JP3715487B2 - Circuit board and crystal oscillator using the same - Google Patents

Circuit board and crystal oscillator using the same Download PDF

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Publication number
JP3715487B2
JP3715487B2 JP33118499A JP33118499A JP3715487B2 JP 3715487 B2 JP3715487 B2 JP 3715487B2 JP 33118499 A JP33118499 A JP 33118499A JP 33118499 A JP33118499 A JP 33118499A JP 3715487 B2 JP3715487 B2 JP 3715487B2
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JP
Japan
Prior art keywords
circuit board
terminal electrode
substrate
board
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33118499A
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Japanese (ja)
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JP2001148613A (en
Inventor
学 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Priority to JP33118499A priority Critical patent/JP3715487B2/en
Publication of JP2001148613A publication Critical patent/JP2001148613A/en
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Publication of JP3715487B2 publication Critical patent/JP3715487B2/en
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Description

【0001】
【発明の属する技術分野】
本発明は複数個が形成されてシート基板から分割される回路基板を産業上の技術分野とし、特にシート基板を分割する際に端子電極の剥離を防止した水晶発振器用の回路基板に関する。
【0002】
【従来の技術】
(発明の背景)水晶発振器は、周波数及び時間の基準源として通信機器を含む各種の電子機器に広く用いられている。近年では、携帯機器を始めとして小型化が浸透し、水晶発振器も更なる縮小化が促進されている。これに伴い、水晶振動子及び他の回路素子を搭載する回路基板の有効利用が求められている。
【0003】
(従来技術の一例)第3図は一従来例を説明する水晶発振器特に回路基板の図である。
回路基板1は例えばガラスエポキシ材からなり、概ね、シート基板2に一括して同一の電極パターン(未図示)を形成した後、個々に分割される。例えば、シート基板2における複数個の回路基板領域(回路基板1となる領域、基板領域とする)毎に端子電極3(ab)を含む電極パターンを形成する。端子電極3(ab)は、電子部品例えばコンデンサ4の端子5(ab)と半田6によって電気的に接続する。
【0004】
そして、打抜き(プレス加工)によって、基板領域の外周となる4辺に分割溝7を、四角部に橋絡部8を形成する。さらに、この例では、各回路基板1の例えば電源やアースを共通接続して、シート基板2の一端部に設けた測定端子9と接続する電極ライン10を形成する。なお、図中の斜線部がシート基板2の実部であり、黒点部は電極である。
【0005】
次に、シート基板2に発振回路を構成する水晶振動子等の各電子部品を搭載した後(未図示)、各基板領域毎に発振周波数等を測定端子に接続した測定機器によって調整する。そして、図示しないカバーを被せた後、各基板領域(回路基板1)の橋絡部8を切断して個々の水晶発振器を得ていた。
【0006】
【発明が解決しようとする課題】
(従来技術の問題点)しかしながら、上記構成の回路基板1では、板面面積を有効に利用することから、一方の端子電極3aを回路基板1の外周に極力接近させる。このため、打抜きによる分割溝7の形成時に回路基板1の外周部が振動したり歪曲して、端子電極3aと基板本体の接合境界部に応力が集中し、端子電極3aを剥離させる問題があった。
【0007】
また、この例では、測定端子9によって一括的に調整を行うので、各回路基板1の橋絡部8に電極ライン10を形成する。そして、橋絡部8は、最終的に切断されるので極力幅を狭くする。したがって、この場合でも、前述同様に、電極ライン10を剥離させる問題があった。
【0008】
(発明の目的)本発明は、電極剥離を防止して小型化を促進する回路基板及びこれを用いた水晶発振器を提供することを目的とする。
【0009】
【課題を解決するための手段】
本発明は、回路基板となる基板領域から基板本体に端子電極を突出して形成し、端子電極上から基板本体を一体的に切断し、回路基板の外周端に端子電極を延出したことを基本的な解決手段とする。以下、本発明の一実施例を説明する。
【0010】
【作用】
本発明では、基板領域から基板本体に端子電極を突出して、端子電極上から基板本体を一体的に切断するので、端子電極と基板本体とは外周部において接合境界部が消失して同一端面となる。したがって、外周端の接合面に発生する応力を抑制する。また、端子電極を回路基板の外周端に延出するので、板面面積を有効に活用できる。以下、本発明の一実施例を説明する。
【0011】
【実施例】
第1図は本発明の一実施例を説明する水晶発振器特に回路基板の図である。なお、前従来例図と同一部分には同番号を付与してその説明は簡略又は省略する。回路基板1は、前述したようにシート基板2に一括して電極パターンを形成し、分割溝7を形成して橋絡部8によって基板本体に接続する。そして、この実施例では、シート基板2における基板領域11の外周から端子電極3aを基板本体に突出して形成する(第2図)。また、橋絡部8の電極ライン10を、切断後の橋絡部8の幅以上として基板本体に形成する(同第2図)。
【0012】
そして、基板領域11の点線枠で示す外周を打抜き、分割溝7及び橋絡部8を形成する。その後、発振回路を構成する回路部品を搭載して調整及びカバーを被せた後、シート基板2を個々の回路基板1に分割して複数の水晶発振器を得る。
【0013】
このような構成であれば、シート基板2の基板領域11から基板本体に端子電極3aを突出して形成する。そして、端子電極3a上から基板本体を一体的に切断する。したがって、端子電極3aと基板本体とは外周部において、接合境界部が消失して同一端面となる。このことから、外周端の接合面に発生する応力を抑制し、電極剥離を防止する。
【0014】
また、端子電極3aを回路基板1の外周端に延出するので、板面面積を有効に活用できて小型化を促進する。また、この実施例では、橋絡部8の電極ライン10を橋絡部8の幅より大きくして切断するので、この場合にも前述同様に電極剥離を防止する。
【0015】
【他の事項】
上記実施例では、端子電極3(ab)の一方3aのみを回路基板1の外周端に延出したが、端子電極3(ab)を回路基板の外周に直交させて形成する場合でも、同様に適用できる。また、水晶発振器用の回路基板として説明したが、電子部品を搭載する回路基板にも適用できる。
【0016】
また、シート基板2には周波数調整等の測定端子9を設けて橋絡部8に電極ライン10を形成したが、測定端子9及び電極ライン10がなく、シート基板2に電極パターンを形成して分割する場合でも、また電子部品を搭載した後に分割する場合でも適用できる。要するに、シート基板2における基板領域の外周に分割溝7を形成して、その後個々の回路基板1に分割する場合に適用できる。
【0017】
【発明の効果】
本発明は、回路基板となる基板領域から基板本体に端子電極を突出して形成し、端子電極上から基板本体を一体的に切断し、回路基板の外周端に端子電極を延出したので、電極剥離を防止して小型化を促進する回路基板及びこれを用いた水晶発振器を提供できる。
【図面の簡単な説明】
【図1】本発明の一実施例を説明する分割溝の形成後におけるシート基板の一部拡大の平面図である。
【図2】本発明の一実施例を説明する分割溝の形成前におけるシート基板の一部拡大の平面図である。
【図3】従来例を説明する分割溝の形成後におけるシート基板の一部拡大の平面図である。
【図4】従来例を説明する端子電極に電子部品を接続した断面図である。
【符号の説明】
1 回路基板、2 シート基板、3 電極端子、4 コンデンサ、5 端子、6 半田、7 分割溝、8 橋絡部、9 測定端子、10 電極ライン、11 基板領域.
[0001]
BACKGROUND OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board for a crystal oscillator in which a plurality of circuit boards that are formed and divided from a sheet substrate are used as industrial technical fields, and in particular, a terminal electrode is prevented from being peeled when the sheet substrate is divided.
[0002]
[Prior art]
