KR20000023264A - Paste coating machine - Google Patents

Abstract

PURPOSE: A paste spreader is provided to form a paste pattern of a specific shape as easily and rapidly adjusting paste spreading amount. CONSTITUTION: A method for changing a thickness of a paste spread contains the steps of adjusting a relative position with a nozzle(13a) and a real substrate(22), out letting a paste(23) from the outlet of a nozzle(13a) and spreading a wanted paste pattern on the surface of the real substrate. If the nozzle(13a) reaches to the decided position with previous change point on the real substrate(22), the spreading height is changed from the surface of the real substrate(22) to the paste outlet of the nozzle(13a) that is from spreading height 1 to the set length 2, and then paste amount is changed from the nozzle(13a). Thereby, a thickness of the paste spread is quickly changed by changing a pressure fed to a storage container having the nozzle(13a).

Description

Paste Applicator {PASTE COATING MACHINE}

According to the present invention, a substrate is placed on a table so as to face a discharge port of a nozzle, and a random (desired) distance is provided between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate, and the paste container is filled in the paste container. A paste applicator for applying a desired pattern of paste patterns onto a substrate by varying the relative positional relationship in a direction parallel to the substrate and the main surface of the nozzle while discharging the paste from the discharge port onto the substrate.

In the conventional paste applicator, in order to control the coating amount, the paste filled in the storage container is discharged from the nozzle onto the substrate, and the relative distance between the nozzle and the substrate in the direction perpendicular to the main surface of the substrate is independent of the curvature of the substrate main surface. Adjust to maintain at a predetermined (desired value), and adjust the relative movement speed between the nozzle and the substrate, that is, the speed (hereinafter referred to as the application speed) when applying the paste pattern or determine the amount of paste ejected from the nozzle. The application amount is adjusted by adjusting the pressure (hereinafter referred to as application pressure) applied to the paste storage container.

For example, when the application speed is constant, the application pressure is increased when increasing the discharge amount of the paste. On the contrary, when reducing the discharge amount of the paste, the discharge amount can be adjusted by decreasing the coating pressure. In addition, when the application pressure is constant, the application speed is lowered when increasing the discharge amount of the paste. On the contrary, when reducing the discharge amount of the paste, the discharge amount is adjusted by increasing the coating speed.

In a conventional paste applicator, the application amount is controlled by adjusting the application pressure or application speed on the premise that the relative distance between the nozzle and the substrate in the direction perpendicular to the main surface of the substrate is controlled to be kept constant regardless of the curvature of the substrate. I am adjusting.

When the paste coating amount is to be adjusted by the coating pressure, a propagation time is required until the result of adjusting the coating pressure is reflected in the discharge amount from the nozzle tip through the paste storage container. Proceed accordingly. For this reason, steep application amount adjustment was difficult.

In the adjustment of the paste coating amount by the coating speed, it is often already adjusted to the maximum speed as a means for improving the productivity, and if it is high speed, the paste coating amount only decreases, and the coating speed is increased without changing the coating amount per unit distance. It was impossible to do.

SUMMARY OF THE INVENTION An object of the present invention is to provide a paste applicator which solves such a problem and facilitates rapid application amount adjustment to form a desired paste pattern.

1 is a perspective view showing an embodiment of a base applicator according to the present invention;

2 is an enlarged perspective view showing a portion of the paste container and the rangefinder shown in FIG. 1;

FIG. 3 is a block diagram showing the structure of the control unit shown in FIG. 1 and the structure of the air pressure control unit and the substrate control unit of the paste storage container. FIG.

4 is a flowchart showing one embodiment of a paste coating method according to the present invention in the paste applicator shown in FIG. 1;

FIG. 5 is a view showing one specific example of coating conditions set in step 200 in FIG. 4;

6 is a flowchart showing the details of step 500 in FIG. 4;

Fig. 7 is a diagram showing a change in paste coating amount with respect to a change in coating height when the coating pressure is the same.

