JP2000114655A - サブマウントミラー方式面型レーザ - Google Patents

サブマウントミラー方式面型レーザ

Info

Publication number
JP2000114655A
JP2000114655A JP10278766A JP27876698A JP2000114655A JP 2000114655 A JP2000114655 A JP 2000114655A JP 10278766 A JP10278766 A JP 10278766A JP 27876698 A JP27876698 A JP 27876698A JP 2000114655 A JP2000114655 A JP 2000114655A
Authority
JP
Japan
Prior art keywords
submount
laser
mirror
substrate
mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10278766A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000114655A5 (https=
Inventor
Makoto Ohashi
真 大橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP10278766A priority Critical patent/JP2000114655A/ja
Priority to US09/408,122 priority patent/US6487224B1/en
Publication of JP2000114655A publication Critical patent/JP2000114655A/ja
Publication of JP2000114655A5 publication Critical patent/JP2000114655A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP10278766A 1998-09-30 1998-09-30 サブマウントミラー方式面型レーザ Pending JP2000114655A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10278766A JP2000114655A (ja) 1998-09-30 1998-09-30 サブマウントミラー方式面型レーザ
US09/408,122 US6487224B1 (en) 1998-09-30 1999-09-29 Laser diode assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10278766A JP2000114655A (ja) 1998-09-30 1998-09-30 サブマウントミラー方式面型レーザ

Publications (2)

Publication Number Publication Date
JP2000114655A true JP2000114655A (ja) 2000-04-21
JP2000114655A5 JP2000114655A5 (https=) 2005-03-03

Family

ID=17601895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10278766A Pending JP2000114655A (ja) 1998-09-30 1998-09-30 サブマウントミラー方式面型レーザ

Country Status (2)

Country Link
US (1) US6487224B1 (https=)
JP (1) JP2000114655A (https=)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303975A (ja) * 2002-04-08 2003-10-24 Opnext Japan Inc モニタ用フォトダイオード付光モジュール。
EP1579540A4 (en) * 2002-10-03 2006-08-02 Quintessence Photonics Corp VERTICAL HIGH PERFORMANCE TRANSMISSION LASERS
JP2008028391A (ja) * 2006-07-17 2008-02-07 Agere Systems Inc マルチレーザー用途のレーザー・アセンブリ
US7343060B2 (en) 2005-03-04 2008-03-11 Fuji Xerox Co., Ltd. Light transmission and reception module, sub-mount, and method of manufacturing the sub-mount
US7350982B2 (en) 2005-07-15 2008-04-01 Fuji Xerox Co., Ltd Sub-mount for mounting optical component and light transmission and reception module
JP2016184729A (ja) * 2015-03-26 2016-10-20 日亜化学工業株式会社 半導体レーザ装置及びこの半導体レーザ装置を用いたバックライト装置
US9748733B2 (en) 2015-03-26 2017-08-29 Nichia Corporation Semiconductor laser device and backlight device using the semiconductor laser device
JP2017528920A (ja) * 2014-10-08 2017-09-28 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ レーザ部品およびその製造方法
WO2019116547A1 (ja) * 2017-12-15 2019-06-20 三菱電機株式会社 半導体レーザ装置および半導体レーザ装置の製造方法
WO2021014568A1 (ja) * 2019-07-23 2021-01-28 三菱電機株式会社 Ｔｏ－ｃａｎ型光送信モジュール
WO2024204657A1 (ja) * 2023-03-29 2024-10-03 京セラ株式会社 光導波路パッケージ及び光源モジュール