BACKGROUND OF THE INVENTION Crystal oscillators are widely used in various electronic devices including communication devices as a frequency and time reference source. In recent years, downsizing of portable devices and the like has spread, and further downsizing of crystal oscillators has been promoted. Accordingly, effective utilization of a circuit board on which a crystal resonator and other circuit elements are mounted is required.
[0003]
(Example of Prior Art) FIG. 3 is a diagram showing a crystal oscillator, particularly a circuit board, for explaining one conventional example.
The circuit board 1 is made of, for example, a glass epoxy material, and is generally divided into individual parts after forming the same electrode pattern (not shown) on the sheet substrate 2 at once. For example, an electrode pattern including the terminal electrode 3 (ab) is formed for each of a plurality of circuit board regions (a region to be the circuit substrate 1 and a substrate region) in the sheet substrate 2. The terminal electrode 3 (ab) is electrically connected to the electronic component, for example, the terminal 5 (ab) of the capacitor 4 by the solder 6.
[0004]
Then, by dividing (pressing), the dividing grooves 7 are formed on the four sides forming the outer periphery of the substrate region, and the bridging portions 8 are formed on the square portions. Furthermore, in this example, for example, a power source or a ground of each circuit board 1 is commonly connected to form an electrode line 10 connected to a measurement terminal 9 provided at one end of the sheet substrate 2. In addition, the shaded part in the figure is the real part of the sheet substrate 2, and the black dot part is the electrode.
[0005]
Next, after mounting each electronic component such as a crystal resonator constituting the oscillation circuit on the sheet substrate 2 (not shown), the oscillation frequency or the like is adjusted for each substrate region by a measuring device connected to a measurement terminal. Then, after covering with a cover (not shown), the bridge portions 8 of each substrate region (circuit substrate 1) were cut to obtain individual crystal oscillators.
[0006]
[Problems to be solved by the invention]
(Problem of the prior art) However, in the circuit board 1 having the above configuration, one of the terminal electrodes 3a is brought as close as possible to the outer periphery of the circuit board 1 because the board surface area is effectively used. For this reason, there is a problem that the outer peripheral portion of the circuit board 1 vibrates or is distorted when the dividing groove 7 is formed by punching, stress is concentrated on the junction boundary between the terminal electrode 3a and the substrate body, and the terminal electrode 3a is peeled off. It was.
[0007]
Further, in this example, since adjustment is performed collectively by the measurement terminals 9, the electrode lines 10 are formed in the bridging portions 8 of the respective circuit boards 1. And since the bridge part 8 is finally cut | disconnected, a width | variety is narrowed as much as possible. Therefore, even in this case, there is a problem of peeling off the electrode line 10 as described above.
[0008]
(Object of the invention) An object of the present invention is to provide a circuit board which prevents electrode peeling and promotes miniaturization, and a crystal oscillator using the circuit board.
[0009]
[Means for Solving the Problems]
The present invention is based on the fact that the terminal electrode protrudes from the substrate region to be the circuit board and is formed on the board body, the board body is integrally cut from the terminal electrode, and the terminal electrode is extended to the outer peripheral edge of the circuit board. Solution. An embodiment of the present invention will be described below.
[0010]
[Action]
In the present invention, since the terminal electrode protrudes from the substrate region to the substrate body and the substrate body is integrally cut from above the terminal electrode, the junction boundary portion disappears at the outer peripheral portion of the terminal electrode and the substrate body, and the same end surface Become. Therefore, the stress generated on the joint surface at the outer peripheral end is suppressed. Further, since the terminal electrode extends to the outer peripheral edge of the circuit board, the plate surface area can be effectively utilized. An embodiment of the present invention will be described below.
[0011]
【Example】
