JPH0786714A - Structure for mounting hybrid ic - Google Patents

Abstract

PURPOSE:To lower the height of a hybrid IC by the size corresponding to U-shaped recessions of lead terminals by a method wherein the U-shaped recessions of the lead terminals inserted into the hybrid IC substrate are inserted into the rectangular shaped groove provided in a master board. CONSTITUTION:A wiring pattern formed on an insulating board and plural lead terminals 2 provided with U-shaped recessions 2a are soldered onto one side of hybrid IC substrate whereon active parts e.g. IC, etc., and passive parts e.g. resistors, etc., are mounted. Next, the lead terminals 2 are formed of a flat plate type metallic board stamped in to a rectangular shape leaving soldering parts 2b in parallel with a master board 3 with the central part thereof bent in U-shaped. At this time, the inner diameter of the recessions 2a is almost equalized with the thickness of the hybrid IC substrate 1 to be inserted into the recessions 2a. Furthermore, the lead terminals 2 are soldered onto the soldering lands 5a formed on the board 1 in the recession 2a to be electrically and mechanically connected to the hybrid IC substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC mounting structure in which a plurality of lead terminals are attached to one side of a hybrid IC substrate.

[0002]

2. Description of the Related Art In recent years, with the progress of miniaturization and thinning of electronic equipment, there has been an increasing demand for a reduction in height in mounting a hybrid IC. Hereinafter, a conventional hybrid IC and a hybrid IC will be described with reference to the drawings.
The main board on which is mounted will be described. In the figure, the same parts are designated by the same reference numerals.

A conventional hybrid IC is shown in FIGS.
As shown in, a wiring pattern is formed on the insulating substrate, and I
A plurality of straight lead terminals 12 are provided on one side of the hybrid IC substrate 11 on which active components such as C and transistors and passive components such as resistors, capacitors and coils are mounted.
It is configured to be attached by soldering. Usually, the lead terminal 12 is the hybrid IC substrate 11
Clip section 12a having a substantially U-shaped cross section for electrically and mechanically connecting, a stopper section 12b at the time of insertion into the parent board below the clip section 12a, and a parent board below the stopper section 12b. It has a straight shape including the insertion portion 12c. In addition, the hybrid I
A hole 14 such as a through hole into which the lead terminal 12 is inserted (hereinafter referred to as a lead terminal insertion hole) is formed in the parent board 13 on which C is mounted.

Then, the hybrid IC is used as a main substrate 1.
6 and 7, the lead terminal 12 of the hybrid IC is inserted into the lead terminal insertion hole 14 of the parent board 13 up to its stopper portion 12b, and the lead terminal is provided on the rear surface of the parent board 13 as shown in FIGS. 12 is soldered with solder 16.

[0005]

However, in the hybrid IC mounting structure in which the hybrid IC of the conventional example is mounted on the parent board, as shown in FIG. 7, the hybrid IC mounted on the parent board is The height h from the surface of the parent board to the top of the hybrid IC board (hereinafter referred to as mounting height) is lower than the height of the hybrid IC board because the clip portion and the stopper portion of the lead terminal are above the surface of the parent board. I couldn't.

Also, the clip portion of the lead terminal is formed by split snap processing, and the vicinity of the top end of the lead terminal is bent at a predetermined angle of 2 to 30. Processing cost was high. Further, after mounting the hybrid IC on the parent board, there is a case where a step of cutting an extra portion under the soldering portion of the lead terminal is required.

Therefore, an object of the present invention is to solve the above problems of the conventional hybrid IC mounting structure, and to reduce the mounting height of the hybrid IC inexpensively and easily. To provide the implementation structure of.

[0008]

In order to achieve the above object, the present invention is a hybrid IC in which a hybrid IC having a plurality of lead terminals attached to one side of a hybrid IC substrate is mounted on a parent substrate. In the mounting structure described above, a part of the lead terminal is formed into a U-shape, and the U-shaped recess for holding the hybrid IC substrate on both sides and end faces thereof and at least the U-shape recess. A mother board protruding in one side and a soldering portion parallel to each other are formed, and a mother board on which the hybrid IC is mounted is formed with a rectangular slit groove into which the U-shaped recess of the lead terminal is inserted. Soldering lands corresponding to the soldering portions of the lead terminals are formed on both sides of the slit groove, and U-shaped recesses of the lead terminals of the hybrid IC are formed on the parent board. Insert the bets groove, it is characterized in that the soldered portion of the lead terminal was soldered to the soldering lands of the parent substrate.

[0009]

According to the above construction, the U-shaped recess of the lead terminal into which the hybrid IC board is inserted is inserted into the rectangular slit groove provided on the parent board, so that the hybrid mounted on the parent board is mounted. The mounting height of the IC is lowered by a dimension corresponding to the U-shaped recess of the lead terminal.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A hybrid IC according to an embodiment of the present invention and a parent board on which the hybrid IC is mounted will be described below with reference to the drawings. In the figure, the same parts are designated by the same reference numerals.

As shown in FIGS. 1 and 2, a hybrid IC according to the present invention has a wiring pattern formed on an insulating substrate and includes active components such as ICs and transistors and passive components such as resistors, capacitors and coils. Hybrid I installed
A plurality of lead terminals 2 provided with U-shaped concave portions 2a are attached to one side of the C substrate 1 by soldering. The lead terminal 2 is obtained by punching a flat metal plate into a rectangular shape, leaving soldering portions 2b parallel to the parent board 3 on both sides in the long side direction, and bending the central portion into a U-shape. The structure has a U-shaped concave portion 2a.

