JP3120655B2 - Method for manufacturing shield frame - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a shielding frame used for forming a circuit module product such as an electronic tuner.

[0002]

2. Description of the Related Art Conventionally, an electronic tuner has been known as an example of a circuit module product. This electronic tuner has a flat surface on which electronic components 20 and the like are soldered on both sides as shown in a simplified form in FIG. A circuit board 21 having a rectangular shape as viewed from the outside, and a shielding frame (hereinafter, referred to as a frame) 22 made of a metal plate that houses the circuit board 21 and is soldered to the circuit board 21. I have. The frame 22 here has a metal plate 23 having a planar shape as shown in FIG. 5, that is, a pair of long sides 24 and short sides 25, and a pair of long sides 24 and short sides 25. After preparing a metal plate 23 having a hollow portion 26 surrounded by a metal plate 25, a long side portion 24 of the metal plate 23 is formed.
And the short side portion 25 is bent in the same direction and is erected in accordance with a manufacturing method. The circuit board 21 receives the required portions of the long side portion 24 and the short side portion 25 at each required position. A protruding piece 27 to be soldered thereon is formed.

[0003]

By the way, when manufacturing the frame 22 having the above-mentioned conventional structure, a thickness of 0.3 mm is required.
It is generally used a metal plate 23 as thin as about mm, so that the hollow portion 26 is formed by pressing (punching) the metal plate 23, or a long side having a small width and a long length. If the bending process is performed to erect the portion 24, deformation such as warpage or twisting would occur. Further, even if no deformation occurs when the frame 22 is manufactured, when the circuit board 21 is housed in the frame 22, the frame 22 may be deformed due to an external force acting when the circuit board is mounted. Was.

The present invention has been made in view of such inconvenience, and it is an object of the present invention to provide a method of manufacturing a frame having a structure capable of extremely easily suppressing deformation of a frame generated at the time of manufacturing or mounting a substrate. It is assumed that.

[0005]

According to the present invention, there is provided a method of housing a circuit board having a rectangular shape in plan view to which required components are soldered, and soldering the circuit board to form a circuit module product. In the manufacturing method, a pair of long sides and short sides, and a long side and short sides disposed in a hollow portion surrounded by these long sides and short sides, or
A step of preparing a metal plate on which a connecting portion connecting the long sides is formed, and a step of erecting only the long side of the metal plate,
A step of removing the other connecting part while leaving only the connecting part connecting the central parts of the long sides, and a step of erecting the short side of the metal plate in the same direction as the long side. It is characterized by including.

[0006]

According to the above method, the bending process for erecting the long sides is performed while the long sides are connected to each other by the connecting portions. Deformation of the entire metal plate including the portion is suppressed. Also, in the frame which has been molded to accommodate the circuit board, a connecting portion for connecting the central portions of the long sides is left, and the deformation of the frame is suppressed by this connecting portion, so that the board is mounted. The deformation of the frame at the time does not occur.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the method of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a schematic structure of an electronic tuner constructed by using a frame manufactured according to the method of the embodiment, and FIG. 2 is a plan view of a metal plate when the frame is manufactured according to the method of the embodiment. Is a simplified plan view, and FIG. 3 is a plan view showing a plan shape of a frame in the process of being manufactured according to the method of the present embodiment.

In the electronic tuner according to this embodiment, conductor patterns (not shown) are formed on both the front and back surfaces as shown in FIG. A circuit board 2 has a rectangular shape in a plan view on which the circuit board 1 is mounted by soldering, and a frame 3 made of a metal plate which houses the circuit board 2 and is soldered to the circuit board 2. The frame 3 is formed into a rectangular frame in a plan view by a pair of the long side portions 4 and the short side portions 5 that are mutually opposed and erected and are connected to each other. The central portions of the long sides 4 are connected to each other via a connecting portion 6 having a narrow width.
The connecting portion 6 only needs to be connected to a substantially central portion of each long side portion 4, and is not limited to the central position in a strict sense.

Further, a plurality of inwardly projecting pieces 7 are formed at required portions of the long side 4 and the short side 5, and the projecting pieces 7 are received by the circuit board 2. The circuit board 2 is soldered by
And the frame 3 are integrated. Also, the connecting portion 6
The protruding pieces 8 are also formed at each of the required locations. These protruding pieces 8 are bent and then soldered to a conductor pattern on the circuit board 2 to serve as a circuit ground. The reason why the opening 6a is formed at the center position of the connecting portion 6 and the opening 6a extends along the short side direction of the frame 3 is that the position of the electronic component 1 is adjusted or soldered. This is because thermal efficiency was considered.

Next, a method of manufacturing the frame 3 according to the present embodiment will be described with reference to FIGS.

First, a metal plate 9 having a planar shape as shown in FIG. 2, that is, a pair of long side portions 4 and short side portions 5 arranged opposite to each other, and these long side portions 4 and short side portions A metal plate 9 is prepared, which is disposed in a hollow portion 10 surrounded by 5 and has a connecting portion 11 for connecting the long side portion 4 and the short side portion 5 to each other. The metal plate 9 has a thickness as small as about 0.3 mm, and protruding pieces 7 to be soldered to the circuit board 2 are formed at required portions of the long side portion 4 and the short side portion 5. ing. The projecting piece 7 here
The hollow part 10, the hollow part 10, the connecting part 11, and the like are formed by performing press working on the metal plate 9.