FIG. 1 is a diagram of a crystal oscillator, particularly a circuit board, illustrating an embodiment of the present invention. In addition, the same number is attached | subjected to the part same as a prior art example figure, and the description is simplified or abbreviate | omitted. As described above, the circuit board 1 collectively forms an electrode pattern on the sheet substrate 2, forms the dividing groove 7, and is connected to the substrate body by the bridging portion 8. In this embodiment, the terminal electrode 3a is formed so as to protrude from the outer periphery of the substrate region 11 in the sheet substrate 2 (FIG. 2). Further, the electrode line 10 of the bridging portion 8 is formed on the substrate body with a width equal to or larger than the width of the bridging portion 8 after cutting (FIG. 2).
[0012]
And the outer periphery shown with the dotted-line frame of the board | substrate area | region 11 is punched, and the division | segmentation groove | channel 7 and the bridge part 8 are formed. Thereafter, circuit components constituting the oscillation circuit are mounted, adjusted and covered, and then the sheet substrate 2 is divided into individual circuit substrates 1 to obtain a plurality of crystal oscillators.
[0013]
With such a configuration, the terminal electrode 3 a is formed to protrude from the substrate region 11 of the sheet substrate 2 to the substrate body. Then, the substrate body is integrally cut from the terminal electrode 3a. Therefore, the terminal boundary 3a and the substrate body have the same end surface with the joining boundary portion disappearing at the outer peripheral portion. From this, the stress which generate | occur | produces in the joint surface of an outer peripheral end is suppressed, and electrode peeling is prevented.
[0014]
Further, since the terminal electrode 3a extends to the outer peripheral end of the circuit board 1, the plate surface area can be effectively utilized and the miniaturization is promoted. In this embodiment, since the electrode line 10 of the bridging portion 8 is cut larger than the width of the bridging portion 8, electrode peeling is prevented in this case as well.
[0015]
[Other matters]
In the above embodiment, only one of the terminal electrodes 3 (ab) 3a is extended to the outer peripheral edge of the circuit board 1. However, even when the terminal electrode 3 (ab) is formed orthogonally to the outer periphery of the circuit board, the same applies. Applicable. Moreover, although it demonstrated as a circuit board for crystal oscillators, it is applicable also to the circuit board which mounts an electronic component.
[0016]
The sheet substrate 2 is provided with a measurement terminal 9 for frequency adjustment and the like, and the electrode line 10 is formed in the bridging portion 8, but the measurement terminal 9 and the electrode line 10 are not provided, and an electrode pattern is formed on the sheet substrate 2. The present invention can be applied to the case of dividing, or the case of dividing after mounting electronic parts. In short, the present invention can be applied to the case where the dividing groove 7 is formed on the outer periphery of the substrate region in the sheet substrate 2 and then divided into individual circuit substrates 1.
[0017]
【The invention's effect】
In the present invention, the terminal electrode is formed so as to protrude from the substrate region serving as the circuit board to the board body, the board body is integrally cut from the terminal electrode, and the terminal electrode is extended to the outer peripheral end of the circuit board. A circuit board which prevents peeling and promotes miniaturization and a crystal oscillator using the circuit board can be provided.
[Brief description of the drawings]
FIG. 1 is a partially enlarged plan view of a sheet substrate after formation of dividing grooves for explaining an embodiment of the present invention.
FIG. 2 is a partially enlarged plan view of a sheet substrate before the formation of a dividing groove for explaining an embodiment of the present invention.
FIG. 3 is a partially enlarged plan view of a sheet substrate after formation of divided grooves for explaining a conventional example.
FIG. 4 is a sectional view in which an electronic component is connected to a terminal electrode for explaining a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board, 2 Sheet board | substrate, 3 Electrode terminal, 4 Capacitor, 5 terminal, 6 Solder, 7 Dividing groove, 8 Bridge part, 9 Measurement terminal, 10 Electrode line, 11 Board | substrate area | region.

