JP2006203946A - High-frequency switch module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a miniaturized and high-performance high-frequency switch module capable of switching transmission circuits and reception circuits of a plurality of (particularly three) systems used in a portable communication equipment, which permits a single equipment to be compatible with a plurality of systems. <P>SOLUTION: The high-frequency switch module switches the transmission circuits and reception circuits of a plurality of different transmitting and receiving systems. The module includes first and second filter circuits having different pass-bands from each other, a first switch circuit for switching transmitting and receiving circuits in a first transmitting and receiving system, and a second switch circuit for switching second and third transmitting and receiving circuits. The first filter circuit includes a distributed constant line LF5, and a series resonance circuit having a distributed constant line LF6 and a capacitor CF6, which is connected in series between the distributed constant line LF5 and a ground. The second filter circuit includes a capacitor CF5 and a series resonance circuit having a distributed constant line LF7 and a capacitor CF7, which is connected in series between the capacitor CF5 and the ground. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a high-frequency composite part used for a radio that can be used for a plurality of different communication systems, and more particularly to a high-frequency switch module used for a radio that handles three communication systems.

  For example, GSM (Global System for Mobile Communications) and DCS1800 (Digital Cellular System 1800) systems, which are popular in Europe, and PCS (Personal Communications Services) system, which are popular in the United States, are used in portable radio systems. There are various systems such as PDC (Personal Digital Cellular), but with the rapid spread of mobile phones in recent years, especially in major metropolitan areas of developed countries, all systems are used in the frequency bands assigned to each system. There are problems such as being unable to cover the person, making connection difficult, and disconnecting in the middle of a call. Accordingly, it has been proposed that the user can use a plurality of systems to increase the number of frequencies that can be used substantially, and further expand the service area and effectively use the communication infrastructure of each system.

  However, in order to use a plurality of systems, it is necessary to have a necessary number of portable communication devices corresponding to each system. However, there has conventionally been no small and lightweight portable communication device capable of communicating with a plurality of systems with one unit. In order to make it possible to use a plurality of systems with a single portable communication device, it is only necessary to configure the portable communication device using components for each system. In a signal transmission system, for example, transmission of a desired transmission frequency is possible. High-frequency circuit components such as a filter that passes a signal, a high-frequency switch that switches between transmission and reception circuits, an antenna that receives and radiates transmission / reception signals, and a filter that passes a desired frequency of a reception signal that has passed through the high-frequency switch Required for each system. For this reason, the portable communication device becomes expensive and both the volume and the weight increase, which is unsuitable for portable use. To realize a portable communication device that can use a plurality of systems by one unit, There is a need for a high-frequency circuit component that satisfies the frequency configuration of the system and that is compact and has multiple functions.

  Accordingly, an object of the present invention is to provide a small and high-performance circuit that can switch between a transmitter circuit and a receiver circuit of a plurality of (especially three) systems as a high-frequency circuit component used in a portable communication device capable of supporting a plurality of systems. It is to provide a high frequency switch module.

  The high-frequency switch module of the present invention is a high-frequency switch module that switches between a plurality of different transmission / reception transmission circuits and reception circuits, the first and second filter circuits having different pass bands, and the first filter circuit. A first switch circuit connected to the second filter circuit, and a second switch circuit connected to the second filter circuit, wherein the first filter circuit is between the antenna and the first switch circuit. A low-pass filter comprising: a distributed constant line provided; and a series resonance circuit including a distributed constant line and a capacitor connected in series between the distributed constant line and the ground. The second filter circuit includes the antenna And a capacitor provided between the capacitor and the second switch circuit, a distributed constant line connected in series between the capacitor and the ground, and Characterized in that it is a high-pass filter and a series resonant circuit consisting of capacitor.

  It is preferable that the first and second filter circuits are demultiplexing circuits that demultiplex a reception signal of the first transmission / reception system and a reception signal of the second and third transmission / reception systems.

  The first and second switch circuits are diode switches having a diode and a distributed constant line as main elements, and a voltage is supplied to the diode switch from a power supply means to control the on / off state. It is preferable to select any one of the first, second and third transmission / reception systems.

  The first switch circuit includes a first diode connected between a first transmission / reception transmission circuit and the first filter circuit, a first transmission / reception reception circuit, and the first filter. It is preferable to include a distributed constant circuit provided between the circuit and a second diode provided between the receiving circuit side of the first transmission / reception system of the distributed constant circuit and the ground.

  The distributed constant circuit is preferably connected to the anode side of the first diode and the cathode side of the second diode, and a control circuit is preferably connected to the anode side of the second diode.

