JP2000093866A - Method and device for paste coating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate the rapid adjustment of the coating quantity of paste to form a paste pattern having a desired shape with high precision. SOLUTION: While changing the relative position relation of a nozzle 13a and an actual substrate 22, by discharging paste 23 from a discharge port of the nozzle 13a, a desired paste pattern is formed on the surface of an actual substrate 22. In this case, when the nozzle 13a reaches a position on the actual substrate 22 determined as a change point in advance, the distance for the surface of the actual substrate 22 to the paste discharge port of the nozzle 13a, that is, the coating height is changed from a coating height 1 to a coating height 2 set in advance, and accordingly, paste discharge from the nozzle 13a is changed. In this way, coating paste thickness can be changed more quickly than changing of pressure applied to a paste housing cylinder provided with the nozzle 13a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method in which a substrate is placed on a table so as to face a discharge port of a nozzle, and between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate. An arbitrary (desired) distance is provided to change the relative positional relationship between the substrate and the nozzle in a direction parallel to the main surface of the nozzle while discharging the paste filled in the paste container from the discharge port onto the substrate. The present invention relates to a paste applying method and a paste applying machine for applying a paste pattern of a desired shape on the substrate.

[0002]

2. Description of the Related Art In a conventional paste coating machine, in order to adjust a coating amount, a paste filled in a storage cylinder is discharged from a nozzle onto a substrate, and the nozzle and the nozzle in a direction perpendicular to the main surface of the substrate are discharged. The relative distance between the substrates is adjusted to maintain a predetermined (desired value) irrespective of the undulation of the main surface of the substrate, and the relative moving speed between the nozzle and the substrate, that is, the speed at which the paste pattern is applied (hereinafter, referred to as the speed) The application amount is adjusted by adjusting the application speed (hereinafter referred to as “application speed”) and the pressure applied to the paste storage cylinder (hereinafter referred to as “application pressure”) that determines the amount of paste discharged from the nozzle.

For example, when the application speed is constant, when increasing the amount of paste discharged, the application pressure is increased. Conversely, when reducing the discharge amount of the paste, the discharge amount can be adjusted by reducing the application pressure. In addition, when the application pressure is constant, when increasing the amount of paste discharged, the application speed is reduced. Conversely, when reducing the discharge amount of the paste, the discharge amount is adjusted by increasing the application speed.

[0004]

In a conventional paste coater, the relative distance between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate is maintained so as to be constant regardless of the undulation of the main surface of the substrate. On the premise of adjustment, the application amount is adjusted by adjusting the application pressure and the application speed.

[0005] When the paste application amount is adjusted by the application pressure, it takes a propagation time for the adjustment result of the application pressure to be reflected on the discharge amount from the nozzle tip through the paste storage cylinder. The paste pattern application operation proceeds by an amount corresponding to the application speed. For this reason, it has been difficult to steeply adjust the coating amount.

[0006] Regarding the adjustment of the paste application amount by the application speed, in many cases, the paste application amount has already been adjusted as high as possible as a means for increasing the productivity. When the paste application amount is further increased, the paste application amount only decreases. It was impossible to increase the coating speed without changing the coating amount per distance.

SUMMARY OF THE INVENTION An object of the present invention is to provide a paste coating method and a paste coating machine which can solve the above-mentioned problems, facilitate quick adjustment of a coating amount, and form a paste pattern of a desired shape. It is in.

[0008]

In order to achieve the above object, in a paste application method according to the present invention, a substrate is placed on a table so as to face a discharge port of a nozzle, and a main surface of the substrate is placed on the table. An arbitrary (desired) distance is provided between the nozzle and the substrate in a vertical direction, and the paste filled in the paste storage cylinder is discharged from the discharge port onto the substrate while the substrate and the nozzle are in contact with each other. By changing the relative positional relationship in a direction parallel to the main surface of the substrate, a paste pattern of a desired shape is drawn on the substrate, and the nozzle in a direction perpendicular to the main surface of the substrate. It is an object of the present invention to change the distance to the substrate and to discharge an amount of paste on the substrate in proportion to the changed distance.

