JP2000091488A - Resin-sealed semiconductor device and circuit member used therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve mounting density on a circuit substrate by a method, wherein a die pad provided with a plurality of suspended leads is electrically independently disposed at a substantially center part of a plane, the part of a projection part having an external terminal configuration provided on the reverse face is exposed to the outside, and a semiconductor element is mounted on a die pad surface by electrically insulating each other. SOLUTION: A die pad is electrically disposed independently at a substantially the center part of a plane, where a terminal part 4 is two-dimensionally disposed. A suspension lead 7 is electrically extended independently from four corners of the die pad, and a projection part 8 having an external terminal configuration is provided on the reverse face of the suspension lead 7. A face of the projection part 8 having an external terminal configuration is configured as the same face as the face of an external terminal 4B of the terminal part 4. Next, each terminal 52a of a semiconductor element 52 mounted on the die pad is connected to an internal terminal 4A (a silver-plated layer 5) of the terminal part 4 with a bonding wire 54. Then, the terminal part 4, the die pad, the suspension lead 7, the semiconductor element 52, and the bonding wire 54 are sealed with a sealing member 55, so that a part of the external terminal 4B and the projection part 8 having external terminal configuration is exposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device having a semiconductor element mounted thereon and a circuit member used for the semiconductor device.

[0002]

2. Description of the Related Art In recent years, semiconductor devices have been typified by LSI ASICs due to advances in high integration and miniaturization technologies, and the trend toward higher performance and lighter, thinner and smaller electric appliances (current trend).
It is becoming more and more highly integrated and highly functional.

Accordingly, the development trend of the resin-encapsulated semiconductor device using a lead frame is based on SOJ (Small Outline J-Lea).
dedPackage) or QFP (Quad Flat)
Through a surface mount type package such as a TSOP (Thin Small Outlin).
ePackage) has been developed to reduce the size of the package with a focus on thinning, and the LO for improving the chip storage efficiency by making the package three-dimensional.
C (Lead On Chip) structure has been developed.

[0004]

However, resin-encapsulated semiconductor device packages are required to have higher integration, higher functionality, more pins, thinner, and smaller. Even in a conventional package, there is a limit to miniaturization of the package because there is a routing of a lead in an outer peripheral portion of the semiconductor element.

On the other hand, as a miniaturized resin-sealed semiconductor device, an area array type CSP (Chip Scalp) is used.
ePackage) has been proposed. This CSP
Are mounted on a circuit board using solder balls, but there are problems in terms of reliability and a problem that a polyimide substrate to be used is expensive.

For this reason, it is advantageous in terms of reliability and manufacturing cost as compared with the CSP using a polyimide substrate, and
In addition, there is a demand for the development of a semiconductor device using the same metal material as a general-purpose lead frame as a device that can be mounted in a chip size.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has a high occupancy rate of a semiconductor element, can be reduced in size, and can improve a mounting density on a circuit board.
It is still another object of the present invention to provide a resin-sealed semiconductor device capable of coping with the increase in the number of pins and a circuit member used for the resin-sealed semiconductor device.

[0008]

In order to achieve the above object, a resin-encapsulated semiconductor device according to the present invention comprises a plurality of terminals having an internal terminal on the front side and an external terminal on the back side integrally formed front and back. Parts are arranged two-dimensionally and electrically independent of each other in a substantially plane, and the internal terminals of the terminal parts and the terminals of the semiconductor element are electrically connected by wires. In a resin-sealed semiconductor device in which the entire portion is resin-sealed so as to expose a portion to the outside, a die pad including a plurality of suspension leads substantially at a central portion of a plane on which a plurality of the terminal portions are two-dimensionally arranged Are electrically independently arranged, and the plurality of suspension leads extend in a plane in which the terminal portions are two-dimensionally arranged, and have an external terminal shape convex portion on the back surface, and the external terminal shape convex portion. A part of the part is exposed to the outside, and the semiconductor element It was electrically insulated as mounted in structure on the surface of the pad.

Further, the resin-encapsulated semiconductor device of the present invention comprises:
The surface of the die pad is substantially flush with the surface of the internal terminal of the terminal portion.

Further, the resin-encapsulated semiconductor device of the present invention comprises:
The die pad is provided with one or more external terminal-shaped protrusions on the back surface, and a part of the external terminal-shaped protrusions is exposed to the outside.