※ Explanation of symbols for main parts of drawing

13a: nozzle 22: substrate

23: paste pattern

In order to achieve the above object, the paste applicator according to the present invention places a substrate on a table so as to face a discharge port of a nozzle, and randomly (desirs) between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate. And the relative positional relationship in the direction parallel to the main surface of the substrate between the substrate and the nozzle while discharging the paste filled in the paste container from the discharge port onto the substrate. By drawing a desired pattern of paste on the substrate, the substrate and the nozzle changing the distance between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate corresponding to the coating amount of the paste pattern and the coating amount of the paste pattern. Showing the relationship with the relative position in the direction parallel to the main surface of the substrate Storage means for storing the data, detection means for detecting a relative position in a direction parallel to the main surface of the substrate with the nozzle in the paste pattern being drawn, and the nozzle detected with the detection means. The substrate corresponding to the coating amount of the paste pattern corresponding to the relative position from the data stored in the storage means when the relative position in the direction parallel to the main surface of the substrate is the relative position for changing the coating amount of the paste pattern. And changing means for changing the distance between the nozzle and the substrate in a direction perpendicular to the main surface of the substrate.

In order to achieve the above object, the paste applicator according to the present invention includes a means for applying a desired constant coating pressure to a paste filled in a paste storage container, and is parallel to the main surface of the substrate with the substrate and the nozzle. Changing means for changing the amount of change per unit time of the relative positional relationship in the direction;

When changing the change amount per unit time of the relative positional relationship in the direction parallel to the main surface of the said board | substrate of the said board | substrate and the said nozzle, the distance of the said nozzle and the said board | substrate in the direction perpendicular | vertical to the main surface of the said board | substrate In proportion to the change in the change amount or in a direction perpendicular to the main surface of the substrate while maintaining the change amount per unit time of the relative positional relationship in the direction parallel to the main surface of the substrate with the substrate and the nozzle. To increase or decrease the distance between the nozzle and the substrate.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment of this invention is described based on drawing.

1 is a perspective view showing an embodiment of a paste applicator according to the present invention, where 1 is a mount, 2a, 2b is a substrate conveying conveyor, 3 is a support, 4 is a substrate adsorption plate, 5 is a θ axis moving table, 6a, 6b is the X-axis movement table, 7 is the Y-axis movement table, 8a and 8b is the servo motor, 9 is the Z-axis movement table, 10 is the servo motor, 11 is the ball screw, 12 is the servo motor, 13 is the paste container 14) a rangefinder, 15 a support plate, 16a, 16b an image recognition camera, 17 a control unit, 18 a monitor, 19 a keyboard, 20 a personal computer main body equipped with an external storage device, and 21 a cable.

In the drawing, two substrate conveying conveyors 2a and 2b are provided on the mount 1 in parallel in the X-axis direction and are movable up and down. Carries horizontally in the axial direction. Moreover, the support stand 3 is provided on the mount 1, and the board | substrate adsorption board 4 is mounted on the support stand 3 via the (theta) axis moving table 5, and is mounted. The θ-axis moving table 5 rotates the substrate adsorption board 4 in the θ direction around the Z axis.

On the mount 1, further, the X-axis moving tables 6a and 6b are provided in parallel with the X-axis from outside the substrate conveying conveyors 2a and 2b, so as to cross between these X-axis moving tables 6a and 6b. The Y axis moving table 7 is provided. The Y-axis moving table 7 is horizontally conveyed in the X-axis direction by the power failure and the rotation (reverse rotation) of the servomotors 8a and 8b provided in the X axis movement tables 6a and 6b. On the Y-axis movement table 7, a Z-axis movement table 9 which moves in the Y-axis direction by a positive reversal of the ball screw 11 driven by the servomotor 10 is provided. The Z-axis movement table 9 is provided with a support plate 15 for holding and pasting the paste container 13 and the rangefinder 14, and the servomotor 12 replaces these paste containers 13 and the rangefinder 14 with each other. It moves in the Z-axis direction via the movable part of the linear guide which is not shown in figure which was provided in this support plate 15. As shown in FIG. The paste container 13 is detachably attached to the movable portion of the linear guide. Moreover, the image recognition cameras 16a and 16b for aligning the board | substrate which are not shown in figure in the upper board of the mount 1 are installed upwards.

Inside the mount 1, a control unit 17 for controlling the servomotors 8a, 8b, 10, 12, 24 (not shown) and the like is provided, and the control unit 17 passes through the cable 21. It is connected to the monitor 18, the keyboard 19, and the personal computer main body 20, and is input from the data for the various processes in the control part 17, such as the keyboard 19, and image recognition cameras 16a and 16b. ) And the processing status of the control unit 17 are displayed on the monitor 18.

Data input from the keyboard 19 is stored in a storage medium such as a floppy disk by an external storage device of the personal computer main body 20.

