JP2000049651A - High frequency switch module for multi-band - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make an antenna be in common and to switch the transmission circuit and reception circuit of a first transmission/reception system and the transmission circuit and reception circuit of a second transmission/reception system by providing a high frequency switch module provided with a switch circuit for switching a transmission system and a reception system in the respective first and second transmission/reception systems. SOLUTION: This high frequency switch module for multi-band is used for the division of the antenna ANT of a dual band portable telephone and the respective transmission/reception circuits of a GSM system and DCS system. The module is constituted of a first switch circuit (SW) for switching the transmission signals and reception signals of the first transmission/reception system (GSM), a first low-pass filter circuit (LPF) connected to the transmission line of the first SW, a second SW for switching the transmission signals and reception signals of the second transmission/reception system (DCS), a second LPF connected to the transmission line of the second SW and a branching circuit for branching the GSM and the DCS.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency composite component, and more particularly to a multi-band high-frequency switch module which handles a plurality of transmission / reception systems having different pass bands.

[0002]

2. Description of the Related Art In a digital portable telephone or the like, a high-frequency switch is used to switch a connection between an antenna ANT and a transmission circuit TX and a connection between an antenna ANT and a reception circuit RX. As this high frequency switch,
There is one disclosed in JP-A-6-197040.

This conventional high-frequency switch includes a first diode having an anode connected to a transmitting circuit and a cathode connected to an antenna, a strip line connected between the antenna and the receiving circuit, and a strip line connected to the receiving circuit. The strip line includes a second diode connected to the anode and the cathode connected to the ground side, the strip line is built in the multilayer substrate, and the first diode and the second diode are mounted on the multilayer substrate. Further, this conventional high-frequency switch simply corresponds to one transmission / reception system (single band).

[0004]

The spread of mobile phones in recent years has been remarkable, and the functions and services of mobile phones have been improved. As this new mobile phone,
Proposals for dual band mobile phones have been made. This dual-band mobile phone handles two transmission / reception systems while a normal mobile phone handles only one transmission / reception system. As a result, the user can select and use a convenient transmission / reception system.

[0005] In this dual-band mobile phone, if a dedicated circuit is configured for each transmission / reception system,
This leads to larger equipment and higher costs. It is advantageous to use a common part as much as possible for the common part to reduce the size and cost of the device.

The present invention provides a multi-band high-frequency switch module having a common antenna and capable of switching between a transmission circuit and a reception circuit of a first transmission / reception system and a transmission circuit and a reception circuit of a second transmission / reception system. It is an object of the present invention to provide a multi-band high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands, and to constitute the multi-band high-frequency switch module with one chip.

[0007]

Means for Solving the Problems A first invention of the present invention is:
A high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands, the switch comprising: a demultiplexing circuit for demultiplexing a signal into the plurality of transmission / reception systems; A high-frequency switch module, the high-frequency switch module including a laminate of an electrode pattern and a dielectric layer, and a chip element disposed on the laminate; , And a transmission terminal and a reception terminal of each of the transmission / reception systems.

According to a second aspect of the present invention, in the first aspect, the common terminal, each of the transmission system terminals, and each of the reception system terminals are formed on a side surface of the multilayer body. At least one ground terminal is formed on the side surface.

According to a third aspect of the present invention, in the first aspect, the high-frequency terminal (the common terminal, each transmission system terminal, each reception system terminal) is formed on a side surface of the laminate, and Are arranged in non-adjacent structures.

According to a fourth aspect of the present invention, in the first aspect, the high-frequency terminal (the common terminal, each transmission system terminal, each reception system terminal) is formed on a side surface of the laminate, and Between them, a ground terminal or a switch circuit control terminal is arranged, and the high-frequency terminals are arranged so as not to be adjacent to each other.

According to a fifth aspect of the present invention, in the first aspect, the high-frequency terminal (the common terminal, each transmission system terminal, each reception system terminal) is formed on a side surface of the laminate, and At least one ground terminal is arranged between them.

In a sixth aspect of the present invention based on the first aspect, the switch circuit is a diode switch, and a control terminal of the diode switch is formed on a side surface of the laminate.

According to a seventh aspect of the present invention, in the first aspect, the transmission system terminal and the reception system terminal of each of the transmission and reception systems are formed on a side surface of the laminate, and the transmission system terminal and the reception system terminal are formed. Is a line-symmetric arrangement.

