周縁部にアースパターン
3と、このアースパターン3に透孔9,9……を
必要に応じ適宜設ける。半田付可能な薄板の金属
片6には前記透孔9と対応する位置に突起61,
61……を設ける。この突起61は印刷基板1の
部品取付側14に突出して折り曲げられたり、突
起61のアースパターン3と接する位置に印刷基
板の板厚と略等しい寸法の切り欠き62,62を
設けて印刷基板1の部品取付側14に突起61を
突出させてひねり止めし、印刷基板1と金属片6
の仮取付が可能となつている。
An earth pattern 3 is provided on the outer periphery of the copper foil side of the printed circuit board 1, and through holes 9, 9 ... are provided in the earth pattern 3 as required. A solderable thin metal piece 6 has projections 61,
The projection 61 is bent so as to project toward the component mounting side 14 of the printed circuit board 1, or cutouts 62, 62 of a size substantially equal to the thickness of the printed circuit board are provided at the position of the projection 61 in contact with the earth pattern 3, so that the projection 61 projects toward the component mounting side 14 of the printed circuit board 1 and is prevented from twisting, and the printed circuit board 1 and the metal piece 6
Temporary installation is possible.

この金属片6は印刷基板1の銅箔側にアースパ
ターンと略直角に取付けられ、上述の如く突起6
1を透孔9に挿入して折り曲げ又はひねり止めさ
れて取付けられる。そして他の電気部品10,1
0固着の為の半田付と同様に半田槽内に入れられ
て印刷基板1の銅箔と金属片6が半田11によつ
て一体化され堅固に固着される。
This metal piece 6 is attached to the copper foil side of the printed circuit board 1 at a substantially right angle to the ground pattern, and the protrusion 6 is attached as described above.
1 is inserted into the through hole 9 and is attached by bending or twisting. and other electrical parts 10,1
Similar to soldering for zero fixation, the copper foil of the printed circuit board 1 and the metal piece 6 are put into a solder bath and are integrated with the solder 11 and firmly fixed.

以上の如く構成した印刷基板の補強構造では金
属片6は銅箔と略直角に取付けられているので、
印刷基板1に対して金属片6のしめる面積が少な
くなり印刷基板の面積を有効に活用できる。これ
を換言すれば幅の狭いアースパターンで金属片を
取付可能とするものである。
In the printed circuit board reinforcement structure configured as described above, the metal piece 6 is attached approximately at right angles to the copper foil, so that
The area covered by the metal piece 6 with respect to the printed circuit board 1 is reduced, and the area of the printed circuit board can be utilized effectively. In other words, the metal piece can be attached using a narrow ground pattern.

更に、銅箔よりなるアースパターンと直角で銅
箔面の下側に金属片6を取付けたので、金属片全
体が半田付されて更に補強されると同時に、金属
片の板厚方向の両側で銅箔と半田付され、従来の
如く金属片の一部分の半田付と異なり安定した半
田付が可能である。
Furthermore, since the metal piece 6 is attached to the lower side of the copper foil surface at right angles to the ground pattern made of copper foil, the entire metal piece is soldered and further reinforced, and at the same time, both sides of the metal piece in the thickness direction It is soldered to copper foil, and unlike the conventional soldering of a part of a metal piece, stable soldering is possible.

以上述べた事を総合して考えると金属片をアー
スパターンと直角に配置することで従来の平板を
銅箔部に面接触して取付けた補強よりも板厚を半
分以下にすることが可能である。更にこの金属片
は板厚方向の両側面が半田付されるので板厚が増
加したと同じ効果が発生し金属片は補強されたこ
とになり更に板厚を薄くすることが可能である。
その結果金属片は瞬時に熱せられて短時間で銅箔
と半田付される為、印刷基板に使用される絶縁材
の熱による変色や劣化に対し非常に効果がたかま
つた。
Considering all of the above, by arranging the metal pieces perpendicular to the ground pattern, it is possible to reduce the plate thickness by half or less compared to the conventional reinforcement in which a flat plate is attached in surface contact with the copper foil part. be. Furthermore, since this metal piece is soldered on both sides in the plate thickness direction, the same effect as if the plate thickness were increased occurs, and the metal piece is reinforced, making it possible to further reduce the plate thickness.
As a result, the metal piece is instantly heated and soldered to the copper foil in a short time, making it highly effective against heat-induced discoloration and deterioration of insulating materials used in printed circuit boards.

尚、金属片には突起61を設けたので印刷基板
1の透孔9に挿入して、折り曲げ又はひねりによ
り容易に金属片の仮止めができ従来の如く金属片
の取付ガタや取付不可能等の事故は発生しない。
又印刷基板1と電気部品10の半田槽内での半田
付時に、金属片6が比較的堅固に印刷基板を補強
するように仮取付されているので、従来より半田
槽内での熱による印刷基板の変形量が少なくなつ
た。
In addition, since the metal piece is provided with a protrusion 61, it can be inserted into the through hole 9 of the printed circuit board 1, and the metal piece can be easily temporarily fixed by bending or twisting, which prevents the metal piece from rattling or being impossible to mount as in the past. No accidents will occur.
In addition, when the printed circuit board 1 and the electrical component 10 are soldered in the solder bath, the metal piece 6 is temporarily attached to relatively firmly reinforce the printed circuit board, so that printing due to heat in the solder bath is more effective than in the past. The amount of deformation of the board has been reduced.

熱による基板の変形量が少ないことは、熱がさ
めて変形が復元する量も少なくなることである。
従つて、この復元時に発生する半田付の信頼性不
良が少なくなり、印刷基板全体における半田付の
信頼性が向上した。
The fact that the amount of deformation of the substrate due to heat is small means that the amount by which the deformation is restored after the heat cools down is also reduced.
Therefore, defects in soldering reliability that occur during restoration are reduced, and soldering reliability on the entire printed circuit board is improved.