FIG. 2 is an enlarged perspective view showing a portion of the paste container 13 and the distance meter 14 shown in FIG. 1, wherein 13a is a nozzle, 22 is a substrate, 23 is a paste pattern, and the same reference numerals are used for the parts corresponding to FIG. Attaching.

In the figure, the distance meter 14 has a triangular notch at its lower end, and a light emitting element and a plurality of light receiving elements are provided at the notch. The nozzle 13a is located below the notch part of the rangefinder 14. The rangefinder 14 measures the distance from the tip of the nozzle 13a to the surface of the substrate 22 by noncontact triangulation. That is, a light emitting element is provided on one inclined surface of the notch of the triangle, and the laser light L emitted from the light emitting element is reflected at the measurement point S on the substrate 22, and on the other side of the notch portion. The light is received by any one of the plurality of light receiving elements provided on the inclined surface. Therefore, the laser beam L is not blocked by the paste container 13 or the nozzle 13a.

Moreover, the measurement point S of the laser beam L on the board | substrate 22 and the position just under the nozzle 13a are shift | deviated by some distance ((DELTA) X, (DELTA) Y) on the board | substrate 22, and this slight Since there is no difference in the bending (unevenness) of the surface of the substrate 22 between the positions deviated by the distances ΔX and ΔY, the measurement results of the distance meter 14 and the tip of the nozzle 13a to the surface of the substrate 22 There are few cars in between. Therefore, the servomotor 12 is controlled based on the measurement result of the distance meter 14 to maintain the distance from the tip of the nozzle 13a to the surface of the substrate 22 at a predetermined value in accordance with the curvature of the surface of the substrate 22. do.

FIG. 3 is a block diagram showing the configuration of the controller 17 shown in FIG. 1, the control of the air pressure in the paste storage container 13, and the control of the substrate 22, where 17a is a microcomputer, 17b is a motor controller, 17c1, 17c2. Is X1, X2-axis driver, 17d is Y-axis driver, 17e is θ-axis driver, 17f is Z-axis driver, 17g is data communication bus, 17h is external interface, 24 is θ-axis moving table 5 (Fig. 1) Servo motor to drive, 25 to 29 is an encoder, 30 is a constant pressure source, 30a is a constant pressure regulator, 31 is a negative pressure source, 31a is a negative pressure regulator, 32 is a valve unit, and the same reference numerals are applied to the parts corresponding to FIGS. 1 and 2. It is sweet.

In the figure, the control unit 17 is an image obtained by the microcomputer 17a, the motor controller 17b, the axis drivers 17c1 to 17f of X, Y, Z, and θ, and the image recognition cameras 16a and 16b. The external interface 17h for transmitting signals between the image processing apparatus 17i for processing signals and the keyboard 19 and the like is incorporated. The control unit 17 also includes a drive control system for the substrate conveying conveyors 2a and 2b, but is not shown here.

Although not shown, the microcomputer 17a stores a ROM storing processing programs for performing application drawing of the main computing unit and the paste described later, the results of processing at the main computing unit, the external interface 17h, and the motor controller 17b. RAM for storing input data, and an input / output unit for exchanging data with an external interface 17h or motor controller 17b. Each servomotor 8a, 8b, 10, 12, 24 is provided with encoders 25 to 29 for detecting the rotation amount, and the detection results are shown for the respective axis drivers 17c1 to 17f of X, Y, Z and 0. Return to) to perform position control.

The servo motors 8a, 8b, and 10 are inputted from the keyboard 19 and rotated forward and backward based on the data stored in the RAM of the microcomputer 17a. 4) The nozzle 13a (FIG. 2) moves the arbitrary distance to the X- and Y-axis directions through the Z-axis movement table 9 (FIG. 1) with respect to the board | substrate 22 vacuum-adsorbed to (FIG. 1). During the movement, a slight air pressure is applied to the paste container 13 from the constant pressure source 30 via the constant pressure regulator 30a and the valve unit 32 by controlling the valve unit 32. Then, the paste is discharged from the discharge port of the tip of the nozzle 13a, and the desired pattern of the paste is applied onto the substrate 22. During horizontal movement of the Z-axis movement table 9 in the X and Y-axis directions, the distance meter 14 measures the distance between the nozzle 13a and the substrate 22 to maintain this distance at all times. The motor 12 is controlled by the Z-axis driver 17f.