Further, the resin-encapsulated semiconductor device of the present invention is configured such that external terminals exposed to the outside and external electrodes made of solder are provided on the external terminal-shaped projections.

A circuit member according to the present invention is a circuit member for a resin-encapsulated semiconductor device. The circuit member includes an outer frame member and a plurality of protrusions independently protruding from the outer frame member via connection leads. And a die pad held from the outer frame member via a plurality of suspension leads, each terminal section having an internal terminal on the front side and external terminals on the back side integrally with the front and back, The lead was provided with an external terminal-shaped convex portion on the back surface, and the external terminal surface and the external terminal-shaped convex portion surface were located on substantially one plane.

Further, the circuit member of the present invention is configured such that the surface of the die pad is substantially flush with the surface of the internal terminal of the terminal portion.

Further, in the circuit member of the present invention, the die pad has one or more external terminal-shaped convex portions on the back surface, and the external terminal-shaped convex surface and the external terminal surface are positioned on substantially one plane. Configuration.

Further, the circuit member of the present invention is configured such that an electrically insulating double-sided adhesive tape is integrally provided on the surface of the die pad.

According to the present invention, the occupancy of the semiconductor element is improved, and the external terminal-shaped projection provided on the back surface of the suspension lead extending from the die pad and the external terminal-shaped projection provided on the back surface of the die pad are provided. In mounting a resin-encapsulated semiconductor device on a circuit board such as an LGA (Land Grid Array) that does not use solder balls, the external part of the terminal part is connected to the circuit board in the same manner as the external terminal of the terminal part. BGA that reduces stress load per terminal and uses solder balls
When mounting a resin-encapsulated semiconductor device such as a (Ball Grid Array) on a circuit board, each of the solder balls is connected to the circuit board via a solder ball in the same manner as an external terminal of a terminal portion. It acts to reduce the stress load on the body.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. Plan view showing an embodiment of a circuit member for a circuit member Figure 1 the invention of the present invention, FIG. 2 is a longitudinal sectional view along A-A taken along the line of the circuit member shown in FIG. 1, FIG. 3 to FIG. 1 It is a longitudinal cross-sectional view in the BB line arrow of the circuit member shown. 1 to 3, a circuit member 1 according to the present invention includes an outer frame member 2 and a plurality of terminals projecting from an inner end 2 a of the outer frame member 2 via connection leads 3 independently of each other. Part 4 and inner edge 2a of outer frame member 2
At a predetermined location (in the illustrated example, the inner side edge 2a of the outer frame member 2)
And the die pad 6 disposed from the four corners) via the suspension leads 7.

The outer frame member 2 has a rectangular corridor having an outer shape and an inner opening shape, and each connection lead 3 is projected from the inner side 2a of the outer frame member 2 in the same plane.

The terminal portion 4 is provided at the tip of the connection lead 3, and has an internal terminal 4A on the front side and an external terminal 4B on the rear side integrally. In the illustrated example, a silver plating layer 5 is provided on the internal terminals 4A, and the external terminals 4B
The surfaces are located on substantially the same plane.

The die pad 6 has the same thickness as the terminal 4 and is supported by the four suspension leads 7 extending from the four corners of the inner end 2a of the outer frame member 2 as described above. An external terminal-shaped convex portion 8 is provided on the back surface of the suspension lead 7, and the external terminal-shaped convex portion 8
It is located on substantially the same plane as the surface.

The material of such a circuit member 1 can be 42 alloy (Ni 41% Fe alloy), copper, copper alloy or the like.

The circuit member 1 of the present invention may be one in which an electrically insulating double-sided adhesive tape is integrally provided on the front side 6a of the die pad 6. Double-sided adhesive tape
It has an adhesive layer on both sides of an electrically insulating base film. For example, UPILEX (Ube Industries, Ltd.)
Double-sided adhesive tape such as UX1W (manufactured by Hamakawa Paper Co., Ltd.) having RXF (adhesive manufactured by Hamakawa Paper Mills) layers on both sides of an electrically insulating film (manufactured by Hamakawa Paper Mills) can be used.