In order to achieve the above object, a paste coating machine according to the present invention places a substrate on a table so as to face a discharge port of a nozzle, and applies the substrate in a direction perpendicular to a main surface of the substrate. An arbitrary (desired) distance is provided between the nozzle and the substrate, and while the paste filled in the paste container is discharged onto the substrate from the discharge port, the main surface of the substrate between the substrate and the nozzle is By changing the relative positional relationship in the parallel direction, a paste pattern of a desired shape is drawn on the substrate, and the paste pattern in a direction perpendicular to the main surface of the substrate corresponding to the amount of the paste pattern applied. A storage unit for storing data representing a relationship between a distance between a nozzle and the substrate and a relative position of the substrate and the nozzle for changing an application amount of the paste pattern in a direction parallel to a main surface of the substrate; Pace of Detecting means for detecting a relative position of the nozzle with respect to the main surface of the substrate in a direction parallel to the main surface of the substrate, and a relative position of the nozzle in the direction parallel to the main surface of the substrate with respect to the paste pattern detected by the detecting means; When the relative position at which the application amount is changed, the nozzles in the direction perpendicular to the main surface of the substrate corresponding to the application amount of the paste pattern corresponding to the relative position from the data stored in the storage means. Changing means for changing the distance to the substrate.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of a paste coater according to the present invention, wherein 1 is a gantry, 2a and 2b are substrate transport conveyors, 3 is a support table, 4 is a substrate suction disk, and 5 is θ. Axis moving table, 6a and 6b are X axis moving tables, 7
Is a Y-axis moving table, 8a and 8b are servo motors, 9 is a Z-axis moving table, 10 is a servo motor, 11 is a ball screw, 12 is a servomotor, and 13 is a paste. Storage cylinder (syringe), 14 is a distance meter, 15 is a support plate, 16a, 16
b is an image recognition camera, 17 is a control unit, 18 is a monitor, 1
9 is a keyboard, 20 is a personal computer having an external storage device, and 21 is a cable.

In FIG. 1, two board transfer conveyors 2 a, which can move up and down in parallel in the X-axis direction, are mounted on a gantry 1.
2b is provided to convey a substrate (not shown) from the back of the drawing to the front, that is, horizontally in the X-axis direction. A support 3 is provided on the gantry 1, and a substrate suction board 4 is mounted on the support 3 via a θ-axis moving table 5. The θ-axis moving table 5 is
Is rotated in the θ direction about the Z axis.

On the gantry 1, there are further provided X-axis moving tables 6a, 6b outside of the board transfer conveyors 2a, 2b and parallel to the X-axis, and these X-axis moving tables 6a, 6b are provided.
A Y-axis moving table 7 is provided so as to extend between 6b. The Y-axis moving table 7 is horizontally conveyed in the X-axis direction by forward or reverse rotation (forward / reverse rotation) of servo motors 8a, 8b provided on the X-axis moving tables 6a, 6b. Is done. On the Y-axis moving table 7, there is provided a Z-axis moving table 9 which moves in the Y-axis direction by forward / reverse rotation of the ball screw 11 driven by the servo motor 10. This Z
The axis moving table 9 includes a paste storage cylinder 13 and a distance meter 1.
4 is provided, and the servo motor 12 moves the paste storage cylinder 13 and the distance meter 14 in the Z-axis direction through a movable portion of a linear guide (not shown) provided on the support plate 15. Move. Paste storage cylinder 1
Reference numeral 3 is removably attached to the movable portion of the linear guide. An image recognition camera 16a for aligning a board (not shown) is provided on the top plate of the gantry 1.
16b is provided facing upward.

Inside the gantry 1, servo motors 8a, 8
b, 10, 12, 24 (not shown), etc., and a control unit 17 is provided.
1 are connected to a monitor 18, a keyboard 19, and a personal computer 20. Data for various processes in the control unit 17 is input from the keyboard 19, and images and control captured by the image recognition cameras 16a and 16b are performed. The processing status of the unit 17 is displayed on the monitor 18.

Data and the like input from the keyboard 19 are stored in a storage medium such as a floppy disk in an external storage device of the personal computer 20.

FIG. 2 is an enlarged perspective view showing a portion of the paste container 13 and the distance meter 14 shown in FIG.
a is a nozzle, 22 is a substrate, 23 is a paste pattern, and portions corresponding to FIG.

In FIG. 1, the rangefinder 14 has a triangular cutout at its lower end, and a light emitting element and a plurality of light receiving elements are provided in the cutout. The nozzle 13a is positioned below the cut portion of the distance meter 14. The distance meter 14 measures the distance from the tip of the nozzle 13a to the surface (upper surface) of the substrate 22 by noncontact triangulation. That is,
A light emitting element is provided on one side of the triangular cut portion, and the laser light L emitted from this light emitting element is
The light is reflected at the upper measurement point S, and is received by one of the plurality of light receiving elements provided on the other slope of the cut portion. Therefore, the laser light L is not blocked by the paste container 13 or the nozzle 13a.