According to an eighth aspect of the present invention, in the first aspect, the transmission system terminal and the reception system terminal of each of the transmission and reception systems are formed on a side surface of the laminate, and the transmission system terminal and the reception system terminal are formed. "Is arranged in a different region from the center line of the laminate.

According to a ninth aspect of the present invention, in the first aspect, the common terminal and the transmission system terminal and the reception system terminal of each of the transmission / reception systems divide the stacked body by two minutes on a plane perpendicular to a mounting surface. In this case, it is formed in another area.

According to a tenth aspect of the present invention, in the ninth aspect of the present invention, the opposite side to the common terminal when the laminate is divided into two, and the opposite side is further divided into two by a plane perpendicular to the mounting surface. The transmission system terminals of the respective transmission / reception systems are formed on one side of the defined area, and the reception system terminals of the respective transmission / reception systems are formed on the other side.

According to an eleventh aspect of the present invention, in the first aspect, the branching circuit and the transmission line for the switch circuit are formed by an electrode pattern in a laminate.

According to a twelfth aspect of the present invention, in the eleventh aspect, the transmission line for the switch circuit is formed in a region interposed between ground electrodes.

According to a thirteenth aspect of the present invention, in the eleventh aspect, the transmission line for the switch circuit is formed in a region sandwiched between ground electrodes, and the demultiplexing circuit is further provided above the ground electrode. And an inductance component for the demultiplexing circuit is further formed thereon.

According to a fourteenth aspect of the present invention, in the first aspect, each of the transmission systems in the transmission / reception systems from the demultiplexing circuit has a low-pass filter function.

According to a fifteenth aspect of the present invention, in the fourteenth aspect, the low-pass filter circuit for obtaining the low-pass filter function is formed by an electrode pattern in the laminate.

According to a sixteenth aspect of the present invention, in the fifteenth aspect, the transmission line is formed in a region interposed between the ground electrodes, and a capacitor for the low-pass filter circuit is further provided above the ground electrode. And a capacitance component for the demultiplexing circuit. An inductance component for the low-pass filter circuit and an inductance component for the demultiplexing circuit are further formed on the components.

According to a seventeenth aspect of the present invention, in the fifteenth aspect, the branching circuit and the low-pass filter circuit are separately formed in different regions in the horizontal direction of the laminate.

According to an eighteenth aspect of the present invention, in the first aspect, the transmission line is formed in a region sandwiched between ground electrodes, and a cutout is formed in the ground electrode above the ground electrode. A through-hole connected to the transmission line is formed in the notch.

According to a nineteenth aspect of the present invention, in the first aspect, a metal case surrounding the chip element disposed on the laminate is disposed on the laminate.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a multi-band high-frequency switch module for handling a plurality of transmission / reception systems having different pass bands. The multi-band high-frequency switch module has a laminated structure and a chip component on the laminated body. By arranging, it is configured to be small. For example,
A high-frequency device that shares an antenna, connects the transmitting system and the receiving system of the first transmitting / receiving system, the transmitting system and the receiving system of the second transmitting / receiving system having different passbands from the first transmitting / receiving system, and the antenna, and switches as appropriate. Switch module can be obtained,
For example, it is effective in a dual band mobile phone or the like.

According to the present invention, a common terminal for a plurality of transmission / reception systems,
The transmission system terminal and the reception system terminal of each transmission / reception system are formed on the side surface of the multilayer body so that they can be surface-mounted. Each terminal formed on this side surface may be extended to its upper surface or lower surface. At least one ground terminal is formed on each side surface. By arranging the ground terminals on each side surface, it is possible to reduce the loss of the multiband high-frequency switch module of the present invention.

According to the present invention, a common terminal for a plurality of transmission / reception systems,
The transmission system terminal and the reception system terminal of each transmission / reception system are terminals for high frequency signals, and are called high frequency terminals. The high-frequency terminals are formed on side surfaces of the laminate, and are arranged so that the high-frequency terminals are not adjacent to each other. A ground terminal or a switch circuit control terminal is arranged between the high frequency terminals. Preferably, at least one ground terminal is arranged between the high-frequency terminals. Thus, by preventing the high-frequency terminals from being adjacent to each other and by arranging the ground terminals between the high-frequency terminals, it is possible to suppress interference between the high-frequency terminals and reduce the loss.