FIG. 4 is a longitudinal sectional view corresponding to FIG. 2 showing another embodiment of the circuit member of the present invention, and FIG. 5 is a longitudinal sectional view equivalent to FIG. 4 and 5, a circuit member 11 according to the present invention includes an outer frame member 12 and a plurality of terminal portions protruding from the inner end of the outer frame member 12 via connection leads 13 independently of each other. 14 and predetermined locations on the inner edge of the outer frame member 12 (four corners of the inner edge of the outer frame member 12 in the illustrated example)
From a die pad 16 disposed via a suspension lead 17
Is provided. The terminal portion 14 has an internal terminal 14A on the front surface side and an external terminal 14B on the back surface integrally on the front and back sides, and an external terminal-shaped convex portion 18 is provided on the back surface of the suspension lead 17. The surface of the shape convex portion 18 is located on substantially the same plane as the surface of the external terminal 14B.

In this circuit member 11, the die pad 16 has a thickness that is approximately half the thickness of the terminal portion 14, and the front side 16a is located on substantially the same plane as the surface of the internal terminal 14A of the terminal portion 14.

FIG. 6 is a longitudinal sectional view corresponding to FIG. 2 showing another embodiment of the circuit member of the present invention. 6, a circuit member 21 of the present invention includes an outer frame member 22 and an outer frame member 22.
And a plurality of terminal portions 24 projecting independently from each other via connection leads 23 from the inner side of the outer frame member 22 at predetermined locations (in the illustrated example, the inner side of the outer frame member 22). A die pad 26 is provided from the four corners (ends) via suspension leads (not shown). The terminal section 24 has an internal terminal 24A on the front side and an external terminal 2A on the rear side.
4B are integrally formed on the front and back sides, and on the back surface of the suspension lead (not shown), an external terminal shape convex portion (not shown) is provided similarly to the suspension lead 7 of the circuit member 1. The component surface is located on substantially the same plane as the external terminal 24B surface.

In this circuit member 21, the die pad 26 has substantially half the thickness of the terminal portion 24, and a plurality of external terminal-shaped projections 29 are provided on the back surface 26b. Such an external terminal-shaped projection 29 is provided on the rear surface 2 of the die pad 26.
6b can be provided at predetermined intervals along the outer peripheral portion,
Also, one or more die pads 26 may be provided at the center of the back side 26b.

FIG. 7 is a longitudinal sectional view corresponding to FIG. 2 showing another embodiment of the circuit member of the present invention. 7, a circuit member 31 according to the present invention includes an outer frame member 32 and the outer frame member 32.
A plurality of terminal portions 34 projecting independently from each other through connection leads 33 from the inner side of the outer frame member 32 and a predetermined portion of the inner side of the outer frame member 32 (in the illustrated example, the inner side of the outer frame member 32). A die pad 36 is provided from the four corners (ends) via suspension leads (not shown). The terminal section 34 has an internal terminal 34A on the front side and an external terminal 3A on the rear side.
4B are integrally formed on the front and back sides, and on the back surface of the suspension lead (not shown), an external terminal shape convex portion (not shown) is provided similarly to the suspension lead 7 of the circuit member 1. The component surface is located on substantially the same plane as the external terminal 34B surface.

In this circuit member 31, the die pad 36 has substantially the same size and approximately half thickness as the terminal portion 34, and is provided with an external terminal-shaped convex portion 39 on the back surface side. They have substantially the same shape.

The material of such circuit members 11, 21, 31 can be 42 alloy (Ni 41% Fe alloy), copper, copper alloy or the like.

The circuit members 11, 21, 31 of the present invention
Are the front sides 16a, 26 of the die pads 16, 26, 36.
a, 36a may be provided with an electrically insulating double-sided adhesive tape integrally provided. The double-sided adhesive tape is provided with an adhesive layer on both sides of an electrically insulating base film. For example, RXF (Hawakawa Paper Co., Ltd.) is provided on both sides of Upilex (an electrically insulating film manufactured by Ube Industries, Ltd.). A double-sided adhesive tape such as UX1W (manufactured by Hamakawa Paper Mills) having an adhesive (made in Japan) layer can be used.

