JP3677407B2 - Daicolette - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die collet not damaging a thin and long chip. SOLUTION: In a die collet for chucking and holding a rectangular thin and long chip contacted at the end face to receiving faces 31, 32 by evacuating it through a suction hole 34, the receiving face 32 for contacting the narrow side end face of the chip is defined by approximately a V-shaped notch 33, piercing the lower end of the die collet in the width direction. Thus the narrow side end face of the chip contacts the receiving face 32 over the entire width, this avoiding concentrating the pressing load on the end face of the chip during bonding and hence preventing the damage to the chip.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a die collet that adsorbs and holds a semiconductor chip.
[0002]
[Prior art]
As a method of picking up a chip such as a semiconductor, a method of vacuum suction using a die collet is known. In this method, an end face of a rectangular chip is brought into contact with a die collet having an inclined receiving surface to hold the chip by vacuum suction while positioning the chip. This receiving surface is usually provided with a so-called relief so that the corners of the end surface of the chip do not directly contact, and only the straight portion of the end surface contacts the receiving surface.
[0003]
[Problems to be solved by the invention]
However, some types of chips have an elongated shape, and if the above-mentioned relief is provided in a die collet intended for such a shaped chip, the width of the receiving surface on the short side of the chip is inherently narrow. Therefore, there is a case where the contact portion with the end face of the chip hardly remains. That is, when a chip having an elongated shape is picked up by such a die collet, the remaining receiving surface with a slight width comes into contact with the end surface on the short side of the chip, so that the pressing force when pressing the chip by the die collet is narrow. There is a problem in that it acts concentrating on the part, and scratches and partial chipping occur on the end face of the chip.
[0004]
Therefore, an object of the present invention is to provide a die collet that does not damage an elongated chip.
[0005]
[Means for Solving the Problems]
The die collet according to claim 1 is configured such that a long side end surface of a rectangular elongated chip is brought into contact with two inclined receiving surfaces, and a short side receiving surface on which a short side end surface is brought into contact. A die collet that sucks and holds the chip by vacuum suction from a suction hole provided in a recess formed by these receiving surfaces, and penetrates the lower end portion of the die collet in the width direction. The short side receiving surface is formed by a substantially V-shaped cutout portion provided so that the end surface of the short side of the chip abuts the short side receiving surface over the entire width.
[0007]
According to the present invention, the end surface of the short side is in contact with the receiving surface that receives the short side of the chip over the entire width, so that the load during pressing does not act intensively and can prevent the chip from being damaged. it can.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a chip bonding apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the die collet, FIG. 3A is a side view of the die collet, and FIG. FIG. 4A and FIG. 4B are partial enlarged views of the chip.
[0009]
First, the structure of the bonding apparatus will be described with reference to FIG. The bonding apparatus includes a substrate supply unit 1, a conveyance path 2, a chip supply unit 3, a position correction unit 4, a bond application unit 5, and a substrate recovery unit 6. The substrate 7 is stored in the stocker 11 of the substrate supply unit 1, and the substrate 7 is sent out onto the transport path 2 by projecting the rod 12 a of the cylinder 12 serving as substrate delivery means. The substrate 7 is positioned at a positioning portion provided in the middle of the transport path 2 and bonding of the elongated chip 9 is performed. A chip supply unit 3 for supplying chips is disposed on the side of the transport path 2. The chip 9 of the wafer 8 is vacuum-sucked by a die collet 15 mounted on the transfer head 14 while being pushed up by a push-up portion 13 provided below. The chip 9 vacuum-sucked and picked up is moved in the horizontal direction by the moving means and temporarily placed on the position correction unit 4. The chip 9 temporarily placed on the table 20 of the position correction unit 4 is corrected for displacement by pressing an L-type position correction claw.
[0010]