The second switch circuit includes: a third diode provided between the second and third transmission / reception transmission circuits and the second filter circuit; and the second transmission / reception reception circuit; A distributed constant circuit arranged between the second filter circuit, a fourth diode provided between the receiving circuit side of the second transmission / reception system of the distributed constant circuit and the ground, 3 and a fifth diode provided between the receiving circuit of the transmission / reception system and the second filter circuit.
A control circuit is preferably connected to the anode side of each of the third and fifth diodes.

  The high-frequency switch module of the present invention can switch between a plurality of different transmission / reception transmission circuits and reception circuits, and can share two transmission / reception transmission circuits, so that it is compact while maintaining excellent electrical characteristics. In addition, it is possible to share some parts (for example, amplifiers) of two transmission / reception transmission circuits, thereby further reducing the size and weight of a portable communication device using a high-frequency switch module. .

[1] Circuit configuration FIG. 1 shows a high-frequency switch module of a reference example. This high-frequency switch module switches between three transmission / reception systems. (A) A first signal that demultiplexes a signal incident on the antenna ANT into a reception signal of the first transmission / reception system and a reception signal of the second and third transmission / reception systems. A demultiplexing circuit including first and second filter circuits F1 and F2, and (b) a transmission circuit TX1 of a first transmission / reception system which is arranged at a subsequent stage of the first filter circuit F1 and is supplied from the control circuit VC1. And a first switch circuit SW1 that switches between the first and second receiver circuits RX1, and (c) a second filter circuit F2 that is arranged at the subsequent stage of the second filter circuit F2, and that is supplied from the control circuits VC2 and VC3. A transmission circuit TX2, a second transmission / reception system reception circuit RX2, and a third transmission / reception system reception circuit RX3 are provided.

  In order to share the transmission circuit TX2 of the second and third transmission / reception systems, it is preferable to configure the high-frequency switch module with an equivalent circuit as shown in FIG. The first transmission / reception system is GSM (transmission frequency 880 to 915 MHz, reception frequency 925 to 960 MHz), the second transmission / reception system is DCS1800 (transmission frequency 1710 to 1785 MHz, reception frequency 1805 to 1880 MHz), and the third transmission / reception system is An example of PCS (transmission frequency 1850 to 1910 MHz, reception frequency 1930 to 1990 MHz) will be described in detail below.

(A) First and second filter circuits The first and second filter circuits F1 and F2 connected to the antenna ANT are each composed of a distributed constant line and a capacitor. The equivalent circuit of FIG. 2 includes a low-pass filter as a first filter circuit F1 that passes GSM transmission / reception signals and attenuates DCS1800 and PCS transmission / reception signals, and passes DCS1800 and PCS transmission / reception signals and GSM transmission / reception signals. A high-pass filter is provided as the second filter circuit F2 for attenuating.

The low-pass filter F1 includes a distributed constant line LF1 and a capacitor CF1 connected in parallel, and a capacitor CF3 connected between LF1 and CF1 and the ground. The high-pass filter F2 is connected in series to the distributed constant line LF2 and the capacitor CF2 connected in parallel, the distributed constant line LF3 connected between LF2 and CF2, and the ground, the distributed constant line LF2 and the capacitor CF2. Consists of a capacitor CF4. Note that the first and second filter circuits F1 and F2 are not limited to such a configuration, and for example, the following configurations (a) to (h) may be employed.
(a) A configuration having a low-pass filter as the first filter circuit F1 and a notch filter as the second filter circuit F2.
(b) A configuration having a notch filter as the first filter circuit F1 and a bandpass filter as the second filter circuit F2.
(c) A configuration having a low-pass filter as the first filter circuit F1 and a band-pass filter as the second filter circuit F2.
(d) A configuration having a notch filter as the first filter circuit F1 and a notch filter as the second filter circuit F2.
(e) A configuration having a notch filter as the first filter circuit F1 and a high-pass filter as the second filter circuit F2.
(f) A configuration having a bandpass filter as the first filter circuit F1 and a bandpass filter as the second filter circuit F2.
(g) A configuration having a band-pass filter as the first filter circuit F1 and a notch filter as the second filter circuit F2.
(h) A configuration having a band-pass filter as the first filter circuit F1 and a high-pass filter as the second filter circuit F2.

(B) Switch circuit The first switch circuit SW1 for switching between the GSM transmission circuit TX1 and the reception circuit RX1 arranged in the subsequent stage of the first and second filter circuits F1, F2, and the transmission circuit TX2 for DCS1800 and PCS Each of the second switch circuits SW2 for switching between the reception circuit RX2 of the DCS 1800 and the reception signal RX3 of the PCS has a diode and a distributed constant line as main elements.