In the standby state where no paste is applied, the microcomputer 17a controls the valve unit 32 so that the negative pressure source 31 is connected to the paste container 13 through the negative pressure regulator 31a and the valve unit 32. The paste, which has been separated from the discharge port of the nozzle 13a, is returned to the paste container 13 through the nozzle. Thereby, the fall of the liquid of the paste from this discharge port can be prevented. Moreover, the negative pressure source 31 may communicate with the paste storage container 13 only when the liquid discharge drips by monitoring the discharge port of this nozzle 13a with the image recognition camera which is not shown in figure.

4 is a flowchart showing an embodiment of a paste coating method according to the present invention in the paste applicator shown in FIG. 1.

In the figure, when power is first supplied to the paste applicator (step 100), the initial setting is executed (step 200).

In this initial setting, in Fig. 1, the Z-axis moving table 9 is moved in the X and Y directions by the servomotors 8a, 8b and 10 to position the nozzle 13a at a predetermined reference position (Fig. 2). ) Is set to a predetermined origin position so that the paste discharge port is positioned at the position at which the paste is discharged (i.e., the paste coating start point), but is also placed on a substrate (hereinafter referred to as a real substrate) to which the paste pattern is to be drawn. Data for one or more paste patterns to be applied for drawing (hereinafter, referred to as paste pattern data) is composed of a series of positional data constituting a paste pattern to be coated and formed on a real substrate, and data of application conditions for each paste pattern are inputted. do. Input of these data is performed by the keyboard 19 (FIG. 1), and these input data are stored in RAM built in the microcomputer 17a (FIG. 3).

This application condition is that if there are m paste patterns (where m is an integer of 1 or more) applied to one actual substrate at present, these paste patterns are represented by the pattern No. 1, 2,... ,… m paste pattern, and the relative speed between the actual substrate and the nozzle when the paste is actually applied to the actual substrate for each paste pattern (this is referred to as the application rate, in particular, the application speed in this case) is initially set. The application speed to the paste container 13 which determines the amount of paste ejected from the nozzle (this is called the application pressure, in particular the application pressure in this case is referred to as the initial application application pressure), and the substrate surface. Each of data such as the height of the nozzle from the nozzle (this is referred to as application height, in particular, the application height in this case is referred to as the initial application application height), and a change point indicating a position (point) at which the paste discharge amount should be changed. As a change point, for example, the paste is applied in order to increase (or decrease) the coating pattern higher (or lower) than other portions, or to apply the paste at the same height as the straight line, such as the bent portion of the pattern. Is a point at which the discharge amount per unit time is changed.

Here, it is assumed that there are n change points in each paste pattern (where n is O or an integer of 1 or more), and each change point is changed to change points 1, 2,... ,… and n. In this case, the position of the change point on the actual substrate is changed to change point 1 = (Xi1, Yil) for the paste pattern of pattern number i (where i = 1, 2, ..., m). Point 2 = (Xi2, Yi2),... ,… , Change point n = (Xin, Yin). For example, in the case of a paste pattern of pattern number 1, each change point is changed point 1 = (X11, Y1), change point 2 = (X12, Y12),... ,… , Change point n = (Xln, Yln).

In addition, the data of the application height are set at the change point and other positions, respectively, in FIG. 5, application heights 1 and 2 are set, and application height 2 is the application height at the change points 1 to n. The prescribed height and the application height 1 define the application height at other positions. Of course, when the application height is different between the change points, that is, when the same application height is maintained from one change point to the next, the application height is set between each change point. The position data of the change points 1 to n is any of the paste pattern data. When the application height is changed in a predetermined area having a certain length on the paste pattern, all of the position data of the area is applied as the change point. It is set as a condition.

Although not shown in FIG. 5, the coating pattern movement data, starting point coordinates, end point coordinates, measurement position data of the applied paste pattern, color back pressure, and the like are also set in the coating conditions.

When the above initial setting (step 200) is completed, the actual substrate is next mounted on the substrate adsorption board 4 (FIG. 1) and held by adsorption (step 300). In this board mounting, the board | substrate conveying conveyors 2a and 2b (FIG. 1) are conveyed to the upper side of the board | substrate adsorption board 4 in the X-axis direction, and these board | substrate conveying conveyors 2a and 2b are carried out by the lifting means which are not shown in figure. The lower substrate is placed on the substrate adsorption board 4 by lowering the?