The measurement point S of the laser beam L on the substrate 22 is displaced from the position immediately below the nozzle 13a by a small distance .DELTA.X, .DELTA.Y on the substrate 22, but this small distance .DELTA.X, .DELTA.Y
Since there is no difference in the waviness (irregularity) of the surface of the substrate 22 between the positions shifted by about a degree, the measurement result of the distance meter 14 and the nozzle 1
There is almost no difference between the distance from the tip of 3a to the surface of the substrate 22. Therefore, by controlling the servomotor 12 based on the measurement result of the distance meter 14, the distance from the tip of the nozzle 13a to the surface of the substrate 22 is maintained at a desired value in accordance with the undulation of the surface of the substrate 22.

FIG. 3 is a block diagram showing the structure of the control unit 17 shown in FIG. 1, the control of the air pressure of the paste container 13, and the control of the substrate 22, and 17a is a micro computer.
Motor 17b, motor controller 17c1, 17c2
Is the X1, X2 axis driver, 17d is the Y axis driver, 17
e is a θ-axis driver, 17f is a Z-axis driver, 17g is a data communication bus, 17h is an external interface, 24 is a servo motor for driving the θ-axis moving table 5 (FIG. 1),
25 to 29 are encoders, 30 is a positive pressure source, 30a is a positive pressure regulator, 31 is a negative pressure source, 31a is a negative pressure regulator, and 32 is a valve unit. The same reference numerals are used.

In FIG. 1, a control unit 17 includes a microcomputer 17a, a motor controller 17b, X,
Y, Z, θ axis drivers 17c1 to 17f, an image processing device 17i for processing video signals obtained by the image recognition cameras 16a, 16b, an external interface for transmitting signals to the keyboard 19, etc. It has a built-in face 17h. The control unit 17 further controls the substrate transport conveyors 2a, 2
Although the driving control system of b is included, illustration is omitted here.

Although not shown, the microcomputer 17a includes a main processing unit, a ROM storing a processing program for performing application and drawing of paste, which will be described later, processing results in the main processing unit, and an external interface. 17h and mo
RA for storing input data from the tach controller 17b
M, an input / output unit for exchanging data with an external interface 17h and a motor controller 17b. Each of the servomotors 8a, 8b, 10, 12, and 24 is provided with encoders 25 to 29 for detecting the amount of rotation, and outputs the detection results to the X, Y, Z, and θ axis drivers. Position control is performed by returning to positions 17c1 to 17f.

The servomotors 8a, 8b and 10 are keyboads.
Input from the computer 19 and the R of the microcomputer 17a.
By rotating forward and backward based on the data stored in the AM, the nozzle 13a (see FIG. 1) is applied to the substrate 22 vacuum-adsorbed to the substrate suction disk 4 (FIG. 1) by the negative pressure distributed from the negative pressure source 131. 2) moves an arbitrary distance in the X and Y axis directions via the Z axis moving table 9 (FIG. 1).
, A slight air pressure is applied to the paste storage cylinder 13 from the positive pressure source 30 via the positive pressure regulator 30a and the valve unit 32, and the paste is discharged from the discharge port at the tip of the nozzle 13a. Thus, a desired pattern of paste is applied to the substrate 22. The distance meter 14 measures the distance between the nozzle 13a and the substrate 22 during the horizontal movement of the Z-axis moving table 9 in the X and Y-axis directions, and the distance meter 14 keeps this distance constant. -If the motor 12 is Z
It is controlled by the axis driver 17f.

In a standby state in which paste application is not performed, the microcomputer 17a operates the valve unit 3.
2, the negative pressure source 31 communicates with the paste storage cylinder 13 via the negative pressure regulator 31a and the valve unit 32, and pulls the paste dripping from the discharge port of the nozzle 13a back into the paste storage cylinder 13. Thus, dripping of the paste from the discharge port can be prevented. The discharge port of the nozzle 13a is monitored by an image recognition camera (not shown), and only when liquid dripping occurs,
The negative pressure source 31 may be connected to the paste container 13.