  The first switch circuit SW1 is a switch circuit on the upper side of FIG. 2, and switches between the GSM transmission circuit TX1 and the reception circuit RX1. The first switch circuit SW1 includes two diodes DG1 and DG2 and two distributed constant lines LG1 and LG2 as main elements. The diode DG1 is disposed between the input / output terminal IP1 and the transmission circuit TX1, the anode is connected to the input / output terminal IP1, and the distributed constant line LG1 is connected between the cathode and the ground. The distributed constant line LG2 is connected between the input / output terminal IP1 and the receiving circuit RX1, the cathode of the diode DG2 is connected between one end of the distributed constant line LG2 on the receiving circuit RX1 side and the ground, and the anode of the diode DG2 And a capacitor CG6 is connected between the ground and the ground. An inductor LG and a resistor R1 are connected in series between the anode and the control circuit VC1.

  Both the distributed constant line LG1 and the distributed constant line LG2 have line lengths such that the resonance frequency is within the frequency band of the GSM transmission signal. For example, when each resonance frequency is set to a substantially intermediate frequency (897.5 MHz) of the transmission signal frequency of GSM, excellent insertion loss characteristics can be obtained within a desired frequency band. The low-pass filter circuit LPF inserted between the first filter circuit F1 and the transmission circuit TX1 is preferably composed of a distributed constant line and a capacitor. In the equivalent circuit shown in FIG. 2, a π-type low-pass filter including a distributed constant line LG3 and capacitors CG3, CG4, and CG7 is inserted between the diode DG1 and the distributed constant line LG1.

  The second switch circuit SW2 is a switch circuit on the lower side of FIG. 2, and switches between the reception circuit RX2 of the DCS 1800, the reception circuit RX3 of the PCS, and the transmission circuit TX2 of the DCS 1800 and PCS. The second switch circuit SW2 includes three diodes DP1, DP2, and DP3 and two distributed constant lines LP1 and LP2 as main elements. The diode DP1 is disposed between the input / output terminal IP2 and the transmission circuit TX2, the cathode is connected to the input / output terminal IP2, and the distributed constant line LP1 is connected between the anode and the ground. A capacitor CGP is connected between the distributed constant line LP1 and the ground, and a control circuit VC3 is connected to one end of the distributed constant line LP1.

  The distributed constant line LP2 is connected between the input / output terminal IP2 and the receiving circuit RX2, the anode of the diode DP2 is connected between one end of the distributed constant line LP2 on the receiving circuit RX2 side and the ground, and the cathode and the ground. And a capacitor CP6 and a resistor R3 are connected in parallel.

  The diode DP3 is connected between the input / output terminal IP2 and the receiving circuit RX3, the cathode is connected to the input / output terminal IP2, and the anode is connected to the control circuit VC2 via the distributed constant line LP and the resistor R2. Yes.

  The distributed constant lines LP1 and LP2 preferably have line lengths such that their resonance frequencies fall within the range from the maximum frequency to the minimum frequency of the frequency band of the transmission signals of the second and third transmission / reception systems. It is preferable to have a line length that is an intermediate frequency between the frequency and the minimum frequency. For example, if the resonant frequency of the distributed constant lines LP1 and LP2 is set to a substantially intermediate frequency (1810 MHz) between the transmission signal frequencies of DCS1800 and PCS, excellent electrical characteristics can be obtained in each mode, and two transmission signals can be combined into one. Can be handled by a circuit.

  The low-pass filter circuit LPF inserted between the second filter circuit F2 and the transmission circuit TX2 is preferably composed of a distributed constant line and a capacitor. In the equivalent circuit shown in FIG. 2, a π-type low-pass filter composed of a distributed constant line LP3 and capacitors CP3, CP4, and CP7 is inserted between the diode DP1 and the distributed constant line LP1.

  In the low-pass filter circuit LPF, the line length of the distributed constant line LP3 is preferably λ / 8 to λ / 12 (where λ is an intermediate frequency of transmission signals in the second and third transmission / reception systems). For example, if the second transmission / reception system is DCS1800 and the third transmission / reception system is PCS, the intermediate frequency λ of transmission signals in the second and third transmission / reception systems is DCS1800 transmission signals 1710 to 1785 MHz and PCS transmission signals 1850 to It is an intermediate frequency (1810MHz) from 1910MHz. If the line length of the distributed constant line LP3 is more than λ / 8 with respect to the intermediate frequency λ, the pass band characteristic becomes narrow, and the desired frequency is near the lower limit frequency of the DCS1800 transmission signal and the PCS transmission signal. Insertion loss characteristics cannot be obtained. If the line length of the distributed constant line LP3 is less than λ / 12, the amount of attenuation in a high frequency region such as a second harmonic or a third harmonic deteriorates. Thus, in any case, the characteristics as the high frequency switch module deteriorate, which is not preferable.