Subsequently, the substrate preliminary positioning (step 400) is performed. In this process, alignment of the real substrate in the X and Y directions is performed by a positioning chuck not shown in FIG. In addition, the positioning marks of the actual substrates mounted on the substrate adsorption board 4 are photographed by the image recognition cameras 16a and 16b to obtain the center positions of the positioning marks by image processing, and the inclination of the actual substrates in the θ direction is determined. The servomotor 24 (FIG. 3) is driven accordingly, and the inclination of the θ direction is corrected accordingly.

In addition, when the remaining amount of paste in the paste container 13 is small and there is a possibility that the paste may be cut off in the middle of the paste pattern coating operation, the paste container 13 is replaced with the nozzle 13a in advance, but the nozzle 13a is replaced with the nozzle 13a. In the case of replacement, the positional shift of the installation position may occur as compared with before replacement, which may impair reproducibility. Therefore, in order to ensure reproducibility, the paste is applied in the shape of a cross using a new nozzle 13a which is replaced in a place where the paste on the actual substrate is not applied, and the center position of the intersection point of the cross coating pattern is obtained by image processing. The distance between the position and the center position of the positioning mark on the actual substrate is calculated and the microcomputer 17a is used as the displacement amount (dx, dy) (Fig. 2) of the paste discharge port of the nozzle 13a. Store in the built-in RAM.

The above is the preliminary positioning of the substrate with respect to the actual substrate (step 400), and the nozzle 13a at the time of application of the paste pattern to be performed later is made by using the displacement amounts (dx, dy) of the nozzle 13a. Correct the position shift.

Next, the pattern No. The paste pattern coating (step 500) is performed in sequence from the paste pattern data of 1. This will be described in detail with reference to FIG. 6.

In the drawing, first, application conditions are set (step 501). Here, in the RAM of the microcomputer 17a (FIG. 3), there is provided a storage table in which paste pattern data of each paste pattern and application conditions as shown in FIG. 5 are stored. The paste pattern data and application conditions of the pattern are read out from this storage table and stored in the predetermined area of the RAM so as to be usable by the microcomputer 17a. Here, first, the pattern No. Since the paste pattern of 1 is applied and drawn, the application conditions in this case are shown in FIG. 5 as follows: coating speed = V1, coating pressure = P1, coating height 1 = H11, coating height 2 = H12, change point coordinate 1 = (X11, Yl1 ), Change point coordinate 2 = (X12, Y12),... ,… The change point coordinate n = (Xln, Yln) is read out from the storage table and stored in the predetermined area of the RAM for use by the microcomputer 17a.

After the setting of the application conditions is completed, the servo motors 8a, 8b and 10 (FIG. 1) are driven next to move the nozzle 13a on the starting point of drawing (application) (step 502). In order to position the ejection opening of the nozzle 13a at this application start position, the Z-axis movement table 9 (FIG. 1) is moved to perform the comparison and adjustment movement of the nozzle position. The positional displacement amount (dx, dy) of the nozzle 13a obtained in step 400 of 4 and stored in the RAM of the microcomputer 17a is a permissible range (ΔX,) of the positional displacement amount of the nozzle 13a shown in FIG. It is judged whether or not in ΔY). If the amount of displacement (dx, dy) is within the allowable range (i.e., ΔX ≥ dx and ΔY ≥ dy), it remains as it is, and if it is out of the allowable range (i.e., ΔX <dx or ΔY <dy), the positional deviation By moving the Z-axis moving table 9 based on the amounts dx and dy to adjust the paste container 13, the position shift between the paste discharge port of the nozzle 13a and the desired position of the actual substrate is eliminated. The nozzle 13a is initially positioned at a desired position.

Next, the servomotor 12 (FIG. 1) is driven to set the height of the nozzle 13a (step 503). The set height is the coating height 1 (specifically, the height H1 in Fig. 5) which is already set on the coating condition of pattern No. 1 read from the storage table of the RAM, and the surface of the actual substrate from the discharge port of the nozzle 13a. The distance to is set at this coating height H1.