The connecting portion 11 in FIG. 2 is formed by integrally connecting the long side portion 4 and the short side portion 5 of the metal plate 9. It is not necessary that even the parts 5 are connected to each other, and the connecting part 11 may be any as long as it connects at least the long sides 4. That is, the connecting portion 11 does not need to be connected to each short side portion 5. The long side portions 4 that are likely to be deformed because of their narrow width and long length are connected to each other via the connecting portion 11. If the metal plates 9 are connected to each other, the deformation of the metal plate 9 hardly occurs.

Subsequently, as shown in FIG. 3, only the long side portions 4 of the metal plate 9 having the above-described structure are bent in a predetermined direction (downward in FIG. 2) to stand upright. After leaving only the connecting portion 6 connecting the central portions of the side portions 4, all other connecting portions 11a are removed. That is, since the bending process for erecting each of the long side portions 4 in the metal plate 9 is performed while the long side portions 4 are connected to each other by the connecting portion 11, the long side portions 4 are formed. Metal plate 9 including 4 and short side 5
The entire deformation is unlikely to occur.

Further, after the short side portion 5 of the metal plate 9 having the above-described configuration is bent by bending the short side portion 5 in the same direction as the long side portion 4, each of the short side portions 5 is set up. The edge of each long side portion 4 is connected to the edge. Then, this frame 3 is integrated as itself. After that, soldering work after housing the circuit board 2 in the frame 3 is performed by using a so-called reflow method or the like, so that an electronic tuner composed of the circuit board 2 and the frame 3 is completed. become.

At this time, the connecting portion 6 for connecting the central portions of the long sides 4 is also left in the frame 3 formed so as to house the circuit board 2. As a result, the deformation of the frame 3 when the circuit board 2 is stored does not occur. It is a general work procedure that the electronic component 1 arranged on the circuit board 2 is also mounted along with the soldering work when connecting the circuit board 2 and the frame 3.

In the present embodiment, the electronic tuner is assumed to be a product composed of a circuit board 2 to which required electronic components 1 are soldered and a frame 3 for accommodating the circuit board 2. However, the present invention is not limited to this, and it is needless to say that the present invention can be applied to a general circuit module product having the same configuration.

[0018]

As described above, according to the method of manufacturing a frame according to the present invention, the bending process for erecting the long side portion of the metal plate forming the frame is performed by connecting the long side portions to each other. Therefore, the deformation of the entire metal plate including the long side portion and the short side portion is unlikely to occur and is suppressed.
Also, in the frame that has been molded, the connecting portion connecting the central portions of the long sides is left, and the deformation of the frame is suppressed by this connecting portion, so the circuit board is attached to this frame. No special deformation will occur.

As a result, according to the present invention, it is possible to obtain the effects of improving the workability when attaching the frame to the circuit board and realizing the improvement of the yield and the quality of the completed circuit module product. become.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a schematic structure of an electronic tuner configured using a frame manufactured according to a method of the present embodiment.

FIG. 2 is a simplified plan view showing a planar shape of a metal plate when a frame is manufactured according to the method of the embodiment.

FIG. 3 is a plan view showing a plane shape of a frame being manufactured according to the method of the present embodiment.

FIG. 4 is a perspective view illustrating a schematic structure of an electronic tuner configured using a frame manufactured according to a conventional example method.

FIG. 5 is a simplified plan view showing a planar shape of a metal plate when a frame is manufactured according to a conventional example method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component (required component) 2 Circuit board 3 Frame (shield frame) 4 Long side part 5 Short side part 6 Connection part 9 Metal plate 10 Hollow part 11 Connection part

Continuation of the front page (72) Inventor Kazunori Kinoshita 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Murata Manufacturing Co., Ltd. (56) References JP-A-56-114398 (JP, A) JP-A-5-343878 (JP, A) JP-A-3-104198 (JP, A) JP-A-4-28499 (JP, A) JP-A-61-103627 (JP, A) JP-A-1-176995 (JP, U) 61-88382 (JP, U) JP-A 4-59987 (JP, U) JP-A 61-59396 (JP, U) JP-A 2-15794 (JP, U) (58) Fields surveyed (58) Int.Cl. ⁷ , DB name) H05K 9/00

Claims (2)

(57) [Claims] 1. A method of manufacturing a shielding frame for accommodating a rectangular circuit board in plan view to which required components are soldered and soldering to the circuit board to constitute a circuit module product. A pair of long side portions and short side portions, and a connecting portion arranged in a hollow portion surrounded by the long side portions and the short side portions and interconnecting the long side portions and the short side portions are formed. Preparing a metal plate, and erecting only the long sides of the metal plate; and removing other connection portions while leaving only the connection portions connecting the central portions of the long sides, Erecting the short side of the metal plate in the same direction as the long side of the metal plate. 2. A method for manufacturing a shielding frame for accommodating a rectangular circuit board in plan view to which required components are soldered and soldering to the circuit board to constitute a circuit module product. A metal plate is prepared in which a pair of long sides and short sides and a connecting part arranged in a hollow portion surrounded by the long sides and short sides and connecting the long sides are formed. A step of erecting only the long side of the metal plate; a step of removing the other connected portion while leaving only a connected portion connecting the central portions of the long sides; a short side of the metal plate And erecting the portion in the same direction as the long side of the shield frame.