The switch circuit of each transmission / reception system of the present invention can use a diode switch circuit. This diode switch circuit uses a control terminal for applying a predetermined voltage to the diode. This control terminal is formed on the side surface of the laminate.

In the present invention, it is preferable that the transmission system terminal and the reception system terminal are arranged so close to each other that the transmission system terminals and the reception system terminals are not adjacent to each other. In addition, it is preferable that the transmission system terminal and the reception system terminal are respectively arranged in different regions with respect to the center line of the laminate. Further, it is preferable that the transmission system terminal and the reception system terminal are arranged in line symmetry. With this configuration,
In a device that handles a plurality of transmission / reception systems on which a high-frequency switch module is mounted, it is easy to connect to a transmission system circuit and a reception system circuit.

In the present invention, it is preferable that the common terminal and the transmission terminal and the reception terminal of each transmission / reception system are formed in different regions when the laminate is divided into two parts by a plane perpendicular to the mounting surface. Since the high-frequency switch module is disposed between the antenna and the transmission / reception circuit, this terminal arrangement allows the antenna and the high-frequency switch module and the transmission / reception circuit and the high-frequency switch module to be connected with the shortest line, and an extra loss Can be prevented.

The present invention also provides a transmission / reception system which is provided on one side of an area opposite to the common terminal when the laminated body is divided into two, and the other side is divided into two parts by a plane perpendicular to the mounting surface. It is preferable that the transmission terminals of the respective transmission and reception systems are formed on the other side. For example, since two transmitting circuits and two receiving circuits are arranged collectively, the transmitting terminals and the receiving terminals of the multi-band high-frequency switch module are arranged close to each other, so that the shortest path connection is possible. , Preventing extra losses.

Also, in the present invention, in the laminate, a common terminal of a first transmission / reception system and a second transmission / reception system of the branching circuit, a transmission terminal of the first transmission / reception system, a reception terminal, Each terminal of the transmission terminal and the reception terminal of the second transmission / reception system is:
A ground terminal is formed on the side surface of the laminate, between the terminals. Each input / output terminal is arranged between the ground terminals. As a result, signal leakage between the terminals is blocked, interference is eliminated, and isolation between the signal terminals is ensured.

The laminate of the present invention can incorporate the transmission lines of the branching circuit and the switch circuit. The transmission line of the switch circuit is preferably formed in a region between the ground electrodes. Further, the branching circuit can be configured by an inductance component and a capacitance component.
This branching circuit is preferably arranged above the transmission line in the laminate. It is preferable that a capacitance component is disposed further above the ground electrode above the ground electrode with the transmission line interposed therebetween, and an inductance component is disposed above the capacitance component.

In the present invention, it is preferable to provide each transmission system with a low-pass filter function. As one means for providing this low-pass filter function, a low-pass filter circuit can be built in. This low-pass filter circuit can be composed of an inductance component and a capacitance component. The low-pass filter circuit is preferably disposed above the transmission line in the laminate.
That is, it is preferable that the capacitance component is disposed further above the ground electrode above the ground electrode with the transmission line interposed therebetween, and the inductance component is disposed above the capacitance component.
Further, it is preferable that the low-pass filter circuit and the demultiplexing circuit are arranged in different regions in the horizontal direction of the laminate.

A notch is formed in the ground electrode above the ground electrode sandwiching the transmission line, and a through hole is formed in the notch to conduct to the transmission line. And can be connected.

In the present invention, it is preferable to arrange a metal case so as to surround the chip components arranged on the laminate. This metal case is preferably mounted with the terminal electrodes on the side surfaces of the laminate exposed. Further, the metal case can be fixed to the upper surface of the laminate by soldering. Further, the high-frequency switch module of the present invention can be mounted on the mounter device by using the metal case.

The present invention deals with a plurality of transmission / reception systems having different passbands. Hereinafter, the case where two transmission / reception systems are handled will be described in detail with reference to the drawings.

FIG. 1 shows a circuit block diagram of a first embodiment according to the present invention. In FIG. 1, the high-frequency switch module for multiband of the present invention is a portion surrounded by a broken line. Also, this part is made into one chip. The multi-band high-frequency switch module of the present invention has a dual-band mobile phone antenna ANT, a GSM system as a first transmission / reception system, and a DCS1800 system as a second transmission / reception system. It can be used for distribution with the transmission and reception circuits of the DCS system and the DCS system.