FIG. 4 is a flowchart showing one embodiment of the paste applying method according to the present invention in the paste applying machine shown in FIG.

Referring to FIG. 1, when the power is turned on to the paste dispenser (step 100), its initial settings are executed (step 200).

In this initial setting, in FIG. 1, the Z-axis moving table 9 is moved in the X and Y directions by the servo motors 8a, 8b and 10 to be positioned at a predetermined reference position.
Position of the nozzle 13a (FIG. 2) where the paste discharge port starts discharging the paste (that is, the paste application start point).
Is set at a predetermined origin position so as to be positioned at the same time. Further, data for one or more paste patterns to be applied and drawn on a substrate (hereinafter, referred to as an actual substrate) on which a paste pattern is to be drawn (hereinafter, paste pattern) Data, which is composed of a series of position data constituting a paste pattern to be applied and formed on an actual substrate) and data of application conditions for each paste pattern. The input of these data is carried out from a keyboard 19 (FIG. 1).
7a (FIG. 3).

Assuming that the number of paste patterns to be applied and drawn on one actual substrate is m (where m is an integer of 1 or more), as shown in FIG. . 1, 2,..., M, and the relative speed between the actual substrate and the nozzle when actually applying the paste to the actual substrate for each of the paste patterns (this is referred to as the application speed. ,
The application speed in this case is referred to as an initial application speed) and a paste container 13 that determines the amount of paste discharged from the nozzle.
(This is referred to as the coating pressure, in particular, the coating pressure in this case is referred to as the initial setting coating pressure), and the height of the nozzle from the substrate surface (this is referred to as the coating height. Is called the initial setting application height.)
And data such as a change point indicating a position (point) at which the paste discharge amount is to be changed. In addition, as a change point, for example, the height of the applied pattern is made higher (or lower) by increasing (or less) the paste application amount than other portions, or a straight line such as a bent portion of the pattern. This is a point at which the discharge amount per unit time of the paste is changed in order to apply the paste at the same height as the portion.

Here, it is assumed that each of the paste patterns has n change points (where n is 0 or an integer of 1 or more).
2,..., N. In this case, the position of the change point on the actual substrate is the pattern number i (where i is
= 1, 2, ..., m)
Change point 1 = (Xi1, Yi1), change point 2
= (Xi2, Yi2), ..., change point n = (Xi
n, Yin). For example, in the case of a paste pattern of pattern number 1, each change point is change point 1 = (X11, Y11), change point 2 = (X1
2, Y12),..., Change point n = (X1n, Y1)
n).

The application height data is set at the change point and other positions, respectively. In FIG. 5, application heights 1 and 2 are set, and application height 2 is set. Defining the application height at the change points 1 to n,
The application height 1 defines the application height at other positions. Of course, when the application height is different between the change points, that is, when the same application height is maintained from one change point to the next change point, the application height for each change point is set. You. This change point 1
To n are any of the paste pattern data described above. When the application height is changed in a predetermined area having a certain length on the paste pattern, all the position data in the area are changed to the change point. Is set as the application condition.

Although not shown in FIG. 5, the application conditions include application pattern movement data, start point coordinates, end point coordinates,
The measurement position data of the applied paste pattern, suckback pressure and the like are also set.

When the initial setting (Step 200) is completed, the actual substrate is mounted on the substrate suction plate 4 (FIG. 1) and held by suction (Step 300). In the mounting of the substrate, the actual substrate is transported in the X-axis direction above the substrate suction plate 4 by the substrate transport conveyors 2a and 2b (FIG. 1), and these substrate transport conveyors 2a, 2b
The actual substrate is placed on the substrate suction plate 4 by lowering 2b.

Next, preliminary substrate positioning (step 40)
Perform 0). In this process, the positioning of the actual substrate in the X and Y directions is performed by a positioning chuck (not shown) in FIG. Further, the mark for positioning the actual substrate placed on the substrate suction plate 4 is moved to the image recognition camera 16.
a, 16b, the center of gravity of the positioning mark is obtained by image processing, the inclination of the actual substrate in the θ direction is detected, and the servo motor 24 (FIG. 3) is driven accordingly. , The inclination in the θ direction is also corrected.

