JP2000154346A5 - - Google Patents
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- JP2000154346A5 JP2000154346A5 JP1998330289A JP33028998A JP2000154346A5 JP 2000154346 A5 JP2000154346 A5 JP 2000154346A5 JP 1998330289 A JP1998330289 A JP 1998330289A JP 33028998 A JP33028998 A JP 33028998A JP 2000154346 A5 JP2000154346 A5 JP 2000154346A5
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- JP
- Japan
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- formula
- following formula
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- Prior art date
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000007650 screen-printing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 239000002966 varnish Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- 238000004455 differential thermal analysis Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33028998A JP2000154346A (ja) | 1998-11-20 | 1998-11-20 | 半導体ウエハー用ポリイミドスクリーン印刷ワニス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33028998A JP2000154346A (ja) | 1998-11-20 | 1998-11-20 | 半導体ウエハー用ポリイミドスクリーン印刷ワニス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000154346A JP2000154346A (ja) | 2000-06-06 |
| JP2000154346A5 true JP2000154346A5 (https=) | 2005-07-21 |
Family
ID=18230996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33028998A Pending JP2000154346A (ja) | 1998-11-20 | 1998-11-20 | 半導体ウエハー用ポリイミドスクリーン印刷ワニス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000154346A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5116001B2 (ja) * | 2001-02-16 | 2013-01-09 | 大日本印刷株式会社 | ウエットエッチングされた絶縁体の製造方法及び電子回路部品の製造方法 |
| JP4599821B2 (ja) * | 2002-10-09 | 2010-12-15 | 宇部興産株式会社 | 微細なパターンが印刷可能なインキおよび印刷物 |
| JP5510908B2 (ja) | 2010-02-26 | 2014-06-04 | 株式会社ピーアイ技術研究所 | 半導体装置用ポリイミド樹脂組成物並びにそれを用いた半導体装置中の膜形成方法及び半導体装置 |
| JP2012069594A (ja) | 2010-09-21 | 2012-04-05 | Pi R & D Co Ltd | 太陽電池内の絶縁膜形成用ポリイミド樹脂組成物及びそれを用いた太陽電池内の絶縁膜形成方法 |
| KR20220044233A (ko) * | 2020-09-30 | 2022-04-07 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 수지조성물, 수지필름, 적층체, 커버레이 필름, 수지 부착 동박, 금속박적층판 및 회로기판 |
| WO2025079359A1 (ja) * | 2023-10-11 | 2025-04-17 | 日産化学株式会社 | 樹脂組成物 |
-
1998
- 1998-11-20 JP JP33028998A patent/JP2000154346A/ja active Pending
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