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100370016B1 (ko) * 2000-06-02 2003-01-29 엘지전자 주식회사 광 정보 저장 장치용 마이크로 미러 및 그 제조 방법과,그를 이용한 광픽업 장치
FR2812769B1 (fr) * 2000-08-04 2003-08-29 Cit Alcatel Laser accordable en semi-conducteur a emission par la tranche
US7180929B2 (en) * 2002-04-18 2007-02-20 Intel Corporation Wafer-level test structure for edge-emitting semiconductor lasers
JP2004022760A (ja) * 2002-06-14 2004-01-22 Oki Electric Ind Co Ltd レーザダイオード
DE10323857A1 (de) 2003-05-26 2005-01-27 Osram Opto Semiconductors Gmbh Gehäuse für ein Laserdiodenbauelement, Laserdiodenbauelement und Verfahren zum Herstellen eines Laserdiodenbauelements
US20050180482A1 (en) * 2004-01-23 2005-08-18 Osowski Mark L. Very low cost surface emitting laser diode arrays
US7586962B1 (en) * 2004-03-29 2009-09-08 The United States Of America As Represented By The Secretary Of The Air Force Integrated diamond carrier for laser bar arrays
US7045827B2 (en) * 2004-06-24 2006-05-16 Gallup Kendra J Lids for wafer-scale optoelectronic packages
US7481545B2 (en) * 2005-10-13 2009-01-27 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Method of forming and mounting an angled reflector
US20080198890A1 (en) * 2007-02-21 2008-08-21 Ungar Jeffrey E Vertically emitting laser and method of making the same
JP4301335B2 (ja) * 2007-10-23 2009-07-22 オムロン株式会社 光導波路、光伝送モジュール、及び電子機器
US20180366902A1 (en) * 2015-12-23 2018-12-20 Intel Corporation Laser projector with angled reflector
WO2017122792A1 (ja) * 2016-01-14 2017-07-20 古河電気工業株式会社 半導体レーザモジュール、半導体レーザモジュール製造方法
JP2019175986A (ja) * 2018-03-28 2019-10-10 住友電気工業株式会社 光モジュール
US20220166185A1 (en) * 2019-08-06 2022-05-26 Mitsubishi Electric Corporation Semiconductor laser device
CN114552377B (zh) * 2022-02-16 2024-06-21 中国电子科技集团公司第四十四研究所 基于异构集成的单向注入锁定半导体激光器
WO2024000964A1 (zh) * 2022-06-30 2024-01-04 青岛海信宽带多媒体技术有限公司 光模块

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5159603A (en) * 1991-06-05 1992-10-27 United States Of America As Represented By The Administrator, National Aeronautics And Space Administration Quantum well, beam deflecting surface emitting lasers
JPH07118087A (ja) 1993-10-20 1995-05-09 Niyuuraru Syst:Kk 単結晶薄膜形成方法
GB2295269A (en) * 1994-11-14 1996-05-22 Sharp Kk Resonant cavity laser having oxide spacer region

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303975A (ja) * 2002-04-08 2003-10-24 Opnext Japan Inc モニタ用フォトダイオード付光モジュール。
EP1579540A4 (en) * 2002-10-03 2006-08-02 Quintessence Photonics Corp VERTICAL HIGH PERFORMANCE TRANSMISSION LASERS
US8442084B2 (en) 2002-10-03 2013-05-14 Laser Operations Llc High performance vertically emitting lasers
US7343060B2 (en) 2005-03-04 2008-03-11 Fuji Xerox Co., Ltd. Light transmission and reception module, sub-mount, and method of manufacturing the sub-mount
US7350982B2 (en) 2005-07-15 2008-04-01 Fuji Xerox Co., Ltd Sub-mount for mounting optical component and light transmission and reception module
JP2008028391A (ja) * 2006-07-17 2008-02-07 Agere Systems Inc マルチレーザー用途のレーザー・アセンブリ
JP2017528920A (ja) * 2014-10-08 2017-09-28 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ レーザ部品およびその製造方法
JP2016184729A (ja) * 2015-03-26 2016-10-20 日亜化学工業株式会社 半導体レーザ装置及びこの半導体レーザ装置を用いたバックライト装置
US9748733B2 (en) 2015-03-26 2017-08-29 Nichia Corporation Semiconductor laser device and backlight device using the semiconductor laser device
WO2019116547A1 (ja) * 2017-12-15 2019-06-20 三菱電機株式会社 半導体レーザ装置および半導体レーザ装置の製造方法
WO2021014568A1 (ja) * 2019-07-23 2021-01-28 三菱電機株式会社 Ｔｏ－ｃａｎ型光送信モジュール
JPWO2021014568A1 (ja) * 2019-07-23 2021-09-13 三菱電機株式会社 Ｔｏ−ｃａｎ型光送信モジュール
WO2024204657A1 (ja) * 2023-03-29 2024-10-03 京セラ株式会社 光導波路パッケージ及び光源モジュール

Also Published As

Publication number Publication date
US6487224B1 (en) 2002-11-26

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