The chip 9 whose position deviation has been corrected is picked up by the die collet 17 of the bonding head 16, horizontally moved again by the moving means, and bonded to the substrate 7 positioned on the transport path 2. On the other side of the conveyance path 2, a bond application unit 5 is disposed, and the bond 10 applied on the rotary table is transferred to the bonding position of the substrate 7 by the transfer tool 19 of the transfer head 18. . By mounting the chip 9 on the bond 10 thus transferred, the chip 9 is bonded to the substrate 7. Then, the substrate 7 for which the bonding is completed is collected by the stocker 24 of the substrate collection unit.
[0011]
Next, a description will be given of die-shaped collets 15 and 17 for attracting rectangular elongated chips used by being mounted on the transfer head 14 and the bonding head 16 with reference to FIGS. As shown in FIG. 2, the die collets 15 and 17 are configured by forming a plurality of inclined receiving surfaces in contact with the end surface of the chip on the block 30. The receiving surface includes two receiving surfaces 31 with which the long-side end surface of the elongated chip 9 abuts and a receiving surface 32 with which the short-side end surface abuts, and is formed by these receiving surfaces 31, 32. A suction hole 34 is provided in the recess. The chip 9 is held by the block 30 by vacuum suction from the suction hole 34 in a state where the elongated chip 9 is in contact with the receiving surfaces 31 and 32.
[0012]
As shown in FIG. 3A, the short side receiving surface 32 is formed by a substantially V-shaped cutout 33 provided at the lower end of the block 30 so as to penetrate in the width direction. By forming the receiving surface 32 in such a shape, when the chip 9 is sucked and held, the end surface on the short side is in contact with the receiving surface 32 over the entire width. Moreover, the surface finishing process of the receiving surface 32 can be easily performed by providing the notch part 33 so that it may penetrate. For this reason, the receiving surface 32 can be finished smoothly, and damage to the end face of the chip 9 at the time of bonding due to a poor surface finish of the receiving surface 32 can be prevented.
[0013]
Next, the bonding of the chip 9 to the substrate 7 using the die collet 17 will be described. FIG. 3B shows a state in which the elongated chip 9 is pressed against the substrate 7 by the die collet 17. At this time, the pressing force is transmitted to the chip 9 through the three receiving surfaces 31 and 32, and the pressing force F on the short side is the end surface of the chip 9 through the floating surface 32 as shown in FIG. Act on. Since the receiving surface 32 is in contact with the end surface on the short side over the entire width of the chip 9, the pressing force F is distributed over the entire width of the end surface on the short side of the chip 9 as shown in FIG. To do.
[0014]
For this reason, there is no concentration of pressing force (see FIG. 4B) that occurs when using a conventional die collet provided with relief, and the receiving surface 32 is sufficiently finished to ensure smoothness. Therefore, damage such as scratches or chipping on the end face of the chip 9 does not occur.
[0015]
The present invention is not limited to the above embodiment. For example, in the above embodiment, the receiving surface on the short side is a three-surface collet that is provided only on one side and abuts on the three sides of the chip 9. However, it may be a four-sided collet provided with the short side receiving surfaces facing each other so that both of the short sides abut.
[0016]
【The invention's effect】
According to the present invention, since the end face of the full width of the short side is in contact with the receiving surface that receives the short side of the chip, the pressing load is concentrated on the end face of the chip when the chip is bonded to the substrate. In this way, damage to the chip can be prevented.
[Brief description of the drawings]
FIG. 1 is a perspective view of a chip bonding apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a die collet according to an embodiment of the present invention. (B) Partial sectional view of a die collet according to an embodiment of the present invention. (A) Partial enlarged view of a chip according to an embodiment of the present invention. (B) One embodiment of the present invention. Partial enlarged view of the chip of the embodiment [Explanation of symbols]
9 Chips 15 and 17 Die collets 31 and 32 Receiving surface 33 Notch 34 Suction hole

Claims (1)

A long side end surface of a rectangular elongated chip is brought into contact with two inclined receiving surfaces, and a short side receiving surface with which a short side end surface abuts is formed by these receiving surfaces. A die collet that sucks and holds the chip by vacuum suction from a suction hole provided in a recessed portion, and is substantially V-shaped provided penetrating in the width direction at the lower end of the die collet The short side receiving surface is formed by a notch portion, and the end surface of the short side of the chip is in contact with the short side receiving surface over the entire width.

Images