The above-mentioned circuit members 1, 11, 21, 31
, The number of terminals, the arrangement of the terminals, the positions of the suspension leads, the number and arrangement of the external terminal-shaped protrusions, and the like are examples, and the circuit member of the present invention is not limited thereto. For example, a plurality of external terminal-shaped protrusions may be provided on the back surface of one suspension lead. Resin-sealed semiconductor device 8 of the present invention is a plan view showing an embodiment of a resin-sealed semiconductor device of the present invention using a circuit member of the invention shown in FIGS. 1 to 3, 9 FIG. 10 is a vertical cross-sectional view of the resin-encapsulated semiconductor device shown in FIG. 8 taken along line CC. FIG. 10 is a vertical cross-sectional view of the resin-encapsulated semiconductor device shown in FIG. FIG. In order to facilitate understanding of the configuration of the semiconductor device, a sealing member 55 to be described later is omitted in FIG. 8, and the sealing member 55 is indicated by a virtual line (2 in FIGS. 9 and 10).
(Dashed line).

8 to 10, a resin-sealed semiconductor device 51 according to the present invention has a semiconductor element 52 on the front side 6a of a die pad 6 with an electrically insulating double-sided adhesive tape 53 interposed therebetween.
Is fixedly mounted on the surface opposite to the terminal surface. The terminals 52 a of the mounted semiconductor element 52 are arranged along each side of the semiconductor element 52.

The terminal section 4 has a pair of internal terminals 4A on the front side and a pair of external terminals 4B on the back side, and the terminal sections 4 are two-dimensionally electrically independent of each other in substantially one plane. It is arranged.

The die pad 6 is arranged at substantially the center of the plane on which the terminal portions 4 are two-dimensionally arranged, independently of the terminal portions 4. From four corners of the die pad 6, suspension leads 7 extend electrically independently in a plane where the terminal portions 4 are two-dimensionally arranged. A part 8 is provided. The surface of the external terminal-shaped projection 8 constitutes substantially the same surface as the surface of the external terminal 4B of the terminal portion 4.

Each terminal 52a of the semiconductor element 52 mounted on the die pad 6 is connected to the internal terminal 4A of the terminal portion 4.
(Silver plating layer 5) is connected by a bonding wire 54.

The terminal portion 4, the die pad 6, the suspension leads 7, the semiconductor element 52, and the bonding wires 54 are sealed so that a part of the external terminal 4B and a part of the external terminal shape projection 8 are exposed to the outside. It is sealed by the stop member 55. The sealing member 55 can be formed using a known resin material used for a resin-sealed semiconductor device. In the illustrated example, the external terminals 4B exposed to the outside
Is provided with an external electrode 56 made of solder, and an external electrode 57 made of solder is provided on the external terminal-shaped projection 8 exposed to the outside. Thereby, BGA (Bal
(1 Grid Array) type semiconductor device.

In such a resin-sealed semiconductor device 51, when the semiconductor device 51 is mounted on a circuit board using the external electrodes 56, the external electrodes 5 contributing to conduction between the semiconductor device 51 and the circuit board are provided.
In addition to 6, the presence of the external electrode 57 provided on the external terminal-shaped projection 8 serving as a dummy electrode reduces the stress load on each external electrode (solder ball).

In the resin-sealed semiconductor device of the present invention in which the external electrodes 56 and 57 made of solder are not provided, the resin-sealed semiconductor device such as an LGA (Land Grid Array) is mounted on a circuit board. In mounting the device, the external terminal-shaped projection 8 is connected to the circuit board in the same manner as the external terminal 4B of the terminal portion 4, so that the stress load per external terminal of the terminal portion 4 is reduced.

Further, since the resin-sealed semiconductor device of the present invention is an area array type in which terminals are taken from the lower surface of the package, the package size and the area required for mounting on a circuit board are the same, Can be mounted on a substrate.

The above-described resin-sealed semiconductor device 51 is an embodiment using the circuit member 1 of the present invention. However, by using the above-described circuit members 11, 21 and 31 of the present invention, a semiconductor element is mounted on a die pad. Is mounted, each terminal of the semiconductor element is connected to the internal terminal of the terminal portion by a bonding wire, a part of the external terminal, and a terminal portion such that a part of the external terminal shape convex portion is exposed to the outside, Die pad, suspension lead,
The semiconductor element and the bonding wire are sealed with the sealing member, whereby the resin-sealed semiconductor device of the present invention can be obtained. In particular, in the circuit members 21 and 31 having the external electrode-shaped protrusions on the back surfaces of the die pads 26 and 36, the number of external electrodes provided on the external terminal-shaped protrusions serving as the dummy electrodes described above increases. The stress load on the external electrodes (solder balls) is more remarkably reduced.

