JP2000214216A - Semiconductor inspecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure the connection reliability of a semiconductor by allowing an insulation film and a wiring pattern to be elastically deformed according to the fluctuation of the height of a salient electrode that is formed at an input/ output terminal. SOLUTION: A semiconductor 21 is retained by suction force F of a collet 27 and is moved to a specific position, and the salient electrode 24 is brought into contact with a wiring pattern 25. The height of the salient electrode 24 scatters depending on its formation method. However, the reduction in the height irregularities is limited and a height scattering of approximately ±5 μremains. When the salient electrode 24 that is subjected to a flattening process is brought into contact with the wiring pattern 25, the wiring pattern 25 and an insulation film 26 are elastically deformed so that a height, irregularities of approximately ±5 μ can be absorbed. The electrical connection of all salient electrodes 24 and the wiring patterns 25 are secured by the elastic deformation, thus inspecting the function of the semiconductor 21. By removing the semiconductor 21 due to suction force F of a collet 27 after inspection is completed, the wiring pattern 25 and the insulation film 26 that have been elastically deformed return to a shape before inspection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor inspection device, and more particularly to a semiconductor inspection device having excellent connection reliability.

[0002]

2. Description of the Related Art A conventional semiconductor inspection apparatus is disclosed in
An example of Japanese Patent Publication No. 221146 will be described with reference to FIG. The semiconductor 21 is arranged so that the input / output pads 22 formed on the surface of the semiconductor 21 and the bumps 17 formed on the surface of the contact sheet 16 face each other. Next, the lid 19 is covered from above the semiconductor 21 and the screw 20 is tightened. This tightening force is transmitted to the contact sheet 16 and the elastic body 12 via the semiconductor 21. Since the contact sheet 16 and the elastic body 12 are elastically deformed, the contact sheet 16 is deformed so as to follow the inclination of the semiconductor 21 and the warpage of the surface.

As a result, the bump 17 and the input / output pad 22
A constant contact pressure can be ensured during the contact, so that low-resistance and stable electrical contact can be realized. Electrical signal is bump 1
7, the signal is transmitted to the socket connector 15 provided outside through the wiring pattern formed toward the outer periphery of the contact sheet 16. Further, the light is transmitted to the inspection wiring board 23 through the wiring layer formed inside the base 10 and the pins 11 provided on the bottom surface of the base 10, and the quality of the semiconductor 21 can be checked by the above apparatus.

[0004]

Generally, the input / output pad 22 of the semiconductor 21 which can be obtained at a low price is made of an aluminum evaporated film. In the conventional example, an acute and fine projection is formed at the tip of the bump 17, and the projection breaks the aluminum oxide film on the surface of the input / output pad 22 to obtain electrical contact.
When a large number of semiconductors 21 are inspected, the projections are worn each time the inspection is performed, so that the ability to break the aluminum oxide film is gradually lost, the connection resistance increases, and the inspection conditions become unstable.

[0005] Further, most of the semiconductor 21 after the inspection is completed
It is electrically connected to the mounting substrate by gold or aluminum wire bonding. Or gold bumps on input / output pad 2
After mounting on the substrate 2, it is mounted on a substrate via an adhesive resin or an anisotropic conductive film. According to the above-described conventional inspection method, damage due to bump contact at the time of inspection remains on the aluminum surface of the input / output pad 22, so that the bonding strength of wire bonding or gold bump bonding decreases. As semiconductors become more highly integrated and more sophisticated, the number of pins of the input / output pads 22 becomes smaller and the pitch becomes narrower. Therefore, the pad area tends to be further reduced, and even a minute damage may cause a significant decrease in strength.

An object of the present invention is to provide a semiconductor inspection apparatus for realizing a semiconductor inspection with a stable connection resistance and ensuring the connection reliability of a semiconductor after the inspection.

[0007]

A semiconductor inspection apparatus according to the present invention comprises a plurality of projection electrodes formed on input / output terminals of a semiconductor and an electrical connection through the projection electrodes. A flexible insulating film disposed so as to include an electrode arrangement region and a wiring pattern formed on the insulating film are provided. When inspecting a semiconductor, the insulating film or the wiring pattern is elastically deformed according to the variation in the height of the bump electrode, so that the shape and area of the contact surface between the bump electrode and the wiring pattern are kept constant. In addition, since the protruding electrodes are formed on the input / output terminals of the semiconductor in advance, it is not necessary to break the aluminum oxide film on the surface of the input / output terminals during the inspection. The problem of rising does not arise. Therefore, even if a large number of semiconductors are inspected, the connection resistance can be kept stable. Further, since the aluminum surface of the input / output terminal is not damaged by the inspection, the connection reliability of the semiconductor after the inspection is not deteriorated.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a sectional view showing a first embodiment of a semiconductor inspection apparatus according to the present invention. In the semiconductor inspection apparatus according to the present invention, the bump electrodes 24 are formed on the input / output terminals 22 of the semiconductor 21 before the inspection. When the input / output terminal 22 is formed of an aluminum vapor-deposited film, the protruding electrode 24 is formed by connecting a gold ball to the surface of the input / output terminal 22 using thermosonic bonding.

