JP2000082760A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JP2000082760A
JP2000082760A JP11155704A JP15570499A JP2000082760A JP 2000082760 A JP2000082760 A JP 2000082760A JP 11155704 A JP11155704 A JP 11155704A JP 15570499 A JP15570499 A JP 15570499A JP 2000082760 A JP2000082760 A JP 2000082760A
Authority
JP
Japan
Prior art keywords
semiconductor chip
wiring pattern
circuit board
pattern
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11155704A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000082760A5 (https=
Inventor
Takeshi Toyoda
剛士 豊田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP11155704A priority Critical patent/JP2000082760A/ja
Publication of JP2000082760A publication Critical patent/JP2000082760A/ja
Publication of JP2000082760A5 publication Critical patent/JP2000082760A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11155704A 1998-06-25 1999-06-02 半導体装置 Pending JP2000082760A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11155704A JP2000082760A (ja) 1998-06-25 1999-06-02 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-178513 1998-06-25
JP17851398 1998-06-25
JP11155704A JP2000082760A (ja) 1998-06-25 1999-06-02 半導体装置

Publications (2)

Publication Number Publication Date
JP2000082760A true JP2000082760A (ja) 2000-03-21
JP2000082760A5 JP2000082760A5 (https=) 2006-03-09

Family

ID=26483632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11155704A Pending JP2000082760A (ja) 1998-06-25 1999-06-02 半導体装置

Country Status (1)

Country Link
JP (1) JP2000082760A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100386634B1 (ko) * 2000-12-29 2003-06-02 앰코 테크놀로지 코리아 주식회사 비지에이 패키지용 기판의 습기 배출공 형성방법
JP2006524904A (ja) * 2003-02-10 2006-11-02 スカイワークス ソリューションズ，インコーポレイテッド インダクタンスが減少し、ダイ接着剤の流出が減少した半導体ダイパッケージ
JP2009100398A (ja) * 2007-10-19 2009-05-07 Epson Toyocom Corp 圧電デバイス
JP2011044747A (ja) * 2010-11-29 2011-03-03 Renesas Electronics Corp 半導体装置の製造方法
JP2012124537A (ja) * 2012-03-26 2012-06-28 Renesas Electronics Corp 半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100386634B1 (ko) * 2000-12-29 2003-06-02 앰코 테크놀로지 코리아 주식회사 비지에이 패키지용 기판의 습기 배출공 형성방법
JP2006524904A (ja) * 2003-02-10 2006-11-02 スカイワークス ソリューションズ，インコーポレイテッド インダクタンスが減少し、ダイ接着剤の流出が減少した半導体ダイパッケージ
JP2009100398A (ja) * 2007-10-19 2009-05-07 Epson Toyocom Corp 圧電デバイス
JP2011044747A (ja) * 2010-11-29 2011-03-03 Renesas Electronics Corp 半導体装置の製造方法
JP2012124537A (ja) * 2012-03-26 2012-06-28 Renesas Electronics Corp 半導体装置

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