The number of terminals, the arrangement of terminals, the positions of the suspension leads, the number and arrangement of the convex portions of the external terminal shape, and the like in the above-described resin-sealed semiconductor device 51 are merely examples. Of course, it is not limited to this. Circuit member and method of manufacturing resin-encapsulated semiconductor device Here, the circuit member of the present invention and the method of manufacturing a resin-encapsulated semiconductor device will be described with reference to the circuit member shown in FIGS.
The resin-sealed semiconductor device shown in FIGS. 8 to 10 will be described as an example.

FIGS. 11 and 12 are process diagrams showing an example of manufacturing the circuit member 1 of the present invention shown in FIGS. 1 to 3 and the resin-sealed semiconductor device 51 using the circuit member 1. . Each step of FIG. 11 is shown in a longitudinal sectional view of the circuit member corresponding to FIG. 2 described above, and each step of FIG. 12 is shown in a longitudinal sectional view of the circuit member corresponding to FIG.

First, the circuit member 1 is manufactured. 11 and 12, a photosensitive resist is applied to the front and back of the conductive substrate 101, dried, exposed through a desired photomask, and then developed to form a resist pattern 102A,
102B are formed (FIGS. 11A and 12A).
As described above, the conductive substrate 101 is made of 42 alloy (N
A metal substrate (thickness of 100% to 250 μm) of i41% Fe alloy), copper, copper alloy, or the like can be used. Is preferred. Further, as the photosensitive resist, conventionally known ones can be used.

Next, the resist patterns 102A, 102
The conductive substrate 101 is etched with a corrosion liquid using B as a corrosion-resistant film (FIGS. 11B and 12B). The corrosion liquid can be appropriately selected depending on the material of the conductive substrate 101 to be used.
When using an alloy, usually, an aqueous solution of ferric chloride is used,
This is performed by spray etching from both sides of the conductive substrate 101.

Next, the resist patterns 102A, 102A
2B is peeled and removed, and a silver plating layer 5 is formed at the position of the internal terminal 4A of the terminal portion 4, whereby the terminal portion 4 is integrally connected to the outer frame member 2 by the connection lead 3, and the outer frame member 2 is provided with a die pad 6 supported by a suspension lead 7 (not shown) from a predetermined position, and a circuit member 1 having an external terminal-shaped projection 8 on the back surface of the suspension lead 7 is obtained (FIG. 1).
1 (C), FIG. 12 (C)).

Next, an electrically insulating double-sided adhesive tape 53 is attached to the front side 6 a of the die pad 6, and the back surface side of the circuit forming surface of the semiconductor element 52 is fixed via the double-sided adhesive tape 53, thereby forming a semiconductor. The element 52 is mounted (FIG. 1
1 (D), FIG. 12 (D)).

Next, the terminal 5 of the mounted semiconductor element 52
2a and the silver plating layer 5 of the internal terminal 4A of the circuit member 1 are electrically connected by a bonding wire 54, and a part of the external terminal 4B and a part of the external terminal-shaped projection 8 are exposed to the outside. The terminal portion 4, the die pad 6, the suspension lead 7, the semiconductor element 52, and the bonding wire 5
4 is sealed with a sealing member 55 (FIG. 11E, FIG. 12).
(E)).

Next, the connection leads 3 and the suspension leads 7 of the circuit member 1 exposed from the sealing member 55 are cut, and the outer frame member 2 is removed to obtain a semiconductor device 51 of the present invention (FIG. 11 (F), FIG. 12 (F)). Thereafter, an external electrode 56 made of solder is formed on the external terminal 4B exposed to the outside, and an external electrode 57 made of solder is formed on the external terminal-shaped projection 8 exposed to the outside.

[0049]

Next, the present invention will be described in more detail with reference to specific examples. (Production of a circuit member) 0.15 mm thick as a conductive substrate
After preparing the 42 alloy, and performing degreasing and cleaning,
An ultraviolet-curable resist (OFPR1305 manufactured by Tokyo Ohka Kogyo Co., Ltd.) was applied to both sides of the conductive substrate by a pouring method and dried. Next, the resist layers on the front side and the back side were respectively exposed through a predetermined photomask, and then developed to form a resist pattern. Thereafter, spray etching was performed on both surfaces of the conductive substrate using an aqueous ferric chloride solution, and after cleaning, the resist pattern was peeled off using an organic alkali solution.