When the remaining amount of the paste in the paste container 13 becomes small and the paste may be interrupted during the paste pattern applying operation, the paste container 13 and the nozzle 13a are exchanged in advance. When replacing 13a, compared to before the replacement,
A positional shift of the mounting position may occur, and the reproducibility may be impaired. Therefore, in order to ensure reproducibility, a new nozzle 13a that has been replaced with a portion on the actual substrate where the paste is not applied is used.
The paste is applied in the shape of a cross using a cross, the center of gravity of the intersection of the cross application pattern is determined by image processing, and the distance between this center of gravity and the center of gravity of the positioning mark on the actual substrate is calculated. This is referred to as the displacement amount dx, dy (FIG. 2) of the paste discharge port of the nozzle 13a,
The data is stored in the RAM incorporated in the data 17a.

The pre-positioning of the substrate with respect to the actual substrate (step 400) has been described above, and the positional deviation of the nozzle 13a at the time of application and drawing of a paste pattern to be performed later is corrected using the positional deviation amounts dx and dy of the nozzle 13a. To do.

Next, the pattern No. The paste pattern application (step 500) is performed sequentially from the first paste pattern data. This will be described in detail with reference to FIG.

In the figure, first, application conditions are set (step 501). Here, the microcomputer
The RAM of the data 17a (FIG. 3) is provided with a storage table in which paste pattern data of each paste pattern and application conditions as shown in FIG. 5 are stored. The paste pattern data of the paste pattern and the application conditions are read out from the storage table and stored in a predetermined area of the RAM so that the microcomputer 17a can use the paste pattern data and the application conditions. Here, first, the pattern No. In this case, since the paste pattern of No. 1 is applied and drawn, the application conditions in this case are as follows: application speed = V1, application pressure = P1,
Coating height 1 = H11, coating height 2 = H12, change point coordinates 1 = (X11, Y11), change point coordinates 2 =
(X12, Y12),..., Change point coordinates n = (X
1n, Y1n) are read from the storage table and the above R
It is stored in a predetermined area of the AM so that it can be used by the microcomputer 17a.

After setting the application conditions,
The servo motors 8a, 8b and 10 (FIG. 1) are driven to move the nozzle 13a to the drawing (coating) start point (step 502). In order to position the discharge port of the nozzle 13a at this coating start position, the Z-axis moving table 9 (FIG. 1) is moved to perform comparison and adjustment movement of the nozzle position. (Step 40 in FIG. 4)
0) and stored in the RAM of the microcomputer 17a and stored in the RAM of the microcomputer 17a, the positional deviation amounts dx and dy of the nozzle 13a shown in FIG.
It is determined whether or not it is within ΔY. This displacement d
x and dy are within an allowable range (that is, ΔX ≧ dx and ΔY ≧ d
y), it is left as it is and out of the allowable range (that is, ΔX
<Dx or ΔY <dy), the displacement d
By moving the Z-axis moving table 9 based on x and dy to adjust the paste storage cylinder 13, the displacement between the paste discharge port of the nozzle 13a and the desired position of the actual substrate is eliminated, and 13a is initially positioned at a desired position.

Next, the servo motor 12 (FIG. 1) is driven to set the height of the nozzle 13a (step 50).
3). The set height corresponds to the pattern No. already read from the storage table of the RAM. The application height 1 set in the application condition 1 (specifically, the height H in FIG. 5)
11), and the distance from the discharge port of the nozzle 13a to the surface of the actual substrate is set to the application height H11.

When the above processing is completed, next, the servo motors 8a, 8b, 1 based on the paste pattern data stored in the RAM of the microcomputer 17a.
0 (FIG. 1) is driven, whereby the paste discharge port of the nozzle 13a moves in the X and Y directions according to the paste pattern data while facing the actual substrate (step 504). Further, the pattern N is transferred from the positive pressure source 30 (FIG. 3) to the paste container 13 via the valve unit 32 (FIG. 3) by the positive pressure regulator 30a (FIG. 3).
o. The air pressure adjusted to the application pressure P1 under the first application condition is applied, and the paste starts to be discharged from the paste discharge port of the nozzle 13a (step 505). At this time, the negative pressure adjusted to the suck-back pressure by the negative pressure regulator 31a (FIG. 3) from the negative pressure source 31 (FIG. 3) to the paste housing cylinder 13 via the valve unit 32 (FIG. 3) immediately before the paste is discharged. To the nozzle 13a
When you suck in the paste that has accumulated in the paste discharge port,
At the start end, the paste can be applied without accumulation.