The first embodiment is different from the first embodiment in which the first and second passbands are different.
A high-frequency switch module that handles a transmission / reception system (GSM) and a second transmission / reception system (DCS), and switches a transmission signal and a reception signal of the first transmission / reception system (GSM). A first low-pass filter circuit and a second transmission / reception system (D
CS), a second switch circuit for switching between the transmission signal and the reception signal, a second low-pass filter circuit connected to the transmission line of the second switch circuit, and demultiplexing the first transmission / reception system and the second transmission / reception system. It is composed of a demultiplexing circuit.

FIG. 2 shows an equivalent circuit diagram of an embodiment according to the present invention. In the branching circuit portion connected to the antenna ANT, two notch circuits are the main circuit. That is,
One notch circuit is formed by the inductor LF1 and the capacitor CF1, and another notch circuit is formed by the inductor LF2 and the capacitor CF2. The capacitor CF3 connected to the ground is connected to one notch circuit. This capacitor CF3 is connected for the purpose of improving the low-pass filter characteristics of the demultiplexing characteristics. Further, another notch circuit has an inductor LF3 connected to the ground and a capacitor CF4 connected in series. This inductor LF3 and capacitor CF4
Are connected for the purpose of improving the high-pass filter characteristic of the demultiplexing characteristic.

This demultiplexing circuit may be composed of only two notch circuits. In addition, for example, a band-pass circuit, a low-pass circuit, a high-pass circuit, or the like, other than the notch circuit, may be used as the branching circuit, and these may be appropriately combined.

Next, the first switch circuit will be described. The first switch circuit is a switch circuit on the upper side of FIG. 2 and switches between GSM transmission TX and reception RX. This switch circuit SW has two diodes D
G1 and DG2 and two transmission lines LG1 and LG2. The diode DG1 has an anode connected to the antenna ANT side, a cathode connected to the transmission TX side, and a transmission line LG1 connected to the ground connected to the cathode side. Have been. Then, the transmission line L is placed between the antenna side and the reception RX.
G2 is connected, a diode DG2 whose cathode is connected to its receiving side is connected, a capacitor CG6 is connected to the anode of the diode DG2 and the ground, and a series circuit of a resistor RG and an inductor LG is interposed therebetween. Connected to the control circuit VC1.

The low-pass filter circuit inserted on the transmission TX circuit side is composed of an inductor LG3 and capacitors CG3, CG4, CG7.
It is inserted between the W diode DG1 and the transmission line LG1.

Next, the second switch circuit will be described. The second switch circuit is a switch circuit on the lower side in FIG. 2 and switches between DCS transmission TX and reception RX. This switch circuit SW has two diodes D
P1 and DP2 and two transmission lines LP1 and LP2. The diode DP1 has an anode connected to the antenna ANT side, a cathode connected to the transmission TX side, and a transmission line LP1 connected to the ground connected to the cathode side. Have been. Then, the transmission line L is placed between the antenna side and the reception RX.
P2 is connected, and a diode DP2 having a cathode connected to the reception RX side is connected to the diode DP2.
A capacitor CP6 is connected between the anode and the ground, a series circuit of a resistor RP and an inductor LP is connected therebetween, and connected to the control circuit VC2.

The low-pass filter circuit inserted on the transmission TX circuit side is composed of an inductor LP3 and capacitors CP3, CP4 and CP7.
It is inserted between the W diode DP1 and the transmission line LP1.

Next, FIG. 3 is a plan view of an embodiment according to the present invention, FIG. 4 is a perspective view of a laminated body portion of the embodiment, and FIG. 5 is an internal structure of the laminated body. In this embodiment, a transmission line of a demultiplexing circuit, a low-pass filter circuit, and a switch circuit is formed in a multilayer body, and a diode and a chip capacitor are mounted on the multilayer body. It is what constituted.

The internal structure of the laminate will be described.
In this laminate, a green sheet made of a ceramic dielectric material that can be fired at a low temperature is prepared, and a conductive paste mainly composed of Ag is printed on the green sheet to form a desired electrode pattern. It is configured by laminating and integrally firing.

The internal structure will be described according to the order of lamination.
First, the ground electrode 31 is formed on almost the entire surface of the lower green sheet 11. Then, terminal electrodes 81, 83, 85, 87, 89, 91 formed on the side surfaces,
Connection portions for connecting to 93, 94, and 95 are provided.