Next, a silver plating layer (having a thickness of about 5
μm), an electrically insulating double-sided adhesive tape (UH1W manufactured by Tomagawa Paper Mills Co., Ltd.) was bonded to the surface of the die pad to obtain a circuit member. In this circuit member, 72 terminal portions are provided from the outer frame member via connection leads, and die pads are provided from the four corners of the outer frame member via hanging leads. And two external terminal-shaped projections. (Production of Semiconductor Device) The back surface side of the circuit forming surface of the semiconductor element (dimensions: 6 mm square, thickness: about 250 μm) is pressed against the double-sided adhesive tape of the above-mentioned circuit member and fixed by heating (180 ° C.). Equipped. Next, the silver plating layer on the internal terminal of the circuit member and the terminal of the mounted semiconductor element were connected by a gold wire. Then, by exposing a part of the external terminal and a part of the convex part of the external terminal shape to the outside, the terminal part, the die pad, the suspension lead, the semiconductor element and the gold wire are made of a resin material (MP manufactured by Nitto Denko Corporation). -740
0).

Next, each connection lead and each suspension lead of the exposed circuit member are cut to remove the outer frame member, and the external terminal exposed to the outside and the ball formed of solder on the external terminal shape convex portion are formed. Were bonded to form external electrodes.

The resin-encapsulated semiconductor device manufactured as described above is a BGA having 72 external pins, its external dimensions are 10 mm square and 0.8 mm thick, and it is very small and thin. Was. Further, since the area array type is such that terminals are taken from the lower surface of the semiconductor device, the package size and the area required for mounting the circuit board are the same, and high-density board mounting is possible.

In the above resin-encapsulated semiconductor device, the external electrode used as an electrode has 72 pins, and an external electrode of 8 pins is additionally provided on the external terminal-shaped projection of the suspension lead. After mounting on a circuit board using the external electrodes composed of the solder balls having a total of 80 pins and performing a temperature cycle test (a temperature change from −25 ° C. to + 125 ° C. is repeated in 60 minute cycles), 650 cycles have elapsed. No cracks (chip breaks) occurred in the solder balls, and it was confirmed that the solder balls had a practical level of stability.

On the other hand, as a comparison, a resin-sealed semiconductor device in which an external electrode made of a solder ball was not provided on the external terminal-shaped protrusion of the suspension lead was manufactured. This resin-encapsulated semiconductor device was mounted on a circuit board using external electrodes consisting of a total of 72 pins of solder balls, and the same temperature cycle test was performed. (Chip cracking) occurred.

For comparison, a conventional area array type semiconductor device using a polyimide substrate (external terminals 72) was used.
Pins) were mounted on a circuit board using solder balls, and the same temperature cycle test was performed. As a result, even after 650 cycles, cracks (chip cracks) occurred in the solder balls.
No occurrence was observed and it was confirmed that it was stable.

From the above, it was confirmed that the resin-encapsulated semiconductor device of the present invention had the same high mounting reliability on a circuit board as a semiconductor device using a conventional polyimide substrate.

[0057]

As described in detail above, according to the present invention, the occupancy of the semiconductor element is increased, the size of the semiconductor element can be reduced, the mounting density on the circuit board can be improved, and the semiconductor element extends from the die pad. An LGA that does not use solder balls due to the presence of external terminal-shaped protrusions provided on the back surface of the suspension leads and external terminal-shaped protrusions provided on the back surface of the die pad
In mounting a resin-encapsulated semiconductor device on a circuit board such as a (Land Grid Array), by connecting to the circuit board in the same manner as the external terminal of the terminal section, the stress load per external terminal of the terminal section is increased. And a ball grid array (BGA) using solder balls.
In mounting the resin-encapsulated semiconductor device on the circuit board as in y), the terminal is connected to the circuit board via a solder ball in the same manner as the external terminal of the terminal portion, so that each solder ball is connected to one of the solder balls. The stress load is reduced, thereby having high mounting reliability on a circuit board, and further reducing the manufacturing cost as compared with a conventional semiconductor device using a polyimide substrate.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of a circuit member of the present invention.

FIG. 2 is a longitudinal sectional view of the circuit member shown in FIG. 1 taken along line AA.

FIG. 3 is a longitudinal sectional view of the circuit member shown in FIG. 1 taken along line BB.

FIG. 4 is a longitudinal sectional view corresponding to FIG. 2, showing another embodiment of the circuit member of the present invention.