After the above processing is finished, the servomotors 8a, 8b, 10 (FIG. 1) are driven based on the paste pattern data stored in the RAM of the microcomputer 17a, and thus the paste of the nozzle 13a is pasted. The discharge port is moved in the X and Y directions in accordance with the paste pattern data in a state where the discharge port is opposed to the real substrate (step 504). In addition, through the valve unit 32 (FIG. 3) from the positive pressure source 30 (FIG. 3) to the paste container 13, the static pressure regulator 30a (FIG. 3) is applied under the conditions of the application of the pattern No. 1. The air pressure adjusted to the coating pressure P1 is applied to start discharging the paste from the paste discharge port of the nozzle 13a (step 505). At this time, the paste is adjusted to the color back pressure by the negative pressure regulator 31a (Fig. 3) from the negative pressure source 31 (Fig. 3) to the paste storage container 13 via the valve unit 32 (Fig. 3) immediately before discharging. The applied negative pressure is applied for some time to suck the paste accumulated at the paste discharge port of the nozzle 13a, so that the paste can be applied at the start end without accumulation of the paste.

At the same time as the application of the drawing operation, the microcomputer 17a introduces the measurement data of the distance between the distance between the paste ejection port of the nozzle 13a and the surface of the real substrate from the rangefinder 14 to correct the curvature of the surface of the real substrate. By measuring and driving the servomotor 12 according to the measured value, as shown in Fig. 7 (a), the set height of the nozzle 13a from the surface of the actual substrate is constant, that is, the application condition of the pattern No. 1 described above. The application height is maintained so as to be 1, and the application of the paste pattern is performed (step 506).

In addition, the microcomputer 17a reads the application position of the paste pattern on the actual substrate, that is, the coordinates from the motor controller 17b (step 507), and changes point 1 (X11, Yl1 in the application conditions of the pattern No. 1). ) Is determined (step 508).

When this change point 1 is reached, the space | interval between the paste application surface of a real board | substrate and a nozzle is changed into the application height 2 = H12 from application height 1 = Hl1 of the application condition of the said pattern No.1 (step 509). This is done by driving the servomotor 12. Fig. 7 (b) shows the state at the change point 1, where H1 > H12. Change points 1, 2,... ,… In the case where it is continued, the application height of the paste pattern is continued while the application height 2 = H12 is set.

Here, as shown in Fig. 7 (b), at the change point at which the coating height is lowered, if there is no change in the application speed and the application pressure, the paste discharged from the nozzle 13a is subjected to the reaction force from the actual substrate and the discharge resistance is increased. Since it becomes large, it becomes difficult to discharge from the nozzle 13a, and the coating amount of paste reduces as much as the application height was lowered. On the contrary, when the coating height 2 = H12 becomes higher than the coating height 1 = Hl1, since the nozzle 13a is separated from the actual substrate, the reaction force from the actual substrate becomes small and the discharge resistance becomes small, which causes the paste to form the nozzle 13a. It is easy to come out from the), and the application amount of the paste increases. Therefore, the relationship between the application speed, application pressure, application height 1, application height 2, and the like and the position coordinates of the change point are set as application conditions shown in Fig. 5 and stored in a storage table in the RAM of the microcomputer 17a. By adjusting the application height of the paste at any position of the paste pattern, the application amount of the paste on the actual substrate can be adjusted.

In this way, the application of the paste pattern is performed. However, the determination of whether to continue or terminate the application of the paste pattern is performed by determining whether the coating point is the end of the paste pattern to be applied, which is determined by the paste pattern data. If it is determined (step 510), if it is not the end, it returns to the measurement process of the surface curvature of a real board, ie, application | coating height control (step 506), and then performs coordinate confirmation (step 507). Each time the change point is reached, the application height is changed to change the application height up to the change point n.

Hereinafter, when the above steps are repeated to reach the end of the application of the paste pattern, the constant pressure regulator 30a is transferred from the constant pressure source 30 (FIG. 3) to the paste container 13 through the valve unit 32 (FIG. 3). Application of the air pressure adjusted to the coating pressure P1 by FIG. 3 is stopped, and paste discharge from the paste discharge port of the nozzle 13a is stopped (step 511).

This paste pattern application operation is performed until all of the set m paste pattern data are finished (step 512). When the end of the paste pattern of m is reached, the servomotor 12 is driven to raise the nozzle 13a to finish the pattern drawing operation, that is, the pattern application (step 500).