Next, a dummy green sheet 12 on which no electrode pattern is printed is laminated. On the green sheet 13 thereon, three line electrodes 41, 42, 43
Are formed, and four line electrodes 44, 45, 46, 47 are formed on the green sheet 14 thereon.
A green sheet 15 on which two through-hole electrodes (the ones with a cross in the figure are cross-holes in the figure are the through-hole electrodes, the same applies hereinafter) is laminated thereon, and a ground electrode 32 is formed thereon. Green sheets 16 are stacked.

The line electrodes formed in the region sandwiched between the two ground electrodes 31 and 32 are appropriately connected to form a transmission line for the first and second switch circuits SW. The line electrodes 42 and 46 are connected by through-hole electrodes to form a transmission line LG1 of an equivalent circuit.
1 and 45 are connected by through-hole electrodes to form a transmission line LG2 of an equivalent circuit; line electrodes 43 and 47 are connected by through-hole electrodes to form a transmission line LP1 of an equivalent circuit; Of the transmission line LP2.

The green sheet 17 laminated on the green sheet 16 has electrodes 61 and 62 for capacitors,
63, 64, 65 and 66 are formed. The green sheet 18 laminated thereon also has the capacitor electrode 6
7, 68, 69 and 70 are formed. On the green sheet 19 laminated thereon, a capacitor electrode 71 is formed.

Further, a green sheet 20 on which line electrodes 48 and 49 are formed is laminated thereon.
Green sheets 21 on which line electrodes 50, 51, 52, 53, 54, 55 are formed are stacked. The uppermost green sheet 22 has lands 23, 24, 25, 26, 27, 28, 29, 33, 3 for mounting element connection.
4, 35, 36 and 37 are formed.

The capacitor electrodes 61, 62, 63, 64, 65 of the green sheet 17 laminated on the green sheet 16 on which the upper earth electrode 32 is formed form a capacitance with the earth electrode 32. The capacitor electrode 61 is connected to the CG4 of the equivalent circuit by the capacitor electrode 62.
Is the equivalent circuit CG3, the capacitor electrode 63 is the equivalent circuit CP4, the capacitor electrode 64 is the equivalent circuit CP3, and the capacitor electrode 65 is the equivalent circuit CF3.
3.

The capacitor electrodes formed on the green sheets 17, 18, and 19 form a capacitance between each other, and constitute an equivalent circuit CF4 between the capacitor electrodes 66 and 70. 69, an equivalent circuit CP7 is formed, and between the capacitor electrodes 62 and 67,
The CG 7 of the equivalent circuit is formed, and the capacitor electrodes 70 and 71
, An equivalent circuit CF2 is formed, and the capacitor electrode 6
8 and 71 constitute an equivalent circuit CF1. In the capacitor electrode 66, a capacitance is formed facing the capacitor electrode 70. At this time, a cutout portion is formed in the ground electrode 32 so as not to face the ground electrode 32. In addition, a through-hole electrode that conducts to the transmission line is formed by using the notch.

In the green sheets 20 and 21, the line electrodes 48 and 55 constitute the equivalent circuit LF1, the line electrodes 54 and 56 constitute the equivalent circuit LF2, and the line electrodes 49 and 53 constitute the equivalent circuit LF3. The line electrode 50 constitutes an equivalent circuit LG3, and the line electrode 52 constitutes an equivalent circuit LP3. The line electrode 51
Is a DC line.

These green sheets were pressed and fired integrally to obtain a laminate. A terminal electrode 8 is provided on the side surface of the laminate.
1, 82, 83, 84, 85, 86, 87, 88, 8
9, 90, 91, 92, 93, 94, 95, 96 were formed. This external view is shown in FIG.

On this laminate, diodes DG1 and D
G2, DP1, DP2, chip capacitors CG1, CG
6, CP1 and CP6. Further, a chip inductor LP4 and a chip capacitor CP8 are mounted. This LC series circuit is connected to improve the isolation characteristics between the transmission TX of this switch circuit and the antenna ANT when the diode is OFF, but it is not always necessary to mount it. FIG. 3 is a plan view showing a state where the mounting element is mounted. FIG. 3 also shows a mounting configuration of the high-frequency switch module. This figure 3
And GRD means a terminal connected to the ground. In this embodiment, in the equivalent circuit shown in FIG.
P2, CP5, CG2, CG5, RG, LG, RP, L
P is formed on a circuit on which the chip component of this embodiment is mounted. Further, the capacitor CP1 may be omitted.

According to this embodiment, when the transmission lines of the first and second switch circuits are formed in the laminate, they are arranged in a region sandwiched between the ground electrodes. This allows
This prevents interference between the switch circuit, the demultiplexing circuit, and the low-pass filter circuit. A region sandwiched between the ground electrodes is arranged below the stacked body to make it easier to obtain a ground potential. Then, an electrode constituting a capacitor connected to the ground is formed so as to face the upper ground electrode.

Further, in this embodiment, each terminal is formed on the side surface of the laminated body, so that the structure can be surface-mounted. In addition, ANT terminal which is a high frequency terminal, DCS type TX terminal, GS
The M-system TX terminal, the GSM-system RX terminal, and the DCS-system RX terminal are arranged so as not to be adjacent to each other, and a ground terminal (GRD) or a control terminal (VC1, VC2) is arranged between the high-frequency terminals. ing. At least one ground terminal is arranged between the high-frequency terminals. Further, at least one ground terminal is arranged on each side surface of the laminate.

In the terminal electrode formed on the side surface of the laminate of this embodiment, a GSM transmission TX terminal is provided on the opposite side of the antenna ANT terminal from which the laminate is divided by a plane perpendicular to the mounting surface. , A reception RX terminal, a transmission TX terminal of the DCS system, and a reception RX terminal. further,
On the other side, a transmission TX terminal of the GSM system and a transmission TX terminal of the DCS system are formed on one half, and a reception RX terminal of the GSM system and a reception RX terminal of the DCS system are formed on the other half. ing.

Further, in the laminate of this embodiment, the antenna ANT terminal formed on the side surface, the GSM transmission TX terminal, the reception RX terminal, the DCS transmission TX terminal, and the reception RX
Each of the high-frequency terminals is sandwiched between ground terminals when viewed in the circumferential direction on the side surface.

According to the embodiment of the present invention, an antenna ANT, a transmission system and a reception system of the GSM system, a transmission system of the DCS1800 system, and a reception system of the dual band portable telephone handling both the GSM system and the DCS1800 system. The multi-band high-frequency switch module capable of switching between the two can be obtained. Further, the present invention is not limited to the above embodiment, and can provide a multi-band high-frequency switch module that handles a plurality of transmission / reception systems having different pass bands.

[0064]

According to the present invention, it is possible to provide a multi-band high-frequency switch module which is extremely useful, for example, in a dual-band portable telephone.
According to the present invention, the multi-band high-frequency switch module can be made compact and one-chip by using a laminated structure. This allows
In a dual-band mobile phone or the like, this is effective for miniaturization of equipment.

[Brief description of the drawings]

FIG. 1 is a circuit block diagram of one embodiment according to the present invention.

FIG. 2 is an equivalent circuit diagram of one embodiment according to the present invention.

FIG. 3 is a plan view of one embodiment according to the present invention.

FIG. 4 is a perspective view of a laminate according to one embodiment of the present invention.

FIG. 5 is an internal structural view of a laminated body according to one embodiment of the present invention.

[Explanation of symbols]

11, 12, 13, 14, 15, 1, 17, 18, 1,
9, 20, 21, 22 Dielectric green sheet 31, 32 Earth electrode 41, 42, 43, 44, 45, 46, 47, 48, 4,
9, 50, 51, 52, 53, 54, 55, 56 Line electrodes 61, 62, 63, 64, 65, 66, 67, 68, 6
9, 70, 71 Electrode for capacitor 81, 82, 83, 84, 85, 86, 87, 88, 8
9, 90, 91, 92, 93, 94, 95, 96 terminal electrodes

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Takeshi Takeda 70-2 Minamisakaemachi, Tottori City, Tottori Prefecture F-term in the Tottori Plant of Hitachi Metals, Ltd.

Claims (19)

[Claims] 1. A high-frequency switch module for handling a plurality of transmission / reception systems having different passbands, comprising: a demultiplexing circuit for demultiplexing a signal to the plurality of transmission / reception systems; It has a switch circuit for switching a receiving system, the high-frequency switch module is composed of a laminate of an electrode pattern and a dielectric layer, and a chip element disposed on the laminate, on the outer surface of the laminate, A multi-band high-frequency switch module comprising a common terminal of the plurality of transmission / reception systems, a transmission system terminal of each of the transmission / reception systems, and a reception system terminal. 2. The common terminal, the transmission system terminals, and the reception system terminals are formed on side surfaces of the multilayer body, and at least one ground terminal is formed on each side surface of the multilayer body. 2. The multi-band high-frequency switch module according to claim 1, wherein: 3. The high frequency terminal (the common terminal, each transmission system terminal, each reception system terminal) is formed on a side surface of the laminate, and the high frequency terminals are arranged in a structure not adjacent to each other. The high-frequency switch module for a multi-band according to claim 1, wherein: 4. The high frequency terminal (the common terminal, each transmission system terminal, each reception system terminal) is formed on a side surface of the laminate, and a ground terminal or a switch circuit control terminal is provided between the high frequency terminals. 2. The high frequency terminal is arranged in a structure in which the high frequency terminals are not adjacent to each other.
The high-frequency switch module for multi-band as described. 5. The high frequency terminal (the common terminal, each transmission system terminal, each reception system terminal) is formed on a side surface of the laminate, and at least one ground terminal is arranged between the high frequency terminals. 2. The multi-band high-frequency switch module according to claim 1, wherein: 6. The multi-band high-frequency switch module according to claim 1, wherein the switch circuit is a diode switch, and a control terminal of the diode switch is formed on a side surface of the multilayer body. 7. A transmission system terminal and a reception system terminal of each transmission / reception system are formed on a side surface of the laminate, and the transmission system terminal and the reception system terminal are arranged in line symmetry. The high-frequency switch module for a multi-band according to claim 1, wherein: 8. A transmission system terminal and a reception system terminal of each of the transmission / reception systems are formed on a side surface of the multilayer body, and the transmission system terminal and the reception system terminal are arranged with respect to a center line of the multilayer body. 2. The dual-band high-frequency multimodule according to claim 1, wherein the multiband high-frequency multimodules are arranged in different areas. 9. The laminated body, wherein the common terminal includes:
2. The multi-band device according to claim 1, wherein the transmission system terminal and the reception system terminal of each transmission / reception system are formed in separate areas when the laminate is divided into two parts by a plane perpendicular to a mounting surface. 3. High frequency switch module. 10. The transmission / reception system of each of the transmission / reception systems is provided on one side of an area opposite to the common terminal when the laminate is divided into two and further divided into two sides by a plane perpendicular to a mounting surface. 10. A system terminal is formed, and a reception system terminal of each of the transmission and reception systems is formed on the other side.
The high-frequency switch module for multi-band as described. 11. The multi-band high-frequency switch module according to claim 1, wherein the branching circuit and the transmission line for the switch circuit are formed by an electrode pattern in a laminate. 12. The multi-band high-frequency switch module according to claim 11, wherein the transmission line for the switch circuit is formed in a region sandwiched between ground electrodes in the laminate. 13. In the laminate, the transmission line for the switch circuit is formed in a region sandwiched between ground electrodes, and a capacitive component for the demultiplexing circuit is formed further above the ground electrode. The multi-band high-frequency switch module according to claim 11, wherein an inductance component for the branching circuit is further formed on an upper portion thereof. 14. The multi-band high-frequency switch module according to claim 1, wherein each of the transmission systems in the transmission / reception systems has a low-pass filter function from the branching circuit. 15. The multi-band high-frequency switch module according to claim 14, wherein the low-pass filter circuit for obtaining the low-pass filter function is configured by an electrode pattern in the laminate. 16. The laminated body, wherein the transmission line is formed in a region sandwiched between ground electrodes, and further above the ground electrode, a capacitance component for the low-pass filter circuit and a capacitor component for the demultiplexer circuit. Is formed,
16. The multi-band high-frequency switch module according to claim 15, wherein an inductance component for the low-pass filter circuit and an inductance component for the demultiplexing circuit are further formed on an upper portion thereof. 17. The multi-band according to claim 15, wherein in the laminate, the branching circuit and the low-pass filter circuit are formed separately in different regions in the horizontal direction of the laminate. For high frequency switch module. 18. In the laminate, the transmission line is formed in a region sandwiched between ground electrodes, and a cutout is formed in a ground electrode above the ground electrode.
2. The multi-band high-frequency switch module according to claim 1, wherein a through-hole connected to the transmission line is formed in the notch. 19. The multi-band high-frequency switch module according to claim 1, wherein a metal case surrounding the chip element disposed on the laminate is disposed on the laminate.