5 is a longitudinal sectional view corresponding to FIG. 3, showing another embodiment of the circuit member of the present invention.

FIG. 6 is a longitudinal sectional view corresponding to FIG. 2, showing another embodiment of the circuit member of the present invention.

FIG. 7 is a longitudinal sectional view corresponding to FIG. 2, showing another embodiment of the circuit member of the present invention.

FIG. 8 is a plan view showing an embodiment of the resin-sealed semiconductor device of the present invention using the circuit member of the present invention shown in FIGS. 1 to 3;

9 is a cross-sectional view of the resin-encapsulated semiconductor device shown in FIG.
It is a longitudinal cross-sectional view in a line arrow.

10 is a cross-sectional view of the resin-encapsulated semiconductor device shown in FIG.
It is a longitudinal cross-sectional view in the direction of arrow D.

11 is a process diagram showing an example of manufacturing the circuit member of the present invention shown in FIGS. 1 to 3 and a resin-sealed semiconductor device using the circuit member, and is a longitudinal sectional view corresponding to FIG. 2; Indicated by

12 is a process chart showing an example of the production of the circuit member of the present invention shown in FIGS. 1 to 3 and a resin-sealed semiconductor device using the circuit member, and is a longitudinal sectional view corresponding to FIG. 3; Indicated by

[Explanation of symbols]

 1, 11, 21, 31 ... circuit member 2, 12, 22, 32 ... outer frame member 3, 13, 23, 33 ... connection lead 4, 14, 24, 34 ... terminal portion 4A, 14A, 24A, 34A ... inside Terminals 4B, 14B, 24B, 34B: external terminals 5, 15, 25, 35: silver plating layers 6, 16, 26, 36: die pads 7, 17: suspension leads 8, 18, 29, 39: external terminal shape convex portions 51: Resin-sealed semiconductor device 52: Semiconductor element 52a: Terminal 54: Bonding wire 55: Sealing member 56: External electrode 57: External electrode

Claims (8)

[Claims] A plurality of terminal portions having an internal terminal on a front surface side and an external terminal on a back surface integrated front and back are two-dimensionally and electrically independent from each other in a substantially one plane. In the resin-encapsulated semiconductor device in which the terminals and the terminals of the semiconductor element are electrically connected by wires, and the entirety of the external terminals of each terminal portion is resin-encapsulated so as to expose a part of the external terminals, A die pad having a plurality of suspension leads is electrically independently arranged at a substantially central portion of a plane where the terminal portions are two-dimensionally arranged, and the terminal portions are two-dimensionally arranged with the plurality of suspension leads. Extending in the plane provided, and provided with an external terminal-shaped convex portion on the back surface, and a part of the external terminal-shaped convex portion is exposed to the outside, and the semiconductor element is electrically insulated from the surface of the die pad. Resin-sealed semiconductor device characterized by being mounted 2. The resin-encapsulated semiconductor device according to claim 1, wherein a surface of the die pad is substantially flush with a surface of an internal terminal of the terminal portion. 3. The die pad according to claim 1, wherein the back surface of the die pad has one or more external terminal-shaped protrusions, and a part of the external terminal-shaped protrusions is exposed to the outside. 3. The resin-sealed semiconductor device according to 2. 4. The resin-sealed mold according to claim 1, wherein an external electrode made of solder is provided on the external terminal exposed to the outside and the external terminal shape convex portion. Semiconductor device. 5. A circuit member for a resin-encapsulated semiconductor device, comprising: an outer frame member; a plurality of terminal portions projecting from the outer frame member independently of each other via connection leads; A die pad held from the frame member via a plurality of suspension leads, each terminal portion integrally having an internal terminal on the front side and an external terminal on the back side, and the suspension lead has an external terminal shape on the back side. A circuit member comprising a convex portion, wherein the external terminal surface and the external terminal shape convex surface are located on substantially one plane. 6. The circuit member according to claim 5, wherein a surface of the die pad is substantially flush with a surface of an internal terminal of the terminal portion. 7. The die pad is provided with one or more external terminal-shaped convex portions on the back surface, and the external terminal-shaped convex portion surface and the external terminal surface are located on substantially one plane. The circuit member according to claim 5. 8. The circuit member according to claim 5, wherein an electrically insulating double-sided adhesive tape is integrally provided on a surface of the die pad.