JP3148554B2 - High frequency tuner - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency tuner, and more particularly to a chassis structure for obtaining an electromagnetic wave shielding effect by uniform contact by combining a chassis case and a ground plate.

[0002]

2. Description of the Related Art FIG. 3 is a perspective view for explaining the structure of a general high frequency tuner. (A) is a built-in configuration diagram on the front side, and (b) is a built-in configuration diagram on the back side. The high-frequency tuner is, for example, a high-frequency CATV tuner.
A front-side ground plate 3 that covers and shields the front side of the chassis housing 1; a front-side shield lid 4 that covers the front-side ground plate 3 and the front surface of the chassis 1; This structure has a backside ground plate 5 that covers and shields the backside of the chassis 1 and a backside shield lid 6 that covers the backside ground plate 5 and the backside of the chassis 1.

[0003] The earth plates 3, 5 and the shield lids 4, 6
Are fixed integrally to the chassis 1 by caulking the claws 7 of the chassis 1 after inserting the holes provided therein.

[0004] The chassis 1 has a flattened portion 8 on the front side thereof, which is in contact with the ground plate 3, and a flat portion 8a on the back side, which is in contact with the ground plate 5 and is formed by an end surface of the chassis. Become.

In order to enhance the contact between the chassis 1 and the earth plates 3 and 5 in the high-frequency tuner, ie, to enhance the electromagnetic wave shielding effect, solder plating of the chassis 1 by solder dip or solder reflow is required. ing. For this reason, the front side and the back side of the chassis 1 are plated with solder.

[0006] The solder dip is a method in which a soldering portion of a soldering member is directed downward, and the soldering portion is immersed in a molten solder bath or a surface of which is contacted with a jet solder to perform soldering. . In addition, the solder reflow,
In this method, solder is supplied to a soldering portion in advance, and the solder is melted by a heat source such as infrared rays, hot air, or a laser to perform soldering.

The state of solder plating of the chassis case in the conventional high frequency tuner and the electromagnetic wave shielding effect due to this will be described below with reference to FIGS. FIG. 4 is an enlarged side view of a main part of a conventional high frequency tuner. FIG.
FIG. 5 is an enlarged perspective view of a main part on the front side of a chassis case used for the high-frequency tuner shown in FIG. 4. FIG. 5 is a detailed enlarged side view of a main part showing a finished state of solder plating after a conventional solder dip and a state of contact with a ground plate.

Here, a method of solder-plating the chassis housing by solder dip will be described.

As shown in FIG. 5, the conventional high frequency tuner includes a folded flat portion 8 of the chassis 1 on the front side of the chassis 1 and a flat portion 8a having an end surface on the back side. The surfaces of the flat portions 8 and 8a have no irregularities.

As a result, for example, when solder plating is performed on the folded flat portion 8 by solder dip, as shown in FIG. There is a problem that the dispersion is large, for example, the shape of the surface is irregular, and the contact with the front-side ground plate 3 is not stable. As shown in the figure, if a solder-plated portion occurs, a slight gap is generated between the solder plating 9 and the front-side ground plate 3.
The electromagnetic wave shielding effect will be reduced.

Further, the flat portion 8a also has a solder-plated portion in the same manner, which may reduce the electromagnetic wave shielding effect.

For this reason, the circuit board 2 is incorporated into the chassis 1 and after solder dipping, the ground plates 3 and 5 and the shield lids 4 and 6 are mounted on the front and back surfaces in this order, and the claws 7 of the chassis 1 are caulked. Although the chassis casing 1 and the earth plates 3 and 5 are brought into contact with each other via the solder plating 9 to enhance the electromagnetic wave shielding effect, uniform contact between the chassis casing 1 and the earth plate 3 is obtained. Therefore, the solder plating 9 adhered to the flat portions 8 and 8a of the chassis 1 with a soldering iron or the like has been subjected to the solder correction, that is, the removal of the glazing portion.

Also, in the solder plating method by solder reflow, the thickness of the solder plating adhered to the surfaces of the flat portions 8 and 8a varies, and it is necessary to correct the solder in the solder plating.

[0014]

As described above, in the structure of the conventional chassis 1, after the solder plating 9 by solder dip, solder reflow or the like, the adhesion state of the solder plating 9 is inspected, and then the solder plating is performed. In the case where thickness variation such as a flicker occurs on the surface of No. 9, an operation of correcting it with a soldering iron or the like was indispensable. These operations have caused variations in product quality due to the state of solder plating, an increase in manufacturing processes, and an increase in product cost.

In view of the above problems, the present invention provides a chassis housing structure that does not require correction with a soldering iron and that can easily obtain flatness accuracy by solder plating of a folded flat portion, thereby improving product quality and manufacturing processes. It is an object of the present invention to provide a high-frequency tuner capable of simplifying and reducing costs.

