JP2000223444A - 半導体製造方法 - Google Patents

半導体製造方法

Info

Publication number
JP2000223444A
JP2000223444A JP11019261A JP1926199A JP2000223444A JP 2000223444 A JP2000223444 A JP 2000223444A JP 11019261 A JP11019261 A JP 11019261A JP 1926199 A JP1926199 A JP 1926199A JP 2000223444 A JP2000223444 A JP 2000223444A
Authority
JP
Japan
Prior art keywords
adhesive sheet
semiconductor
semiconductor wafer
semiconductor element
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11019261A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000223444A5 (enExample
Inventor
Koichi Miyazaki
公一 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP11019261A priority Critical patent/JP2000223444A/ja
Publication of JP2000223444A publication Critical patent/JP2000223444A/ja
Publication of JP2000223444A5 publication Critical patent/JP2000223444A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Dicing (AREA)
JP11019261A 1999-01-28 1999-01-28 半導体製造方法 Pending JP2000223444A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11019261A JP2000223444A (ja) 1999-01-28 1999-01-28 半導体製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11019261A JP2000223444A (ja) 1999-01-28 1999-01-28 半導体製造方法

Publications (2)

Publication Number Publication Date
JP2000223444A true JP2000223444A (ja) 2000-08-11
JP2000223444A5 JP2000223444A5 (enExample) 2006-02-02

Family

ID=11994509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11019261A Pending JP2000223444A (ja) 1999-01-28 1999-01-28 半導体製造方法

Country Status (1)

Country Link
JP (1) JP2000223444A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002343995A (ja) * 2001-05-11 2002-11-29 Sony Corp 集積型薄膜素子およびその製造方法
JP2013009016A (ja) * 2012-10-10 2013-01-10 Sony Corp 集積型薄膜素子の製造方法
JP2013009015A (ja) * 2012-10-10 2013-01-10 Sony Corp 集積型薄膜素子の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002343995A (ja) * 2001-05-11 2002-11-29 Sony Corp 集積型薄膜素子およびその製造方法
JP2013009016A (ja) * 2012-10-10 2013-01-10 Sony Corp 集積型薄膜素子の製造方法
JP2013009015A (ja) * 2012-10-10 2013-01-10 Sony Corp 集積型薄膜素子の製造方法

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