Subsequently, the process proceeds to the substrate discharge (step 600) in FIG. 4, and the adsorption to the substrate adsorption board 4 of the actual substrate is released in FIG. 1, thereby raising the substrate transport conveyors 2a and 2b and raising the actual substrate. (22) is loaded and discharged out of the apparatus by the substrate transfer conveyors 2a and 2b in this state. Then, it is determined whether or not the previous step is completed (step 700). When the paste pattern is applied and drawn on the plurality of real substrates using the same paste pattern data, the process is repeated from the substrate mounting (step 300) for each real substrate. And when such a series of processes are complete | finished with respect to all the real board | substrates, all work is complete | finished (step 800).

As mentioned above, although one Embodiment of this invention was described, this invention is not limited to such embodiment.

That is, in the said embodiment, although a nozzle was movable and a board | substrate was fixed, you may fix a nozzle and make a board | substrate move.

In addition, even when the coating speed is slowed at the curved portion of the paste pattern, the coating height is decreased in a slow range to reduce the paste coating amount, so that the paste coating amount per unit time is constant throughout the paste pattern, and the desired paste pattern is high. It is also possible to apply | coat and form with precision.

If the coating pressure is made constant and the coating height is made high and the coating speed is made high, the paste coating amount per unit distance does not change, and the line width of the formed paste pattern is constant. The productivity can be increased by shortening the application drawing time of the desired paste pattern while maintaining high reliability from the combination of application height and application speed without adjusting the adjustment in the middle of the drawing.

In addition, if the coating height is increased or decreased while the coating pressure is kept constant, the application amount of paste per unit distance is increased or decreased. A paste pattern can be obtained by changing the line width at a desired position.

As described above, according to the present invention, steep application amount adjustment can be easily performed, and the desired paste pattern can be formed with high accuracy.

Claims (4)

The substrate 22 is placed on the table 4 so as to face the discharge port of the nozzle 13a, and between the nozzle 13a and the substrate 22 in a direction perpendicular to the main surface of the substrate 22. At a desired distance, while discharging the paste filled in the paste container 13 from the discharge port onto the substrate 22, the substrate 22 of the substrate 22 and the nozzle 13a In the paste applicator which draws the desired paste pattern 23 on the said board | substrate 22 by changing the relative positional relationship in the direction parallel to a main surface, The substrate for changing a distance between the nozzle 13a and the substrate 22 and a coating amount of the paste pattern 23 in a direction perpendicular to the main surface of the substrate 22 corresponding to the coating amount of the paste pattern 23. Storage means (RAM of 17a) for storing data indicating a relationship between the relative position in the direction parallel to the main surface of the substrate 22 between the nozzle 22 and the nozzle 13a; Step 507 performed by detection means 17a for detecting the relative position in the direction parallel to the main surface of the substrate 22 between the substrate 22 and the nozzle 13a in the paste pattern 23 during drawing )and, The storage means when the relative position in the direction parallel to the main surface of the substrate 22 with the nozzle 13a detected by the detection means 17a is a relative position that changes the application amount of the paste pattern 23. The nozzle 13a and the substrate 22 in a direction perpendicular to the main surface of the substrate 22 corresponding to the application amount of the paste pattern 23 corresponding to the relative position from the data stored in 17a; A paste applicator, comprising: distance changing means (step 509 performed in 17a) for changing to a distance of? The method of claim 1, A paste applicator, comprising means (30a) for applying a desired constant coating pressure to a paste filled in a paste container (13). The method of claim 1, Change amount changing means for changing a change amount per unit time of a relative positional relationship in a direction parallel to the main surface of the substrate 22 between the substrate 22 and the nozzle 13a, In the distance changing means 17a when the change amount changing means changes the change amount per unit time of the relative positional relationship in a direction parallel to the main surface of the substrate 22 between the substrate 22 and the nozzle 13a. And the step (509) to be carried out changes the distance between the nozzle (13a) and the substrate (22) in a direction perpendicular to the main surface of the substrate (22) in proportion to the change of the change amount. The method of claim 1, Change amount changing means for changing a change amount per unit time of a relative positional relationship in a direction parallel to the main surface of the substrate 22 between the substrate 22 and the nozzle 13a, The distance change when the relative position in the direction parallel to the main surface of the substrate 22 with the nozzle 13a detected by the detection means 17a is a relative position that changes the application amount of the paste pattern 23. Step 509 performed in the means 17a causes the change amount changing means to maintain the change amount per unit time of the relative positional relationship in the direction parallel to the main surface of the substrate 22 between the substrate 22 and the nozzle 13a. And a distance between the nozzle (13a) and the substrate (22) in a direction perpendicular to the main surface of the substrate (22) is increased or decreased.