JP2000053946A5 - - Google Patents
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- Publication number
- JP2000053946A5 JP2000053946A5 JP1998222005A JP22200598A JP2000053946A5 JP 2000053946 A5 JP2000053946 A5 JP 2000053946A5 JP 1998222005 A JP1998222005 A JP 1998222005A JP 22200598 A JP22200598 A JP 22200598A JP 2000053946 A5 JP2000053946 A5 JP 2000053946A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- polishing
- coupling agent
- oxide
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 14
- 238000005296 abrasive Methods 0.000 claims 13
- 238000005498 polishing Methods 0.000 claims 13
- 239000007822 coupling agent Substances 0.000 claims 8
- 239000006061 abrasive grain Substances 0.000 claims 7
- 239000000463 material Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- OFJATJUUUCAKMK-UHFFFAOYSA-N Cerium(IV) oxide Chemical compound [O-2]=[Ce+4]=[O-2] OFJATJUUUCAKMK-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N Silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N TiO Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N Tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N Zirconium(IV) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K [O-]P([O-])([O-])=O Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000006172 buffering agent Substances 0.000 claims 1
- 229910000420 cerium oxide Inorganic materials 0.000 claims 1
- 239000002738 chelating agent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910000423 chromium oxide Inorganic materials 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229910000460 iron oxide Inorganic materials 0.000 claims 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims 1
- VPBIQXABTCDMAU-UHFFFAOYSA-N magnesium;oxido(oxo)alumane Chemical compound [Mg+2].[O-][Al]=O.[O-][Al]=O VPBIQXABTCDMAU-UHFFFAOYSA-N 0.000 claims 1
- 229910000000 metal hydroxide Inorganic materials 0.000 claims 1
- 150000004692 metal hydroxides Chemical class 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- TXKRDMUDKYVBLB-UHFFFAOYSA-N methane;titanium Chemical compound C.[Ti] TXKRDMUDKYVBLB-UHFFFAOYSA-N 0.000 claims 1
- 229910052863 mullite Inorganic materials 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000010452 phosphate Substances 0.000 claims 1
- 230000001737 promoting Effects 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 239000011780 sodium chloride Substances 0.000 claims 1
- 229910052596 spinel Inorganic materials 0.000 claims 1
- 239000011029 spinel Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
- 229910001887 tin oxide Inorganic materials 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- 229910001929 titanium oxide Inorganic materials 0.000 claims 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims 1
- 239000004034 viscosity adjusting agent Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 229910052845 zircon Inorganic materials 0.000 claims 1
- 229910052846 zircon Inorganic materials 0.000 claims 1
- 229910001928 zirconium oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22200598A JP2000053946A (ja) | 1998-08-05 | 1998-08-05 | 研磨材組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22200598A JP2000053946A (ja) | 1998-08-05 | 1998-08-05 | 研磨材組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000053946A JP2000053946A (ja) | 2000-02-22 |
| JP2000053946A5 true JP2000053946A5 (de) | 2005-10-27 |
Family
ID=16775616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22200598A Pending JP2000053946A (ja) | 1998-08-05 | 1998-08-05 | 研磨材組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000053946A (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3660511B2 (ja) | 1998-12-03 | 2005-06-15 | 株式会社東芝 | 研磨方法及び半導体装置の製造方法 |
| US6646348B1 (en) * | 2000-07-05 | 2003-11-11 | Cabot Microelectronics Corporation | Silane containing polishing composition for CMP |
| KR20020055308A (ko) * | 2000-12-28 | 2002-07-08 | 박종섭 | 화학적 기계적 연마용 패드 및 그 제조 방법 |
| EP2418258A1 (de) | 2001-02-20 | 2012-02-15 | Hitachi Chemical Company, Ltd. | Polierschmiere und Verfahren zum Polieren eines Substrats |
| JPWO2003038883A1 (ja) | 2001-10-31 | 2005-02-24 | 日立化成工業株式会社 | 研磨液及び研磨方法 |
| JP2003277731A (ja) * | 2002-03-26 | 2003-10-02 | Catalysts & Chem Ind Co Ltd | 研磨用粒子および研磨材 |
| JPWO2012169515A1 (ja) * | 2011-06-08 | 2015-02-23 | 株式会社フジミインコーポレーテッド | 研磨材及び研磨用組成物 |
-
1998
- 1998-08-05 JP JP22200598A patent/JP2000053946A/ja active Pending
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