[0016]

According to a first aspect of the present invention, there is provided a high-frequency tuner according to the first aspect of the present invention, a chassis having a folded flat portion on one surface, a circuit board incorporated in the chassis, and the chassis. A high-frequency tuner having a ground plate for shielding the front and back surfaces of the body and a solder plating formed on the surface of the flat portion with a solder dip and connecting the flat portion and the ground plate ; Bending
A through hole is provided at the end of the shaft .

[0017]

Further, a high-frequency tuner according to a second aspect of the present invention is characterized in that the plurality of through holes are uniformly provided.

[0019]

[0020]

According to the above construction, the high frequency tuner according to the first aspect of the present invention is characterized in that the through-hole is bent at the folded flat portion.
Since the side end portion is provided, of the solder plating that adheres to the folded flat portion in the solder dip, excess solder plating is sucked up by the through hole by the surface tension and flows into the folded flat portion back side, As a result, the thickness of the solder on the surface of the folded flat portion is made uniform, the flatness is maintained, the contact with the ground plate is stabilized, and the inspection and correction of the adhesion state of the conventional solder plating is unnecessary, and the product quality is reduced. Improvement, simplification of the manufacturing process, and cost reduction can be achieved, and a high-frequency tuner having a high electromagnetic wave shielding effect can be obtained.

[0021]

Further, the high-frequency tuner according to the second aspect of the present invention is a high-frequency tuner having a structure in which a plurality of the through holes are provided uniformly, so that a higher flatness accuracy can be obtained and a higher electromagnetic wave shielding effect can be obtained. Obtainable.

[0023]

[0024]

FIG. 1 is an enlarged side view of a main part of a high-frequency tuner according to an embodiment of the present invention. FIG. 2 is an enlarged perspective view of a main part of a chassis case used in the high-frequency tuner shown in FIG. FIGS. 3A and 3B are perspective views for explaining the configuration of a general high-frequency tuner. FIG. 3A is an assembled configuration diagram on the front side, and FIG. 3B is an assembled configuration diagram on the back side.

The high frequency tuner is, for example, a high frequency CA.
It is a TV tuner, basically as shown in FIG.
Chassis housing 1, circuit board 2 incorporated in chassis housing 1, front ground plate 3 covering and shielding the front surface of chassis housing 1, front ground plate 3 and surface of chassis housing 1 A front-side shield cover 4 that covers the rear side, a back-side ground plate 5 that covers and shields the back side of the chassis 1, and a back-side shield cover 6 that covers the back side ground plate 5 and the back side of the chassis 1. It is a structure consisting of

The earth plates 3, 5 and the shield lids 4, 6
Are integrally fixed to the chassis 1 by caulking the claws 7 of the chassis 1 through the holes provided therein. The chassis case 1 includes:
On the front surface side, a folded flat portion 8 that contacts the ground plate 3 and a flat portion 8a that comes into contact with the ground plate 3 and that is formed by an end surface of the chassis housing are provided. A flat portion 8a,
Solder plating 9 is applied to the front and back sides of the chassis 1 including the flat portions 8 and 8a by solder dip in order to enhance the contact with the ground plates 3 and 5 and to enhance the electromagnetic wave shielding effect. .

The high-frequency tuner of this embodiment has a plurality of notched through-holes 10 uniformly provided at the bent side end of the flat portion 8 in the basic structure described above, as shown in FIGS. Structure. The notch through hole 10 is formed by, for example, die cutting or the like, and has a size of 1 mm square.

When a solder dip is performed on the flat portion 8 provided with such a notched through hole 10, first, the folded flat portion 8 is formed.
Solder plating solution adheres to the whole area. Naturally, most of the excess solder plating solution falls, but a part of the excess solder plating solution remains on the surface of the folded flat portion 8. However, the excess solder plating liquid remaining on the surface of the folded flat portion 8 is sucked up by the notch through-hole 10 due to the surface tension thereof, and the excess solder plating solution is removed.
And the flatness accuracy of the surface of the folded flat portion 8 is maintained.

Therefore, after assembling with the ground plates 3 and 5 and the shield plates 4 and 6, the contact between the folded flat portion 8 and the ground plate 3 is tightly contacted. This eliminates the need for the inspection and repair steps after solder dip, which were indispensable in the past, thereby improving the product quality, simplifying the manufacturing process and reducing the cost, and obtaining a high-frequency tuner having a high shielding effect. .

Further, on the front side or the back side of the chassis 1, the ground plate 3 is formed of an end face of the chassis.
By providing a concave portion such as a notch in the flat portion 8a in contact with 5, the flatness of the flat portion 8a is maintained, and the inspection and repair steps after solder dip are not required, thereby improving the product quality and simplifying the manufacturing process. It is possible to obtain a high-frequency tuner having a high shielding effect while reducing the cost and cost.