On the lower surface of the semiconductor 21, a wiring pattern 25 and a flexible insulating film 26, which are formed so as to be able to contact the respective protruding electrodes 24, are arranged. TAB (Tape-Autom
When an ated-bonding tape is used, the width of the wiring pattern can be reduced to about 50 microns and the wiring interval can be reduced to about 50 microns by etching a copper foil having a thickness of about 35 microns. TAB tape insulation film 2
As a material for No. 6, polyimide having a thickness of 50 microns or 75 microns is widely used.

In FIG. 1, the position of the wiring pattern 25 and the position of the semiconductor protruding electrode 24 are recognized using the positioning function of a flip chip bonder (not shown). Next, the semiconductor 21 is held by the attraction force F of the collet 27, and is moved to a predetermined position where the wiring pattern 25 and the protruding electrode 24 can be brought into contact with each other. 25.

The height of the protruding electrodes 24 varies depending on the method of forming them. In the thermosonic bonding of a gold ball, which is generally used as a method for forming an electrode, the height of the electrode reaches 90 μm on average and the dispersion reaches ± 20 μm when the gold wire is cut apart.
As a method of reducing the height variation, a step of pressing a flat tool to crush the tip of the projection is often used. However, there is a limit to the reduction of height variation,
Even if the above steps are performed, a height variation of about ± 5 μm remains.

When the wiring pattern 25 is brought into contact with the protruding electrode 24 subjected to the above-described flattening step, the wiring pattern 25 and the insulating film 26 are elastically deformed so as to absorb a height variation of ± 5 μm. In particular, as long as the amount of deformation of the insulating film 26 made of an organic polyimide material is large and the polyimide having a thickness of 50 μm or 75 μm is elastically deformed, a height variation of up to 10 μm can be sufficiently absorbed. Due to this elastic deformation, all the projecting electrodes 2
4 and the wiring pattern 25 are electrically connected, and the function of the semiconductor 21 can be inspected. After the inspection, if the semiconductor 21 is removed by the suction force F of the collet 27,
Elastically deformed wiring pattern 25 and insulating film 26
Returns to the shape before inspection. By repeating the above operation, it is possible to realize an inspection with a stable electrical connection to many semiconductors 21.

[0014]

According to the semiconductor inspection apparatus of the present invention, the electrical inspection is performed through the protruding electrodes formed on the input / output terminals of the semiconductor, so that the aluminum deposited film on the surface of the input / output terminals is not damaged. In addition, the connection reliability of the semiconductor does not deteriorate before and after the inspection.

Further, since the insulating film or the wiring pattern is elastically deformed in accordance with the variation in the height of the protruding electrodes, the insulating film and the wiring pattern return to the shapes before the inspection after the inspection. Since there is no need to break the aluminum oxide film as in the conventional example, even if a large number of semiconductors are inspected, the connection resistance does not increase and the inspection conditions can be kept stable.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a semiconductor inspection device according to the present invention.

FIG. 2 is a sectional view showing an example of a conventional semiconductor inspection device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Base, 11 ... Pin, 12 ... Elastic body, 13 ... Rear plate, 14 ... Spacer, 15 ... Socket connector, 16 ...
Contact sheet, 17… Bump, 18… Fence, 1
9: lid, 20: screw, 21: semiconductor, 22: input / output terminal, 23: inspection board, 24: protruding electrode, 25: wiring pattern, 26: insulating film, 27: suction collet.

Claims (1)

[Claims] In a semiconductor inspection apparatus for inspecting a semiconductor by supplying an electric signal through a plurality of protruding electrodes formed on input / output terminals of a semiconductor, the semiconductor inspection apparatus includes an area in which the protruding electrodes are arranged. A flexible insulating film disposed on the insulating film, and a predetermined wiring pattern formed on the insulating film and capable of contacting the protruding electrode. When the protruding electrode is pressed against the wiring pattern, the wiring A semiconductor inspection device, wherein an electrical connection is maintained by elastically deforming a pattern or the insulating film in accordance with a variation in the height of the bump electrode.