Claims (2)

電子部品と電気的に接続する端子電極を有して、複数個の回路基板領域が分割溝によって基板本体から分離されるとともに橋絡部によって基板本体に連結し、前記橋絡部を切断して分割される回路基板において、前記端子電極を前記回路基板領域から基板本体に突出して形成し、前記端子電極上から前記基板本体を一体的に切断して前記分割溝を形成し、前記端子電極を外周端に延出したことを特徴とする回路基板。A terminal electrode electrically connected to the electronic component, wherein a plurality of circuit board regions are separated from the board main body by dividing grooves and connected to the board main body by a bridge part, and the bridge part is cut; In the circuit board to be divided, the terminal electrode is formed to project from the circuit board region to the board body, the board body is integrally cut from above the terminal electrode to form the dividing groove, and the terminal electrode is formed. A circuit board characterized by extending to an outer peripheral end. 請求項1の回路基板上に水晶振動子及び発振回路素子を搭載してなる水晶発振器。A crystal oscillator comprising a crystal resonator and an oscillation circuit element mounted on the circuit board according to claim 1.
JP33118499A 1999-11-22 1999-11-22 Circuit board and crystal oscillator using the same Expired - Fee Related JP3715487B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33118499A JP3715487B2 (en) 1999-11-22 1999-11-22 Circuit board and crystal oscillator using the same

Publications (2)

Publication Number Publication Date
JP2001148613A JP2001148613A (en) 2001-05-29
JP3715487B2 true JP3715487B2 (en) 2005-11-09

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2394365B (en) * 2002-10-19 2005-08-17 Motorola Inc Circuit board constructions
JP5022576B2 (en) * 2005-07-08 2012-09-12 株式会社ジャパンディスプレイイースト Display panel and display device
JP2009205274A (en) 2008-02-26 2009-09-10 Brother Ind Ltd Printing device

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