更に印刷基板の熱による変形量が少なくなつた
ので電気部品10と印刷基板の取付による浮き上
りも少なくなると云う効果も発生した。
Furthermore, since the amount of deformation of the printed circuit board due to heat was reduced, there was also the effect that lifting caused by attachment of the electrical component 10 and the printed circuit board was reduced.

本考案の変形例を、第5図、第6図を参照して
説明する。
A modification of the present invention will be described with reference to FIGS. 5 and 6.

第5図で示すものは印刷基板と金属片の半田付
による取付状態を示すもので、金属片は印刷基板
の外周縁部の全周に沿つて半田11により固定す
るが、第6図に示すように全周でなく一部分の半
田付を削除してところどころに半田付部を設けて
固着してもよい。一部分の半田付を削除しても金
属片が連続して存在する為それ程印刷基板の強度
を低下させることにならない。
What is shown in Fig. 5 shows how the printed circuit board and the metal piece are attached by soldering, and the metal piece is fixed with solder 11 along the entire circumference of the outer peripheral edge of the printed board. For example, soldering may be removed from a portion of the circumference rather than the entire circumference, and soldered portions may be provided here and there for fixation. Even if a portion of the solder is removed, the strength of the printed circuit board will not be reduced that much because the metal pieces continue to exist.

又、この半田付を一部削除した位置で銅箔と接
する金属片部分の一部を切り欠き、印刷基板と金
属片間に間隔をもたせてこの間に他の回路パター
ンを設けることも可能である。
It is also possible to cut out a part of the metal piece that contacts the copper foil at the position where this soldering is partially removed, and create a gap between the printed circuit board and the metal piece so that another circuit pattern can be provided in between. .

但しこの場合印刷基板の強度はある程度低下す
るので重量物の電気部品がこの切り欠き部近辺に
存在しないことが望ましい。
However, in this case, the strength of the printed circuit board will be reduced to some extent, so it is desirable that no heavy electrical components be present near this notch.

〔考案の効果〕[Effect of idea]

以上説明したように本考案によれば、金属部材
と半田によつて印刷基板を補強するものであるか
ら、シヤーシを用いる従来と異なつて、厚板を加
工したり印刷基板の面積を広くしたりするなどの
手間が不用になるとともに、ネジ点数の削減や基
板とシヤーシ間で発生するシヨツクノイズの解消
なども達成される。
As explained above, according to the present invention, the printed circuit board is reinforced with metal members and solder, so unlike the conventional method that uses a chassis, it is not necessary to process thick plates or increase the area of the printed circuit board. In addition to eliminating the need for additional steps, it also reduces the number of screws and eliminates the shock noise that occurs between the board and chassis.

また金属部材としては入手の容易な単純なもの
ですみ、半田付工程を簡単で作業性にすぐれてい
る。
In addition, the metal components can be simple and easily available, and the soldering process is simple and has excellent workability.

したがつてこの考案はテレビジヨン受像機に限
らず電気機器一般の印刷基板に対し、実用的にす
ぐれた補強構造を得ることができた。
Therefore, this invention was able to provide a practically excellent reinforcing structure for printed circuit boards not only for television receivers but also for electrical equipment in general.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例の印刷基板の補強構造を示す斜
視図、第2図は第1図のA−A断面図、第3図は
本考案の印刷基板の補強構造を示す断面図、第4
図は同じく印刷基板を銅箔側からみた分解斜視
図、第5図及び第6図は印刷基板と金属片の取付
状態を示す説明図である。 1……印刷基板、3……アースパターン、6…
…金属片、9……透孔、10……電気部品、11
……半田。
FIG. 1 is a perspective view showing a conventional reinforcement structure for a printed circuit board, FIG. 2 is a sectional view taken along the line A-A in FIG.
The same figure is an exploded perspective view of the printed circuit board seen from the copper foil side, and FIGS. 5 and 6 are explanatory diagrams showing the state in which the printed circuit board and the metal piece are attached. 1...Printed circuit board, 3...Earth pattern, 6...
...Metal piece, 9...Through hole, 10...Electrical component, 11
……solder.

Claims (1)

【実用新案登録請求の範囲】 印刷基板の外周縁部にそつた銅箔よりなるアー
スパターンと、 このアースパターンと略直角に配置される半田
付可能な金属片と、 この金属片と前記アースパターンを固着する半
田とからなることを特徴とする印刷基板の補強構
造。
[Claims for Utility Model Registration] A grounding pattern made of copper foil along the outer periphery of a printed circuit board, a solderable metal piece disposed approximately at right angles to the grounding pattern, and this metal piece and the grounding pattern. A reinforcing structure for printed circuit boards, characterized by comprising solder for fixing.
JP1978090010U 1978-06-30 1978-06-30 Expired JPS6141269Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1978090010U JPS6141269Y2 (en) 1978-06-30 1978-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1978090010U JPS6141269Y2 (en) 1978-06-30 1978-06-30

Publications (2)

Publication Number Publication Date
JPS557368U JPS557368U (en) 1980-01-18
JPS6141269Y2 true JPS6141269Y2 (en) 1986-11-25

Family

ID=29017943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1978090010U Expired JPS6141269Y2 (en) 1978-06-30 1978-06-30

Country Status (1)

Country Link
JP (1) JPS6141269Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53107155U (en) * 1977-02-04 1978-08-28

Also Published As

Publication number Publication date
JPS557368U (en) 1980-01-18

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