At the start of the coating / drawing operation, the microcomputer 17a sends a signal from the distance meter 14 to the nozzle 13
7A by measuring the swell of the surface of the actual substrate by taking in actual measurement data of the distance between the paste discharge port a and the surface of the actual substrate, and driving the servomotor 12 in accordance with the measured value. Nozzle 1 from the surface of the actual substrate as shown in FIG.
3a is constant, that is, the above pattern No. 1
The application height is maintained at the application height 1 under the application conditions, and the application and drawing of the paste pattern is performed (step 50).
6).

The microcomputer 17a reads the application position of the paste pattern on the actual substrate, that is, the coordinates from the motor controller 17b (step 50).
7), the pattern No. It is determined whether or not change point 1 (X11, Y11) under the first application condition has been reached (step 508).

When this change point 1 is reached, the distance between the paste application surface of the actual substrate and the nozzle is changed to the above-mentioned pattern No. The application height 1 = H11 in the application condition 1 is changed to the application height 2 = H12 (step 509). This is performed by driving the servo motor 12. FIG.
(B) shows the state at the change point 1, where H11> H12. When the change points 1, 2, 2, ... continue, the application height 2 =
The application drawing of the paste pattern is continuously executed while H12 is set.

Here, as shown in FIG. 7 (b), at the change point where the coating height becomes low, if the coating speed and the coating pressure are not changed, the paste discharged from the nozzle 13a will not be transferred from the actual substrate. Since the ejection resistance increases due to the reaction force, the ejection becomes difficult from the nozzle 13a, and the application amount of the paste is reduced by the reduced application height. Conversely, when the coating height 2 = H12 is higher than the coating height 1 = H11, the nozzle 13a moves away from the actual substrate, so that the reaction force from the actual substrate is reduced and the ejection resistance is reduced. Therefore, the paste is applied to the nozzle 13a.
And the amount of paste applied increases. Therefore, the relationship between the values such as the coating speed, the coating pressure, the coating height 1 and the coating height 2 and the position coordinates of the change point is shown in FIG.
Is set in the storage table in the RAM of the microcomputer 17a, and the application amount of the paste at an arbitrary position of the paste pattern, that is, the application amount of the paste on the actual substrate is set. Can be adjusted.

As described above, the application and drawing of the paste pattern proceeds, and the determination of whether to continue or end the application and drawing operation of the paste pattern is the end of the paste pattern to be applied, where the application point is determined by the paste pattern data. (Step 51)
0) If it is not the end, the process returns to the measurement processing of the undulation of the surface of the actual substrate, that is, the application height control (step 506), and then the coordinate confirmation (step 507) is executed.
The application height is changed each time the change point is reached, and the application height is changed up to the change point n.

Thereafter, the above steps are repeated until the end of the application of the paste pattern is reached.
The application of the air pressure adjusted to the application pressure P1 by the positive pressure regulator 30a (FIG. 3) from the positive pressure source 30 (FIG. 3) to the paste storage cylinder 13 via the positive pressure source 30 (FIG. 3) is stopped via the nozzle 13a. The discharge of the paste from the outlet is stopped (step 511).

This paste pattern application operation is performed until all of the set m pieces of paste pattern data are completed (step 512), and the last pattern N
o. When the end of the paste pattern of m is reached, the servo motor 12 is driven to raise the nozzle 13a, and the pattern drawing operation, that is, the pattern application (step 500) is completed.

Thereafter, in FIG. 4, the process proceeds to the substrate discharge (step 600), and in FIG. 1, the suction of the actual substrate to the substrate suction disk 4 is released, and the substrate transport conveyors 2a and 2b are lifted to remove the actual substrate 22. The substrate is then placed, and in this state, discharged out of the apparatus by the substrate transport conveyors 2a and 2b. Then, it is determined whether all the processes have been completed (step 70).
0). When a paste pattern is applied and drawn on a plurality of real substrates using the same paste pattern data, the process is repeated from mounting the substrate on each of the real substrates (step 300). Then, when the series of processing is completed for all the actual substrates, all the operations are completed (step 800).
Becomes

As described above, one embodiment of the present invention has been described, but the present invention is not limited to only such an embodiment.

That is, in the above embodiment, the nozzle is movable,
Although the substrate is fixed, the nozzle may be fixed and the substrate may be movable.

Even when the coating speed is reduced in the curved portion of the paste pattern, the coating height is reduced in a slow range to reduce the amount of the applied paste, and the amount of applied paste per unit time is constant over the entire paste pattern. It is also possible to apply and form a paste pattern having a desired shape with high accuracy.

