JPH11330765A - Surface-mounting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the tip of a cut/lift part formed by cutting and lifting up a part of the cover of a module board to be surely soldered. SOLUTION: A surface-mounting module is composed of a board 10 and a metal cover 9 mounted so as to cover the board 10, a part of the cover 9 is cut off and lifted up towards the board 10 to serve as a cut/lift part 11, and the tip part 12 of the cut/lift part 11 is inserted into a through-hole 16 provided to the board 10 and then soldered, wherein the tip 13 of the cut/lift part 11 is located within the thickness of the board 10. By this setup, a cut/lift part of a cover can be surely soldered to a board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount module, and more particularly, to a cover structure thereof.

[0002]

2. Description of the Related Art Conventional surface mount modules are shown in FIGS.
This is the configuration shown in FIG. FIG. 2 is an external perspective view of the module, and FIG. 3 is a sectional view of the module. Below, according to the drawing,
A conventional surface mount module will be described. FIG.
2A shows a perspective view of the surface of the module, and FIG.
Shows a perspective view of the back surface of the module. Reference numeral 2 denotes a resin-based printed circuit board (hereinafter, referred to as a board) on the surface of which a high-frequency circuit used for the module is formed. Electronic components constituting an electric circuit are mounted on the surface of the substrate 2 of the module, and a metal cover 1 for electromagnetic shielding is attached. Reference numeral 3 denotes a cut-out from the cover for stabilizing high-frequency characteristics.

FIG. 3 is a cross-sectional view of a conventional surface mount module. As shown in FIG. 3A, a cutout 4 is formed from a cover 1 toward a substrate 2. The tip 5 of the cut-and-raised portion 4 needs to be shorter than the tip 6 by the dimension A so that the tip 6 at the periphery of the cover 1 is in close contact with the substrate 2.

[0004]

However, in such a conventional configuration, the electronic components 8 constituting the electric circuit of the module are changed due to the difference in the density of the patterns on the front and back of the substrate 2.
During the reflow soldering at the time of mounting and the reflow soldering of the cover 1, the substrate 2 is warped. In the conventional example, since a large ground pattern for electromagnetic shielding is formed on the back surface of the module substrate 2 in FIG.
The substrate warps in a concave shape as shown in FIG. Due to this warpage, a gap is formed between the cut-and-raised tip 5 and the land 7 on the substrate 2 at the time of reflow soldering of the cover 1, and becomes a dimension B obtained by adding the dimension A and the warpage amount from the designed gap dimension A In some cases, the module in which the tip 5 of the cut-and-raised portion 4 and the land 7 of the substrate 2 are not soldered may occur.

An object of the present invention is to provide a surface mount module having a structure for solving the above-mentioned problem and for securely soldering a tip of a cut-and-raised portion formed from a module substrate and a cover. Things.

[0006]

According to the present invention, there is provided a surface mount module comprising a substrate on which electronic components are mounted and a cover attached so as to cover the substrate. Cut and raised on the substrate side, and have a structure in which the tip of the cut and raised is inserted into a hole provided in the substrate and soldered, and the tip of the cut and raised is within the thickness of the substrate. It is.

As a result, the tip of the cut-and-raised cover is securely soldered to the substrate.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a surface mount module comprising a board on which electronic components are mounted and a cover attached so as to cover the board, wherein a part of the cover is provided. Has a structure in which the tip of the cut and raised is inserted into a hole provided in the substrate and soldered, and the tip of the cut and raised is within the thickness of the substrate. This is a module, so even if the module substrate warps at the time of reflow soldering of the cover, the gap between the surface of the substrate and the edge of the cut-and-raised portion will not occur because the tip of the cut-and-raised portion is in the hole. In addition, the cut-and-raised and the board can be securely soldered.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view of a module according to an embodiment of the present invention. Reference numeral 10 denotes a board constituting the module, on the surface of which are mounted electronic components 8 constituting an electric circuit of the module. 9 is a cover made of metal for electromagnetically shielding the substrate 10 and capable of being soldered. In this cover, cut-and-raised portions 11 are formed from the top surface of the cover toward the substrate 10 for the purpose of stabilizing high-frequency characteristics.
0 is inserted into a through-hole 16 provided in the hole. The tip 13 of the cut-and-raised portion 11 is set so as to be within the thickness of the substrate 10, and in this embodiment, is set so as to be located on the back surface 10 a side of half the thickness of the substrate 10. Before mounting the cover 9 on the substrate 10, the cream solder 15 is placed on a land 14 around a through hole 16 provided on the surface of the substrate 10.
Is applied, the cover 9 is attached, and the solder paste 15 is melted by reflow soldering, flows into the through hole 16, and the tip 12 of the cut-and-raised 11 wets the solder.
At this time, even if the substrate 10 is warped,
The tip 13 of the through hole 1 is located below the surface of the substrate 10.
6, the inner surface of the through hole 16, the tip 12 of the cut-and-raised portion 11, and the land 14 are securely soldered.

Further, the tip 13 of the cut-and-raised portion 11 is
When the cover 9 is reflow-soldered, the cream solder becomes
Does not become convex with respect to the back surface 10a, and does not hinder the surface mounting of the module.

In the reflow soldering of the through-hole 16 and the cut-and-raised portion 11, the tip 13 of the cut-and-raised portion does not protrude on the back surface 10a of the substrate 10, so that cream solder is printed on the through-hole 16 from the back surface 10a of the substrate 10 and reflowed. It can also be soldered.

[0012]

As described above, according to the present invention, the cut-and-raised portion formed from the cover for stabilizing the high-frequency electrical characteristics of the module and the module substrate are securely soldered, so that the characteristics are stabilized. . Also, since good soldering is obtained, there is no need for soldering correction work, and the productivity of the module increases.

Further, since the tip of the cut-and-raised portion is soldered in the hole, the soldering strength is increased, so that the solder does not crack or fall off when dropped.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a surface mount module according to an embodiment of the present invention.

FIG. 2 (a) is a perspective view of the conventional surface mount module as viewed from the front, and FIG. 2 (b) is a perspective view of the same as viewed from the back.

FIG. 3A is a cross-sectional view of the same surface mount module, and FIG. 3B is a cross-sectional view of the same when the substrate is warped.

[Explanation of symbols]

 Reference Signs List 8 electronic component 9 cover 10 substrate 11 cut and raised 12 tip 13 tip 15 solder 16 through hole

Claims (1)

[Claims] 1. A surface mount module comprising a board on which electronic components are mounted and a metal cover attached so as to cover the board, a part of the cover is cut and raised toward the board, and A surface mount module having a structure in which a tip portion is inserted into a hole provided in a substrate and soldered, and a tip of the cut-and-raised portion is within a thickness of the substrate.