JP2000077437A - Electronic component bonding device and bonding of the electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component bonding device, which can correct the positional deviation of an electronic component with high precision without generating a flaw in the lower surface of the component and a contamination on the lower surface of the component, and a method of bonding the component. SOLUTION: In a process, wherein a chip on a feeding part is picked up to transfer the chip on a table 30 on a position correction part and the positional deviation of the chip 9 is corrected, the chip 9 is placed on a tapered stage 31 having four sides of slant surfaces 31a, which form a roughly pyramidal recessed part slanting toward the central part of the stage 31, is horizontally moved from the isostere direction on a plane view towards the central point of the stage 31 and the positional deviation of the chip 9 is corrected by a plurality of positioning members 32 making contact to the chip 9 placed on the stage 31. Thereby, the chip 9 will not move horizontally as the lower surface of the chip 9 comes into contact to the stage 31 and a flaw in the contact part of the lower surface of the chip 9 to the stage 31 and a contamination on the contact part are not generated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus and method for bonding electronic components to a substrate.

[0002]

2. Description of the Related Art A bonding apparatus for bonding an electronic component such as a semiconductor chip to a substrate is provided with a position correction section for picking up the electronic component from a wafer or a tray and then temporarily mounting the electronic component to correct the position. Often. This position correction unit arranges the position and direction of the electronic component before mounting it on the board, and then picks up the electronic component by the mounting transfer head. Deviation correction is performed.

[0003]

Some electronic components, such as electronic components with bumps such as flip chips, are of a type that is resistant to scratches and contamination. This is because, in the example of the electronic component with bumps, scratches and contamination of the bumps may cause defects in later processes such as bonding failure and erroneous recognition in image recognition during mounting. However, when the position correction is performed by the position correction unit, the position of the electronic component is corrected by moving the electronic component in a horizontal direction with a position regulating claw or the like on the temporary placement stage. There was a problem that the sliding of the stage caused scratches and contamination of the electronic components.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a bonding apparatus and a bonding method for an electronic component, which can correct the displacement of the electronic component accurately without causing scratches or contamination on the lower surface of the electronic component.

[0005]

According to a first aspect of the present invention, there is provided an electronic component bonding apparatus, comprising: a supply unit for an electronic component; a positioning unit for positioning a substrate to which the electronic component is bonded; A position correction unit disposed between the position correction unit and mounting the electronic component to correct the positional deviation; and a first transfer head that picks up the electronic component from the supply unit and transfers the electronic component to the position correction unit. A second transfer head for picking up the electronic component whose position has been corrected by the position correcting unit, mounting the electronic component on the substrate of the positioning unit, and bonding the electronic component, and tilting the position correcting unit toward the center. A tapered stage having an inclined surface on a plurality of sides forming a substantially pyramid-shaped concave portion, on which the electronic component is mounted,
Positional displacement correction comprising a plurality of positioning members that move horizontally from the equidistant direction toward the center point of the tapered stage in plan view and abut against the electronic component mounted on the tapered stage to correct the positional displacement. Means were provided.

According to a second aspect of the present invention, there is provided a method of bonding an electronic component, comprising picking up an electronic component from a supply unit by a first transfer head and transferring the electronic component to a position correction unit; Correcting the position shift of the electronic component, and correcting the position shift of the electronic component by picking up the electronic component having the position shift corrected by the second transfer head, mounting the electronic component on a substrate, and bonding the electronic component; In the step, the electronic component is placed on a tapered stage having a plurality of inclined surfaces forming a substantially pyramid-shaped concave portion inclined toward a central portion, and the center point of the tapered stage is viewed from the equidistant direction in plan view. And a plurality of positioning members abutting on the electronic component mounted on the tapered stage correct the positional shift of the electronic component.

According to the present invention, in the step of positioning the electronic component, the electronic component is placed on a tapered stage having four inclined surfaces, and a plurality of positioning members that move horizontally from the equidistant directions are brought into contact with each other. By correcting the displacement of the electronic component, the lower surface of the electronic component does not horizontally move while being in contact with the stage on which the electronic component is placed, and the contact portion is not scratched or contaminated.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component bonding apparatus according to an embodiment of the present invention, and FIGS. 2 (a) and 2 (b).
3A is a perspective view of a position correction unit of the electronic component bonding apparatus, FIG. 3A is a cross-sectional view of the position correction unit of the electronic component bonding apparatus, and FIG. 3B is a position correction of the electronic component bonding apparatus. It is a top view of a part.

First, the structure of an electronic component bonding apparatus will be described with reference to FIG. In FIG. 1, a bonding apparatus includes a substrate supply unit 1, a transport path 2, a chip supply unit 3,
It comprises a position correcting section 4, a bond applying section 5, and a substrate collecting section 6. The substrate 7 is stored in the stocker 11 of the substrate supply unit 1, and the substrate 7 is sent out onto the transport path 2 by protruding a rod of a cylinder 12 serving as a substrate sending out unit. A positioning section is provided in the middle of the transport path 2, and the substrate 7 is positioned by positioning means (not shown), and bonding of electronic components is performed.

A supply section 3 for supplying a chip 9 as an electronic component is provided on a side of the transport path 2. The chip 9 of the wafer 8 is pushed up from the wafer 8 by the push-up section 13 provided below, is vacuum-sucked by the nozzle 15 of the first transfer head 14, and is placed on the position correction section 4. The chip 9 placed on the table 20 of the position correction unit 4 is
The displacement is corrected by the displacement correcting means.

