JP2000223876A - 電子機器 - Google Patents
電子機器Info
- Publication number
- JP2000223876A JP2000223876A JP11021297A JP2129799A JP2000223876A JP 2000223876 A JP2000223876 A JP 2000223876A JP 11021297 A JP11021297 A JP 11021297A JP 2129799 A JP2129799 A JP 2129799A JP 2000223876 A JP2000223876 A JP 2000223876A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- circuit board
- cooling air
- heat
- exhaust passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims abstract description 92
- 238000010438 heat treatment Methods 0.000 claims description 36
- 230000005855 radiation Effects 0.000 claims description 16
- 238000000638 solvent extraction Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 238000007664 blowing Methods 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Calculators And Similar Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11021297A JP2000223876A (ja) | 1999-01-29 | 1999-01-29 | 電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11021297A JP2000223876A (ja) | 1999-01-29 | 1999-01-29 | 電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000223876A true JP2000223876A (ja) | 2000-08-11 |
JP2000223876A5 JP2000223876A5 (enrdf_load_stackoverflow) | 2005-12-02 |
Family
ID=12051222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11021297A Pending JP2000223876A (ja) | 1999-01-29 | 1999-01-29 | 電子機器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2000223876A (enrdf_load_stackoverflow) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002102500A (ja) * | 2000-10-02 | 2002-04-09 | Heiwa Corp | 遊技機 |
JP2006301715A (ja) * | 2005-04-15 | 2006-11-02 | Toshiba Corp | 電子機器 |
JP2009146268A (ja) * | 2007-12-17 | 2009-07-02 | Fujitsu Ltd | 電子機器 |
JP2011077448A (ja) * | 2009-10-01 | 2011-04-14 | Denso Corp | 電子装置およびその冷却装置 |
JP2011238063A (ja) * | 2010-05-11 | 2011-11-24 | Toshiba Corp | 電子機器 |
JP2011238797A (ja) * | 2010-05-11 | 2011-11-24 | Toshiba Corp | 電子機器 |
JP2013537989A (ja) * | 2010-09-24 | 2013-10-07 | インテル・コーポレーション | モバイルコンピュータ装置表面の冷却を向上させる方法および装置 |
US8553409B2 (en) * | 2008-06-27 | 2013-10-08 | Dell Products L.P. | System and method for portable information handling system parallel-wall thermal shield |
US8705233B2 (en) * | 2008-03-29 | 2014-04-22 | Dell Products L.P. | System and method for portable information handling system thermal shield |
WO2021220570A1 (ja) * | 2020-04-28 | 2021-11-04 | 日立Astemo株式会社 | 電子制御装置 |
JP7597268B1 (ja) * | 2024-09-27 | 2024-12-10 | 株式会社Ihi | インバータ装置および回転機械 |
-
1999
- 1999-01-29 JP JP11021297A patent/JP2000223876A/ja active Pending
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002102500A (ja) * | 2000-10-02 | 2002-04-09 | Heiwa Corp | 遊技機 |
JP2006301715A (ja) * | 2005-04-15 | 2006-11-02 | Toshiba Corp | 電子機器 |
JP2009146268A (ja) * | 2007-12-17 | 2009-07-02 | Fujitsu Ltd | 電子機器 |
KR101009628B1 (ko) * | 2007-12-17 | 2011-01-21 | 후지쯔 가부시끼가이샤 | 전자기기 |
US8199484B2 (en) | 2007-12-17 | 2012-06-12 | Fujitsu Limited | Electronic device |
US8705233B2 (en) * | 2008-03-29 | 2014-04-22 | Dell Products L.P. | System and method for portable information handling system thermal shield |
US8553409B2 (en) * | 2008-06-27 | 2013-10-08 | Dell Products L.P. | System and method for portable information handling system parallel-wall thermal shield |
JP2011077448A (ja) * | 2009-10-01 | 2011-04-14 | Denso Corp | 電子装置およびその冷却装置 |
US8422224B2 (en) | 2010-05-11 | 2013-04-16 | Kabushiki Kaisha Toshiba | Display device and electronic apparatus |
JP2011238797A (ja) * | 2010-05-11 | 2011-11-24 | Toshiba Corp | 電子機器 |
JP2011238063A (ja) * | 2010-05-11 | 2011-11-24 | Toshiba Corp | 電子機器 |
US9098234B2 (en) | 2010-05-11 | 2015-08-04 | Kabushiki Kaisha Toshiba | Display device and electronic apparatus |
JP2013537989A (ja) * | 2010-09-24 | 2013-10-07 | インテル・コーポレーション | モバイルコンピュータ装置表面の冷却を向上させる方法および装置 |
US8953313B2 (en) | 2010-09-24 | 2015-02-10 | Intel Corporation | Method and apparatus for enhanced cooling of mobile computing device surfaces |
WO2021220570A1 (ja) * | 2020-04-28 | 2021-11-04 | 日立Astemo株式会社 | 電子制御装置 |
CN115462188A (zh) * | 2020-04-28 | 2022-12-09 | 日立安斯泰莫株式会社 | 电子控制装置 |
US12127377B2 (en) | 2020-04-28 | 2024-10-22 | Hitachi Astemo, Ltd. | Electronic control device |
JP7597268B1 (ja) * | 2024-09-27 | 2024-12-10 | 株式会社Ihi | インバータ装置および回転機械 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051012 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051012 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070829 |
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A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070911 |
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A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080122 |