Further, when the coating height is increased while the coating pressure is kept constant, and the coating speed is increased accordingly, the amount of paste applied per unit distance does not change, and the line width of the formed paste pattern is constant. There is no need to adjust the application pressure with poor response in the middle of drawing, and from the combination of application height and application speed, while maintaining high reliability, shorten the application / drawing time of the desired paste pattern. Productivity can be increased.

[0052]

As described above, according to the present invention,
It is easy to sharply adjust the amount of application, and a paste pattern having a desired shape can be formed with high accuracy.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a paste applicator according to the present invention.

FIG. 2 is an enlarged perspective view showing a paste storage cylinder and a distance meter shown in FIG. 1;

FIG. 3 is a block diagram showing a configuration of a control unit shown in FIG. 1 and a configuration of an air pressure control unit and a substrate control unit of a paste storage cylinder.

FIG. 4 is a flowchart showing one embodiment of a paste applying method according to the present invention in the paste applying machine shown in FIG. 1;

FIG. 5 is a diagram showing a specific example of application conditions set in step 200 in FIG.

FIG. 6 is a flowchart showing details of step 500 in FIG. 4;

FIG. 7 is a diagram showing a change in paste application amount with respect to a change in application height when the application pressure is the same.

[Explanation of symbols]

 13a: Nozzle 22: Substrate 23: Paste pattern

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Fukuo Yoneda 5-2-2 Koyodai, Ryugasaki-city, Ibaraki Pref. Hitachi Techno Engineering Co., Ltd. (72) Inventor Haruo Mikai 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki F-term (reference) in the Development Laboratory, Hitachi Techno Engineering Co., Ltd. 4D075 AA02 AA37 AA38 BB99X CA47 DA06 DC18 EA35 4F041 AA05 AA12 BA38

Claims (4)

[Claims] A substrate is placed on a table so as to face a discharge port of a nozzle, and a desired distance is provided between the nozzle and the substrate in a direction perpendicular to a main surface of the substrate. By discharging the paste filled in the paste storage cylinder from the discharge port onto the substrate while changing the relative positional relationship between the substrate and the nozzle in a direction parallel to the main surface of the substrate, In a paste application method for drawing a paste pattern of a desired shape, a distance between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate is changed, and the amount of the paste is proportional to the changed distance. Is applied onto the substrate. 2. The paste application method according to claim 1, wherein a change amount per unit time of a relative positional relationship between the substrate and the nozzle in a direction parallel to the main surface of the substrate is changed on the substrate. A paste pattern to be drawn in a desired shape. 3. A substrate is placed on a table so as to face a discharge port of a nozzle, and a desired distance is provided between the nozzle and the substrate in a direction perpendicular to a main surface of the substrate. By discharging the paste filled in the paste storage cylinder from the discharge port onto the substrate while changing the relative positional relationship between the substrate and the nozzle in a direction parallel to the main surface of the substrate, In the paste coating method for drawing a paste pattern having a desired shape, a relative positional relationship between the substrate and the nozzle in a direction parallel to the main surface of the substrate is detected during the drawing of the paste pattern, and the detected paste pattern drawing position is determined as desired. A paste application method, wherein the application amount is changed by changing a distance between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate when the application amount is changed. . 4. A substrate is placed on a table so as to face a discharge port of a nozzle, and a desired distance is provided between the nozzle and the substrate in a direction perpendicular to a main surface of the substrate. By discharging the paste filled in the paste storage cylinder from the discharge port onto the substrate while changing the relative positional relationship between the substrate and the nozzle in a direction parallel to the main surface of the substrate, A paste application machine that draws a paste pattern of a desired shape on a substrate, changing a distance between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate corresponding to an application amount of the paste pattern and an application amount of the paste pattern Storage means for storing data representing a relationship between the substrate and the nozzle and a relative position in a direction parallel to the main surface of the substrate; and a memory parallel to the main surface of the substrate and the nozzle in the paste pattern being drawn. Detecting means for detecting a relative position in the direction, and a relative position in a direction parallel to the main surface of the substrate with respect to the nozzle detected by the detecting means is a relative position for changing the application amount of the paste pattern; Changing means for changing the distance between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate corresponding to the application amount of the paste pattern corresponding to the relative position from the data stored in the storage means; A paste coating machine, comprising: