JP3925804B2 - High frequency switch module for triple band - Google Patents

Description

  The present invention relates to a high-frequency switch that handles a plurality of transmission / reception systems, and relates to a triple-band high-frequency switch module that handles three transmission / reception systems having different pass bands.

  In a digital cellular phone or the like, a high frequency switch is used to switch the connection between the antenna ANT and the transmission circuit TX and the connection between the antenna ANT and the reception circuit RX. As this high-frequency switch, there is one disclosed in JP-A-6-197040.

  In this conventional high-frequency switch, a first diode whose anode is connected to the transmitting circuit side and whose cathode is connected to the antenna side, a strip line connected between the antenna and the receiving circuit, and an anode connected to the receiving circuit side A second diode having a cathode connected to the ground side, the strip line is built in the multilayer substrate, and the first diode and the second diode are mounted on the multilayer substrate. In addition, this conventional high-frequency switch corresponds to only one transmission / reception system (single band).

  In recent years, the spread of mobile phones has been remarkable, and the functions and services of mobile phones have been improved. As this new mobile phone, proposals such as a dual-band mobile phone and a triple-band mobile phone have been made. This dual-band mobile phone handles two transmission / reception systems, whereas a normal mobile phone handles only one transmission / reception system, and a triple-band mobile phone handles three transmission / reception systems. Thereby, the user can select and use a convenient transmission / reception system.

  In this dual or triple band mobile phone, if a dedicated circuit is configured for each transmission / reception system, the size and cost of the device will increase. Using common parts as much as possible for the common parts is advantageous in reducing the size and cost of the equipment.

  The present invention is a triple-band high-frequency switch module having a common antenna and capable of switching between the transmission circuit and the reception circuit of the first, second, and third transmission / reception systems, and includes three transmission / reception systems having different passbands. The object is to construct a triple-band high-frequency switch module to be handled with a one-chip laminate.

The present invention is connected to an antenna and separates the first transmission / reception system on the low frequency side and the second and third transmission / reception systems on the high frequency side, and is connected to the branching circuit. A first switch circuit that switches between a transmission system and a reception system of the transmission / reception system, and a branching circuit connected to the branching circuit, the second transmission / reception system reception system, the third transmission / reception system reception system, and the second An electrode pattern formed on the inside and on the surface of a laminate composed of a plurality of dielectric layers, and a second switch circuit that switches a shared transmission system to the third transmission / reception system, A triple-band high-frequency switch module configured using a chip element mounted on the laminate, wherein the branching circuit is configured by an LC circuit, and each switch circuit includes a diode, an antenna side, and a receiving circuit connected between the Has a transmission line, said transmission line, said in the laminate, it is formed by connecting a plurality of dielectric layers line electrodes of each switch circuit formed on one surface in each through-hole electrodes, different dielectric layers the first and the line electrodes of the switching circuit and the line electrode of the second switching circuit do not overlap each other in the stacking direction, and the ground electrodes on the upper and lower of the line electrodes are formed a dielectric layer formed on A triple-band high-frequency switch module having a formed dielectric layer.

  In the triple-band high-frequency switch module of the present invention, the line electrode for the reception-side transmission line of each switch circuit includes the through-hole electrode provided in the dielectric layer on which the ground electrode is formed above. This is a triple-band high-frequency switch module connected to a transmission system diode of the switch circuit.

  The triple-band high-frequency switch module of the present invention can be configured in a small size and on a single chip by using a laminated structure. As a result, it becomes effective for downsizing of devices in triple band mobile phones and the like.

  The present invention is a triple-band high-frequency switch module that handles three transmission / reception systems with different passbands. For example, the antenna is shared, and the transmission / reception system of the first transmission / reception system, the first transmission / reception system and the passage A triple-band high-frequency switch module capable of switching between a transmission system and a reception system of a second transmission / reception system with different bands, and a third transmission / reception system with a different pass band, a transmission system and a reception system, and an antenna. For example, it is effective in a triple band mobile phone or the like. This triple-band high-frequency switch module is made compact by arranging a laminated structure and chip parts on the laminated body, and particularly has a feature in the arrangement of line electrodes formed on the dielectric layer. Yes.

  According to the present invention, the first transmission / reception system and the second and third transmission / reception systems are divided by the branching circuit of the antenna side circuit, and the first switch circuit is provided in the first transmission / reception system. The transmission system and the reception system are separated. Further, the second switch circuit is provided in the second and third transmission / reception systems, the transmission system common to the second and third transmission / reception systems, the reception system of the second transmission / reception system, and the third transmission / reception system. The receiving system is separated and the transmission terminal of the second transmission / reception system and the transmission terminal of the third transmission / reception system are shared.

  In the present invention, a common terminal of a plurality of transmission / reception systems, a transmission system terminal of each transmission / reception system, and a reception system terminal are formed on the side surface of the laminated body to enable surface mounting. Each terminal formed on the side surface may be extended to the upper surface or the lower surface. At least one ground terminal is formed on each side surface. By disposing a ground terminal on each side surface, the loss of the triple-band high-frequency switch module of the present invention can be reduced.

  A diode switch circuit can be used for each transmission / reception switch circuit of the present invention. In this diode switch circuit, a control terminal for applying a predetermined voltage to the diode is used. This control terminal is formed on the side surface of the laminate.

  In the present invention, it is preferable that the transmission system terminal and the reception system terminal are arranged so that the transmission system terminals and the reception system terminals are close to each other. Moreover, it is preferable to arrange | position a transmission system terminal and a receiving system terminal in a respectively separate area | region with respect to the centerline which bisects a laminated body to a longitudinal direction when seeing a laminated body. With this configuration, in a device that handles a plurality of transmission / reception systems on which a high-frequency switch module is mounted, it is easy to connect to a transmission system circuit and a reception system circuit, and extra loss can be prevented.

  In the present invention, it is preferable that the common terminal and the transmission terminal and the reception terminal of each transmission / reception system are formed in different regions when the laminate is divided into two parts by a plane perpendicular to the mounting surface. That is, the common terminal is arranged on one side and the transmitting terminal and the receiving terminal are arranged on the other side with respect to the center line that is divided in the short direction when the laminated body is seen in the laminating direction. Since this high-frequency switch module is arranged between the antenna and the transmission / reception circuit, this terminal arrangement allows the antenna and the high-frequency switch module, and the transmission / reception circuit and the high-frequency switch module to be connected with the shortest line, resulting in an extra loss. Can be prevented.

  The laminate of the present invention can incorporate a transmission line of a branching circuit and a switch circuit. The transmission line of this switch circuit is preferably formed in a region sandwiched between ground electrodes. Further, the branching circuit can be composed of an inductance component and a capacitance component. This branching circuit is preferably arranged above the transmission line in the laminate. And it is preferable to have a structure in which a capacitive component is disposed further above the ground electrode above the ground electrode sandwiching the transmission line, and an inductance component is disposed further above.

  In the present invention, each transmission system is preferably provided with a low-pass filter function. As one means for providing this low-pass filter function, a low-pass filter circuit can be built in the laminate. This low-pass filter circuit can be composed of an inductance component and a capacitance component. And it is preferable that this low-pass filter circuit is arrange | positioned above a transmission line within a laminated body. In other words, it is preferable to have a structure in which a capacitive component is disposed further above the ground electrode above the ground electrode that sandwiches the transmission line, and an inductance component is disposed further above. Further, the electrode pattern for the low-pass filter circuit and the electrode pattern for the demultiplexing circuit circuit are configured in separate regions in the horizontal direction of the multilayer body so as not to overlap when the multilayer body is transparently viewed in the lamination direction. It is preferable.

  A ground electrode on the upper side of the ground electrode sandwiching the transmission line is provided with a notch, and a through hole is formed in the notch to be connected to the transmission line and connected to the upper branching circuit and the low-pass filter circuit. be able to.

  In the present invention, it is preferable to dispose a metal case so as to surround the chip component disposed on the laminate. The metal case is preferably mounted with the terminal electrode on the side surface of the laminate exposed. The metal case can be fixed to the upper surface of the laminate by soldering. Moreover, the high frequency switch module of this invention can be mounted with a mounter apparatus by this metal case.

  A circuit block diagram of the first embodiment according to the present invention is shown in FIG. In FIG. 1, the triple-band high-frequency switch module of the present invention is a portion surrounded by a broken line. Further, this portion is substantially made into one chip. The triple-band high-frequency switch module of the present invention includes, for example, a GSM system (transmission TX.880-915 MHz, reception RX.925-960 MHz) as a first transmission / reception system, and a DCS1800 system (transmission TX.1710) as a second transmission / reception system. -1785 MHz, reception RX. 1805 to 1880 MHz), and a third-band mobile phone antenna as a third transmission / reception system corresponding to the three systems PCS system (transmission TX. 1850 to 1910 MHz, reception RX. 1930 to 1990 MHz) It can be used for distribution between ANT and GSM, DCS, and PCS transmission / reception circuits. Also, the DCS transmission system and the PCS transmission system are shared.

This first embodiment has a demultiplexing circuit that demultiplexes the first transmission / reception system (GSM) and the second and third transmission / reception systems (DCS, PCS) from a terminal connected to the ANT. The transmission signal (GSM) of the first transmission / reception system (GSM) demultiplexed by the wave circuit
TX) and a first switch circuit SW for switching a received signal (GSM RX), and a first low-pass filter circuit (LPF) connected to the transmission line of the first switch circuit. The second and third transmission / reception systems (DCS, PCS) demultiplexed by the demultiplexing circuit receive signals (DCS) of the second transmission / reception system (DCS).
RX), a third transmission / reception system (PCS) reception signal (PCS RX), and a second switch circuit SW for switching the second and third transmission signals (DCS, PCS TX), A second low-pass filter circuit (LPF) connected to the transmission line of the switch circuit is included.

  An equivalent circuit diagram of one embodiment according to the present invention is shown in FIG. The branching circuit portion connected to the antenna ANT has two notch circuits as main circuits. That is, the inductor LF1 and the capacitor CF1 constitute one notch circuit, and the inductor LF2 and the capacitor CF2 constitute another notch circuit. A capacitor CF3 connected to the ground is connected to one notch circuit. The capacitor CF3 is connected for the purpose of improving the low-pass filter characteristic of the demultiplexing characteristic. In addition, an inductor LF3 connected to the ground and a capacitor CF4 are connected in series to the other notch circuit. The inductor LF3 and the capacitor CF4 are connected for the purpose of improving the high-pass filter characteristic of the demultiplexing characteristic.

  This branching circuit may be only two notch circuits. In addition to the notch circuit, for example, a band-pass circuit, a low-pass circuit, a high-pass circuit, or the like may be used for this branching circuit, and these may be combined as appropriate.

  Next, the first switch circuit will be described. The first switch circuit is a switch circuit on the upper side of FIG. 2 and switches the GSM transmission circuit TX and the reception circuit RX. This switch circuit mainly includes two diodes DG1 and DG2 and two transmission lines LG1 and LG2. The diode DG1 has an anode connected to the antenna ANT side, a cathode connected to the transmission circuit TX side, and a cathode side thereof. The transmission line LG1 connected to the ground is connected to the ground. A transmission line LG2 is connected between the antenna side and the receiving circuit RX, a diode DG2 having a cathode connected to the receiving circuit side RX is connected, and a capacitor CG6 is connected between the anode of the diode DG2 and the ground. A series circuit of an inductor LG and a resistor R1 is connected between them and connected to the control circuit VC1.

  The low-pass filter circuit inserted on the transmission circuit TX side includes an inductor LG3 and capacitors CG3, CG4, and CG7, and is inserted between the diode DG1 of the switch circuit and the transmission line LG1.

  Next, the second switch circuit will be described. The second switch circuit is a switch circuit on the lower side of FIG. 2, and switches between the DCS system reception circuit RX, the PCS system reception circuit RX, and the DCS system and PCS system transmission circuit TX. This switch circuit is mainly composed of three diodes DP1, DP2, DP3 and two transmission lines LP1, LP2. The diode DP1 has a cathode connected to the antenna ANT side and an anode on the DCS and PCS transmission circuit TX side. A transmission line LP1 connected to the ground via a capacitor CGP is connected to the anode side. A control circuit VC3 is connected between the transmission line LP1 and the capacitor CGP. A transmission line LP2 is connected between the antenna side and the DCS receiving circuit RX, a diode DP2 having an anode connected to the DCS receiving circuit RX side is connected, and the cathode of the diode DP2 is connected to the ground. A capacitor CP6 and a resistor R3 are connected. The diode DP3 is connected between the antenna side and the PCS receiving circuit RX, the cathode of the diode DP3 is connected to the antenna side, and the control circuit VC2 is connected to the anode side via the inductor LP and the resistor R2. .

  The low-pass filter circuit inserted on the DCS and PCS transmission circuit TX side includes an inductor LP3 and capacitors CP3, CP4, and CP7, and is inserted between the diode DP1 of the switch circuit SW and the transmission line LP1. .

  Table 1 shows the control logic of each control circuit VC1, VC2, VC3 of the switch module of this embodiment. Thereby, each mode is changed.

  Next, FIG. 3 is a plan view of an embodiment according to the present invention, FIG. 4 is a perspective view of a laminate portion of the embodiment, and FIG. 5 is an internal structure diagram of the laminate. In this embodiment, the transmission line of the demultiplexing circuit, the low-pass filter circuit, and the switch circuit is configured in a laminated body, and a diode and a chip capacitor are mounted on the laminated body, thereby forming a one-chip triple-band high-frequency switch module. Is configured. P1 to P16 given to the external terminals of the perspective portion shown in FIG. 4 match the P numbers such as P2 and P4 in the equivalent circuit of FIG.

  The internal structure of this laminate will be described. For this laminate, a green sheet made of a ceramic dielectric material that can be fired at a low temperature is prepared, and a conductive paste mainly composed of Ag is printed on the green sheet to form a desired electrode pattern. It is constructed by laminating and firing together.

  This internal structure will be described according to the stacking order. First, the ground electrode 31 is formed on almost the entire surface of the lower green sheet 11. And the connection part for connecting with the terminal electrodes 81, 83, 87, 89, 91, 93, 95 formed in a side surface is provided.

  Next, a dummy green sheet 12 on which no electrode pattern is printed is laminated. One line electrode 41 is formed on the green sheet 13 thereon, four line electrodes 42, 43, 44, and 45 are formed on the green sheet 14 thereon, and the green sheet 15 is formed on the green sheet 15 thereon. Four line electrodes 46, 47, 48, 49 are formed. A green sheet 16 on which two through-hole electrodes (the one marked with a cross in the figure is a through-hole electrode, the same applies hereinafter) is laminated thereon, and a ground electrode 32 is formed thereon. The green sheets 17 are stacked.

  Line electrodes formed in a region sandwiched between the two ground electrodes 31 and 32 are appropriately connected to form a transmission line for the first and second switch circuits SW. The line electrodes 41, 42 and 46 are connected by through-hole electrodes to constitute a transmission line LG1 of an equivalent circuit, and the line electrodes 45 and 49 are connected by through-hole electrodes to constitute a transmission line LG2 of an equivalent circuit. 43 and 47 are connected by through-hole electrodes to constitute an equivalent circuit transmission line LP1, and line electrodes 44 and 48 are connected by through-hole electrodes to constitute an equivalent circuit transmission line LP2.

  Capacitor electrodes 61, 62, 63, 64, 65, 66 are formed on the green sheet 18 laminated on the green sheet 17. Capacitor electrodes 67, 68 and 69 are also formed on the green sheet 19 laminated thereon. A capacitor electrode 70 is formed on the green sheet 20 laminated thereon.

  Furthermore, the green sheet 21 on which the line electrodes 50, 51, 52, 53, 54 are formed is laminated thereon, and the green sheet 22 on which the line electrodes 55, 56, 57, 58, 59 are formed. Are stacked. The uppermost green sheet 23 is formed with lands for connecting mounted elements.

  Capacitor electrodes 61, 62, 63, 64, 66 of the green sheet 18 laminated on the green sheet 17 on which the upper ground electrode 32 is formed form a capacitance with the ground electrode 32, and the capacitor The electrode 61 is equivalent circuit CP3, the capacitor electrode 62 is CP4 equivalent circuit, the capacitor electrode 63 is equivalent circuit CG4, the capacitor electrode 64 is equivalent circuit CG3, and the capacitor electrode 66 constitutes an equivalent circuit CF3.

  The capacitor electrodes formed on the green sheets 18, 19, and 20 form a capacitance between them, and an equivalent circuit CF4 is formed between the capacitor electrodes 65 and 68. Similarly, the capacitor electrodes 61, 62, and 67 are formed. The equivalent circuit CP7 is formed between the capacitor electrodes 69 and 70, and the equivalent circuit CF1 is formed between the capacitor electrodes 69 and 70, and the equivalent circuit CF2 is formed between the capacitor electrodes 68 and 70. In this capacitor electrode 65, a capacitor is formed facing the capacitor electrode 68. At this time, a cutout portion is formed in the ground electrode 32 so as not to face the ground electrode 32. In addition, a through-hole electrode that is electrically connected to the transmission line is formed using this notch.

  In the green sheets 21 and 22, the line electrodes 52 and 59 constitute an equivalent circuit LF1, the line electrodes 54 and 58 constitute an equivalent circuit LF2, and the line electrode 53 constitutes an equivalent circuit LF3. 51 and 57 constitute an equivalent circuit LG3, and the line electrode 55 constitutes an equivalent circuit LP3. The line electrodes 50 and 56 are wiring lines. The line electrodes 51 and 57 constitute an equivalent circuit LG3, but the line electrodes 51 and 57 are formed so as to partially face each other, and the opposed portions constitute the equivalent circuit CG7. .

  These green sheets were pressure-bonded and integrally fired to obtain a laminate. Terminal electrodes 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96 were formed on the side surface of this laminate. This external view is shown in FIG.

  On this laminate, diodes DG1, DG2, DP1, DP2, DP3, chip capacitors CG1, CG6, CGP, CP6, and chip resistor R3 were mounted. FIG. 3 is a plan view showing a state in which this mounting element is mounted. FIG. 3 also shows the mounting configuration (connection structure of each terminal) of the high-frequency switch module. In FIG. 3, GRD means a terminal connected to the ground. In this embodiment, among the equivalent circuit shown in FIG. 2, CP2, CP5, CG2, CG5, R1, LG, R2, LP, and CP7 are formed on the circuit on which the chip component of this embodiment is mounted.

  According to this embodiment, when the transmission lines of the first and second switch circuits are formed in the laminated body, they are arranged in a region sandwiched between the ground electrodes. As a result, interference between the switch circuit, the branching circuit, and the low-pass filter circuit is prevented. A region sandwiched between the ground electrodes is arranged at the lower part of the stacked body to make it easy to obtain the ground potential. And the electrode which comprises the capacitor | condenser connected between ground is formed facing the upper ground electrode.

  Further, in this embodiment, each terminal is formed on the side surface of the laminate, and has a structure capable of surface mounting. Each terminal on the side is an ANT terminal, a DCS / PCS system TX terminal, a GSM system TX terminal, a GSM system RX terminal, a DCS system RX terminal, a PCS system RX terminal, a ground terminal (GRD), or a control terminal (VC1, VC2, VC3). In addition, at least one ground terminal is disposed on each side surface of the laminate.

  Further, in the terminal electrode formed on the side surface of the laminate of this embodiment, on the opposite side of the antenna ANT terminal which is divided into two by the plane perpendicular to the mounting surface, a DCS / PCS-based TX terminal, A GSM TX terminal, a GSM RX terminal, a DCS RX terminal, and a PCS RX terminal are formed. Further, on the opposite side of the ANT terminal on which the TX terminal group and the RX terminal group are formed, a transmission TX terminal group is formed on one half of the ANT terminal, and a reception RX terminal group is formed on the other side. .

  In this embodiment, the antenna ANT terminal is sandwiched between ground terminals, the transmission TX terminal is sandwiched between ground terminals, and the reception RX terminal group is also sandwiched between ground terminals. A ground terminal is formed between the antenna ANT terminal, the transmission TX terminal, and the reception RX terminal. VC1, VC2, and VC3 are also sandwiched between ground terminals.

  According to an embodiment of the present invention, an antenna ANT, a GSM transmission system, a reception system, a DCS1800 transmission system, and a reception system in a triple band mobile phone that handles three bands of GSM system, DCS1800 system, and PCS system. In addition, a high frequency switch module capable of switching between a PCS transmission system and a reception system could be obtained. Further, the present invention is not limited to the above-described embodiment, and a triple-band high-frequency switch module that handles three transmission / reception systems having different pass bands can be obtained.

  In addition, if the DCS transmission system and the PCS transmission are separated from each other, two switch circuits are required. By sharing the terminals of the DCS transmission system and the PCS transmission system, two switch circuits are provided. Can be configured. This also makes it possible to share the amplifier in the previous stage of the DCS system and PCS system transmission system terminals of the triple-band high-frequency switch module.

  FIG. 6 is an equivalent circuit diagram of another embodiment of the present invention, FIG. 7 is a plan view, and FIG. 8 is an internal structural diagram of the laminate. This embodiment has many parts similar to the above-described embodiment, and different parts will be described.

  First, the duplexer portion is the same. The first switch circuit portion of the first transmission / reception system (GSM) is also substantially the same, except that the transmission line LG1 is not connected to the ground, but is controlled together with the transmission line LP1 of the second switch circuit. This is where the circuit VC3 is connected. In the second switch circuit, the directions of the diodes DP1, DP2, and DP3 are reversed. A control circuit VC4 is connected between the diode DP2 and the capacitor CP6 via a series circuit of an inductor LD and a resistor R3.

  In the laminated structure, the connection part to the terminal electrode 89 of the ground electrode 31 of the green sheet 11 is eliminated. In the green sheet 15, the lead terminal of the line electrode 46 is changed. In the green sheet 17, the connection part of the ground electrode 32 to the terminal electrode 89 is eliminated. In the green sheet 21, a line electrode 71 is added. The line electrode 71 is a wiring line. In the green sheet 22, a through hole connected to the line electrode 71 is added. In the green sheet 23, the land shape is appropriately changed.

  On the laminate, diodes DG1, DG2, DP1, DP2, DP3, chip capacitors CG1, CG6, CGP, CP6 were mounted. FIG. 7 is a plan view showing a state in which this mounting element is mounted. FIG. 7 also shows the mounting configuration (connection structure of each terminal) of the high-frequency switch module. In FIG. 7, GRD means a terminal connected to the ground. In this embodiment, among the equivalent circuits shown in FIG. 6, CP2, CP5, CG2, CG5, R1, LG, R2, LP, CP7, R3, and LD are on the circuit on which the chip parts of this embodiment are mounted. It is formed.

  Table 2 shows the control logic of each control circuit VC1, VC2, VC3, VC4 of the switch module of this embodiment. Thereby, each mode is changed.

  Also in this embodiment, the triple-band high-frequency switch module has the same effect as the above-described embodiment.

  According to the present invention, it is possible to provide a triple-band high-frequency switch module that is extremely useful in, for example, a triple-band mobile phone. According to the present invention, the triple-band high-frequency switch module can be configured in a small size and in one chip by using a laminated structure. As a result, it becomes effective for downsizing of devices in triple band mobile phones and the like.

It is a circuit block diagram of one example concerning the present invention. 1 is an equivalent circuit diagram of an embodiment according to the present invention. It is a top view of one example concerning the present invention. It is a perspective view of the laminated body of one Example which concerns on this invention. It is an internal structure figure of the laminated body of one Example which concerns on this invention. It is an equivalent circuit schematic of another Example which concerns on this invention. It is a top view of another example concerning the present invention. It is an internal structure figure of the laminated body of another Example which concerns on this invention.

Explanation of symbols

11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23 Dielectric green sheets 31, 32 Ground electrodes 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 71
Line electrodes 61, 62, 63, 64, 65, 66, 67, 68, 69, 70 Capacitor electrodes 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94 95, 96 Terminal electrode

Claims (2)

A first transmission / reception system on the low frequency side, a demultiplexing circuit for separating the second and third transmission / reception systems on the high frequency side, and a demultiplexing circuit connected to the antenna; A first switch circuit that switches between a transmission system and a reception system; and a second transmission / reception system reception system, a third transmission / reception system reception system, and a second transmission / reception system that are connected to the branching circuit. A second switch circuit for switching a shared transmission system to the third transmission / reception system;
These are triple-band high-frequency switch modules configured by using electrode patterns formed on and inside a laminate composed of a plurality of dielectric layers, and chip elements mounted on the laminate,
The branching circuit is composed of an LC circuit,
Wherein each switch circuit includes a diode, a connected transmission line between the antenna side and a reception circuit, said transmission line, said in the laminate, each formed on one surface on the plurality of dielectric layers The line electrodes of the first switch circuit and the line electrode of the second switch circuit, which are formed by connecting the line electrodes of the switch circuit with through-hole electrodes and formed in different dielectric layers, overlap each other in the stacking direction. match not, and the high-frequency switch module for a triple band comprising the dielectric layer is a ground electrode is formed on the upper and lower of the line electrodes are formed dielectric layer.   The line electrode for the reception-side transmission line of each switch circuit is connected to the transmission system diode of the switch circuit via a through-hole electrode provided in the dielectric layer on which the upper ground electrode is formed. The triple-band high-frequency switch module according to claim 1.

Images