The inner dimension of the U-shaped recess 2a of the lead terminal 2 is approximately equal to the thickness of the hybrid IC substrate 1, and the hybrid IC substrate 1 is placed in the U-shaped recess 2a.
Insert. The lead terminal 2 has a U-shaped recess 2
At a, it is soldered to the soldering land 5a formed on the hybrid IC substrate 1, and is electrically and mechanically connected to the hybrid IC substrate 1.

The parent board 3 on which the hybrid IC constructed as described above is mounted is the lead terminal 2 described above.
Rectangular slit groove 4 into which the U-shaped recess 2a is inserted
To form the lead terminals 2 on both sides of the slit groove 4.
The soldering land 5b corresponding to the soldering portion 2b is formed.

The slit groove 4 can be formed in the process of manufacturing the parent substrate, or can be formed by laser processing after manufacturing the parent substrate.

In the figure, the soldering lands 5a on the hybrid IC board and the soldering lands 5b on the parent board are a part of the wiring pattern formed on the board, and other wiring patterns (not shown in the drawing). ) Formed at the same time.

The hybrid IC of the above embodiment
When surface mounting is carried out on the parent board 3, it is usually mounted by the reflow soldering method. Specifically, as shown in FIG. 3, the solder paste 6 is applied to the soldering land 5b on the parent board 3 to which the soldering portion 2b of the lead terminal 2 is connected, and the solder paste 6 of the lead terminal 2 of the hybrid IC is coated. The V-shaped concave portion 2 a is inserted into the slit groove 4 formed in the parent substrate 3. This temporarily fixes the hybrid IC,
The soldering portion 2b of the lead terminal 2 is installed at the position of the soldering land 5b coated with the solder paste 6.
Next, the parent substrate 3 to which the hybrid IC is temporarily fixed is heated to melt the solder paste 6. In this way, the hybrid IC is soldered to the parent board 3.

Hybrid IC mounted as described above
In the mounting structure of FIG. 3, the U-shaped recess of the lead terminal into which the hybrid IC substrate is inserted is inserted into the rectangular slit groove provided on the parent board as shown in FIG. Mounting height of hybrid IC
Can be lowered by a dimension corresponding to the U-shaped recess of the lead terminal.

Further, in the hybrid IC, the U-shaped concave portion of the lead terminal is inserted and held in the rectangular slit groove provided on the mother board, and is supported by the soldering portion of the lead terminal. It is unlikely that the mounter will cause misalignment or tilt when mounted on the main board.

Further, the soldered portion of the lead terminal has a stable surface contact, and good solderability and sufficient soldering strength can be obtained.

In the lead terminal of the above-mentioned embodiment, the soldering portion which is projected from the U-shaped concave portion and which is parallel to the mother board is
Although it is provided on both sides of the U-shaped recess, it may be a lead terminal formed on only one side as shown in FIG. In this case, the side where the soldering part is provided is the hybrid I
Each lead terminal may be attached so as to be located on both sides of the C substrate.

[0021]

As described above, according to the hybrid IC mounting structure of the present invention, the lead terminal mounting portion of the hybrid IC substrate is inserted and mounted in the rectangular slit groove provided in the parent substrate. Therefore, the mounting height of the hybrid IC mounted on the parent board can be reduced by a dimension corresponding to the U-shaped recess of the lead terminal. Therefore, the mounting height of the hybrid IC can be made lower than that of the hybrid IC substrate, and the mounting can be made even lower than that of the conventional lead terminal insertion type hybrid IC.

Further, in spite of the vertical mounting type of the board, there is no deviation at the time of mounting on the parent board, and the soldered portion of the lead terminal has a stable surface contact, and good solderability can be obtained. Therefore, stable and highly reliable surface mounting can be realized, and defects at the time of mounting can be reduced, so that the mounting cost can be reduced.

Moreover, the lead terminal of the present invention can form the U-shaped concave portion by simple press molding, and the lead terminal manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view of a hybrid IC and a parent board according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of FIG.

FIG. 3 is a cross-sectional view showing a state in which a hybrid IC according to an embodiment of the present invention is mounted on a parent board.

FIG. 4 (a) is a hybrid I of another embodiment of the present invention.
Sectional drawing of C, (b) is a top view except the mounted components of (a).

FIG. 5 is a perspective view of a conventional hybrid IC and a parent board.

6 is a cross-sectional view of FIG.

FIG. 7 is a cross-sectional view showing a state in which a conventional hybrid IC is mounted on a parent board.

[Explanation of symbols]

 1 Hybrid IC board 2 Lead terminal 2a U-shaped recess 2b Soldering part 3 Parent board 4 Slit groove 5b Soldering land 6 Solder paste

Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01R 9/09 C 6901-5E

Claims (1)

[Claims] 1. A hybrid IC mounting structure in which a hybrid IC having a plurality of lead terminals attached to one side of a hybrid IC board is mounted on a parent board. And forming a U-shaped recess for holding the hybrid IC substrate on both sides and end faces thereof, and a soldering part parallel to the parent substrate protruding at least on one side of the U-shaped recess. A rectangular slit groove into which the U-shaped recess of the lead terminal is inserted is formed on the parent board on which the hybrid IC is mounted, and the slit portions corresponding to the lead terminal soldering portions are formed on both sides of the slit groove. A soldering land is formed, the U-shaped recess of the lead terminal of the hybrid IC is inserted into the slit groove of the parent board, and the soldering portion of the lead terminal is A hybrid IC mounting structure characterized by being soldered to a soldering land of a parent board.