The chip 9 whose position has been corrected by the position correcting unit 4 is used as a bonding head 1 serving as a second transfer head.
6 and is bonded to the substrate 7 positioned on the transport path 2. Conveyance path 2
On the other side, a bond application unit 5 is provided, and the bond 10 applied on the rotary table is transferred to the transfer head 1.
The transfer is performed to the bonding position of the substrate 7 by the transfer tool 19 of FIG. By mounting the chip 9 on the thus transferred bond 10, the chip 9 is bonded to the substrate 7. The substrate 7 after the bonding is collected by the stocker 24 of the substrate collection unit 6.

Next, the position correcting section 4 will be described with reference to FIG. 2A and 2B, the table 3
Above 0, a taper stage 3 for correcting the displacement of the chip 9
1 is attached. The tapered stage 31 has four inclined surfaces 31a forming a substantially pyramid-shaped concave portion inclined toward the center. In a state where the chip 9 is mounted on the tapered stage 31, as shown in FIG. 3A, the chip 9 contacts the inclined surface 31a only at the outer peripheral end, and is thereby supported by the tapered stage 31. . Therefore,
The lower surface of the chip 9 does not directly contact the tapered stage 31,
No scratch or contamination occurs on the lower surface of the chip 9 during the temporary placement.

Around the taper stage 31, four positioning members 32 are provided which move horizontally from the diagonal direction of the taper stage 31, that is, 90 degrees in a plan view toward the center of the taper stage 31. Have been. The taper stage 31 and the positioning member 32 constitute a displacement correcting means. As shown in FIG. 3B, by pressing the positioning member 32 against four corners of the chip 9, the center point of the chip 9 coincides with the movement center point O of the positioning member 32, and the position of the chip 9 is shifted. Is corrected.

At this time, unlike the conventional displacement correction method, the chip 9 is not horizontally moved in one direction, so that the lower surface of the chip 9 does not slide with the tapered stage 31 during the displacement correction. No scratches or contamination occur on the lower surface of the electronic component.

This electronic component bonding apparatus is configured as described above, and its operation will be described below. In FIG. 1, a substrate 7 of a stocker 11 is pushed out onto a transport path 2 by a rod 12a of a cylinder 12. Substrate 7
Is transported downstream and positioned. The chips 9 of the wafer 8 in the supply unit 3 are pushed up by the push-up unit 13, picked up by the nozzle 15 of the first transfer head 14, and temporarily placed on the taper stage 31 of the position correction unit 4.

Here, by driving the positioning member 32 and pressing it against four corners of the chip 9, the chip 9 is positioned with respect to the center point of the positioning member 32.
The displacement is corrected. At this time, since the lower surface of the chip 9 does not directly contact the tapered stage 31 and there is almost no horizontal movement of the chip 9 at the time of position correction, there is no generation of scratches or contamination due to friction of the lower surface of the chip.

The chip 9 whose positional deviation has been corrected in this way is picked up by the nozzle 17 of the bonding head 16 and bonded to the substrate 7 positioned on the transport path 2. Then, the substrate 7 on which the bonding has been completed is transported to the downstream side and collected by the stocker 24.

[0018]

According to the present invention, in the process of correcting the displacement of an electronic component, a plurality of positioning devices are mounted on a tapered stage having four inclined surfaces and horizontally moved in an equal direction. The electronic components are corrected for misalignment without being moved horizontally by the members, so that the lower surface of the electronic components moves horizontally while contacting the stage, so that scratches and contamination do not occur. Problems occurring in the process can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component bonding apparatus according to an embodiment of the present invention.

2A is a perspective view of a position correction unit of the electronic component bonding apparatus according to one embodiment of the present invention; FIG. 2B is a perspective view of a position correction unit of the electronic component bonding apparatus according to one embodiment of the present invention;

3A is a cross-sectional view of a position correction unit of the electronic component bonding apparatus according to one embodiment of the present invention; FIG. 3B is a plan view of a position correction unit of the electronic component bonding apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 Reference Signs List 2 transport path 3 supply unit 4 position correction unit 7 substrate 14 first transfer head 16 bonding head 31 taper stage 31a inclined surface 32 positioning member

Claims (2)

[Claims] An electronic component supply unit, a positioning unit for positioning a substrate to which the electronic component is bonded, and a positioning unit disposed between the supply unit and the positioning unit, the electronic component being placed and being displaced. A position correction unit for performing correction, a first transfer head that picks up the electronic component from the supply unit and transfers the electronic component to the position correction unit, and picks up the electronic component whose position has been corrected by the position correction unit. And a second transfer head for mounting and bonding to the substrate of the positioning unit, and the position correction unit has a plurality of inclined surfaces forming a substantially pyramid-shaped recess inclined toward the center. The tapered stage on which the electronic component is mounted on the inclined surface is horizontally moved from the equidistant direction in plan view toward the center point of the tapered stage, and contacts the electronic component mounted on the tapered stage. Not in contact Bonding apparatus of electronic components, characterized in that a positional deviation correcting means comprising a plurality of positioning members corrected. 2. A step of picking up an electronic component of a supply unit by a first transfer head and transferring the electronic component to a position correction unit, and a step of correcting a displacement of the electronic component mounted on the position correction unit. Picking up the electronic component whose positional deviation has been corrected by the second transfer head, mounting the electronic component on a substrate, and bonding the electronic component. In the step of correcting the positional deviation of the electronic component, the electronic component tilts toward the center. The electronic component is placed on a tapered stage having a plurality of inclined surfaces forming a substantially pyramid-shaped concave portion, and horizontally moved from an equidistant direction toward the center point of the tapered stage in a plan view. A method of bonding an electronic component, comprising: correcting a displacement of the electronic component by a plurality of positioning members abutting on the electronic component mounted on the taper stage.