In the above embodiment, the folded flat portion 8
Although a plurality of notched through holes 10 are provided in this embodiment, the present invention is not limited to this, and any structure may be used as long as a through hole is provided in the folded flat portion 8.

A concave portion may be provided in place of the cut-out through hole 10, but in this case, a size is required to allow all the excess solder plating solution to be sucked up. Further, if the opening of the recess is only the surface to which the solder plating liquid is applied, the air in the recess is confined. Therefore, an air vent hole or the like is separately provided as necessary. In addition, by forming the recess as a notch and providing it at the end of the folded flat portion 8, an air vent hole can be eliminated.

As described above, the high-frequency tuner of the above embodiment has a configuration in which the through-hole 10 is provided in the folded flat portion 8, and therefore, among the solder plating 9 adhered to the folded flat portion 8 by a solder dip, an extra part is used. The solder plating is sucked up by the through hole 10 due to the surface tension thereof, and is turned back.
It flows into the back surface side, whereby the thickness of the solder on the surface of the folded flat portion 8 is made uniform, the flatness is maintained, the contact with the ground plate 3 is stabilized, and the inspection and correction of the adhesion state of the conventional solder plating can be performed. Since it is unnecessary, the quality of the product can be improved, the manufacturing process can be simplified, the cost can be reduced, and a high-frequency tuner having a high electromagnetic wave shielding effect can be obtained.

Further, by providing recesses in the flat portions 8, 8a, the flatness of the flat portions 8, 8a is maintained within a range in which an excess amount of the solder plating solution can be sucked into the recesses. 5 stabilizes, and as above, it is not necessary to inspect and correct the adhesion state of the conventional solder plating, thereby improving the product quality, simplifying the manufacturing process and reducing the cost, and achieving a high electromagnetic wave shielding effect. High-frequency tuner having the same.

Further, by providing a plurality of the notched through holes 10 or the concave portions uniformly, a higher flatness accuracy can be obtained and a high frequency tuner having a higher electromagnetic wave shielding effect can be obtained.

In addition, by forming the concave portion with a notch, when excess solder plating solution is sucked into the notch, the air in the notch is discharged from the side surface of the folded flat portion 8, and the air is separately vented. A high frequency tuner having a stable and high electromagnetic wave shielding effect can be obtained without providing holes or the like.

In the above embodiment, the solder plating by the solder dip has been described. However, it is needless to say that the variation of the solder plating caused by the solder reflow can be eliminated by the above configuration.

[0038]

As described above, according to the first aspect of the present invention,
According to the described high-frequency tuner, the folded flat portion is folded.
Since the through hole is provided at the bent side end , the excess solder plating of the solder plating adhered to the flat portion turned back by solder dipping is sucked up by the through hole by the surface tension and the back surface of the flat portion. This makes the thickness of the solder on the surface of the folded flat portion uniform, maintains flatness accuracy, stabilizes the contact with the ground plate, and eliminates the conventional inspection and correction of the adhesion state of the solder plating. It is possible to improve the product quality, simplify the manufacturing process and reduce the cost, and obtain a high-frequency tuner having a high electromagnetic wave shielding effect.

[0039]

Further, according to the high frequency tuner of the second aspect of the present invention, since the through holes are uniformly provided in plural, higher flatness accuracy can be obtained and a higher electromagnetic wave shielding effect can be obtained. A tuner is obtained.

[0041]

[Brief description of the drawings]

FIG. 1 is an enlarged side view of a main part of a high-frequency tuner according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a main part of a chassis case used for the high-frequency tuner shown in FIG.

FIGS. 3A and 3B are perspective views for explaining the configuration of a general high-frequency tuner, wherein FIG. 3A is a built-in configuration diagram on the front side, and FIG.

FIG. 4 is an enlarged side view of a main part of a conventional high frequency tuner.

FIG. 5 is an enlarged perspective view of a main part of a chassis case used in a conventional high-frequency tuner.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chassis housing 2 Circuit board 3 Front ground plate 4 Front shield cover 5 Back ground plate 6 Back shield cover 8, 8a Flat part 9 Solder plating 10 Notch through hole

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H03J 1/00 H04B 1/08 H05K 9/00

Claims (2)

(57) [Claims] 1. A chassis having a folded flat portion on one surface, a circuit board incorporated in the chassis, an earth plate for shielding the front and back surfaces of the chassis, and a solder on a surface of the flat portion. A high-frequency tuner formed by dip and having solder plating for connecting the flat portion and the ground plate, wherein a through hole is provided at a bent side end of the flat portion. Tuner. 2. A high-frequency tuner of claim 1 Symbol mounting, characterized by comprising a plurality uniformly the through hole.