  The low-pass filter circuit LPF is not limited to the one built in the switch module as shown in FIG. 1, and may be arranged at the subsequent stage of the high-frequency switch module as shown in FIG. In this case, the low-pass filter circuit LPF can be configured by a ceramic filter or the like.

[2] Description of operation The high-frequency switch module of the reference example supplies the voltage from the power supply means (control circuit) to control the diode switch to the on / off state, whereby the first, second and third One of the transmission / reception systems is selected. The operation of the high-frequency switch module of the equivalent circuit shown in FIG. 2 will be described in detail below.

(A) DCS / PCS TX mode When the second and third transmission circuits TX2 and the second filter circuit F2 are connected, a positive voltage is applied from the control circuit VC3 and a voltage of 0 is applied from the control circuit VC2. The positive voltage supplied from the control circuit VC3 is cut by the capacitors CGP, CP2, CP3, CP4, CP5, CP6, and CF4, and applied to a circuit including the diodes DP1, DP2, and DP3. As a result, the diodes DP1 and DP2 are turned on, and the diode DP3 is turned off. When the diode DP1 is turned on, the impedance between the second and third transmission circuits TX2 and the connection point IP2 becomes low. Further, the distributed constant line LP2 is resonated by being grounded at a high frequency by the diode DP2 and the capacitor CP6 which are turned on, and the impedance of the second receiving circuit RX2 viewed from the connection point IP2 becomes very large. Furthermore, when the diode DP3 is turned off, the impedance between the connection point IP2 and the third receiving circuit RX3 increases. As a result, the transmission signals coming from the second and third transmission circuits TX2 are transmitted to the second filter circuit F2 without leaking to the second reception circuit RX2 and the third reception circuit RX3.

(B) DCS RX mode When the second receiving circuit RX2 and the second filter circuit F2 are connected, the voltages from the control circuits VC2 and VC3 are 0, and the diodes DP1, DP2, and DP3 are turned off. The diode DP2 in the OFF state connects the connection point IP2 and the second receiving circuit RX2 via the distributed constant line LP2. Further, when the diode DP1 is turned off, the impedance between the connection point IP2 and the second and third transmission circuits TX2 increases. Further, when the diode DP3 is turned off, the impedance between the connection point IP2 and the third receiving circuit RX3 is increased. As a result, the reception signal coming from the second filter circuit F2 is transmitted to the second reception circuit RX2 without leaking to the second and third transmission circuits TX2 and the third reception circuit RX3.

(C) PCS RX mode When the third receiving circuit RX3 and the second filter circuit F2 are connected, a positive voltage is applied from the control circuit VC2, and the voltage of the control circuit VC3 is set to zero. The positive voltage supplied from the control circuit VC2 is cut in the DC component by the capacitors CP5, CP6, CP8 and CF4 and applied to the circuit including the diodes DP1, DP2 and DP3. As a result, the diodes DP2 and DP3 are turned on, and the diode DP1 is turned off. When the diode DP3 is turned on, the impedance between the third receiving circuit RX3 and the connection point IP2 is lowered. Also, the distributed constant line LP2 is grounded at high frequency by the diode DP2 and the capacitor CP6 which are turned on, resonates in the transmission signal frequency band of the DCS1800 and PCS, and the impedance when the second receiving circuit RX2 is viewed from the connection point IP2. Becomes very large in the received signal band of PCS. Further, when the diode DP1 is turned off, the impedance between the connection point IP2 and the second and third transmission circuits TX2 increases. As a result, the reception signal coming from the second filter circuit F2 is transmitted to the third reception circuit RX3 without leaking to the second and third transmission circuits TX2 and RX2.

(D) GSM TX mode When connecting the first transmission circuit GSM TX and the first filter circuit F1, a positive voltage is applied from the control circuit VC1. The positive voltage is applied to a circuit including the diodes DG2 and DG1 after the DC component is cut by the capacitors of CG6, CG5, CG4, CG3, CG2 and CG1. As a result, the diodes DG2 and DG1 are turned on. When the diode DG1 is turned on, the impedance between the first transmission circuit TX1 and the connection point IP1 is lowered. The distributed constant line LG2 is grounded and resonated at high frequency by the diode DG2 and the capacitor CG6 which are turned on, and the impedance of the first receiving circuit RX1 viewed from the connection point IP1 becomes very large. As a result, the transmission signal coming from the first transmission circuit TX1 is transmitted to the first filter circuit F1 without leaking to the first reception circuit RX1.

(E) GSM RX mode When connecting the first receiving circuit GSM RX and the first filter circuit F1, a voltage of 0 is applied to the control circuit VC1 and the diodes DG1 and DG2 are turned off. The diode DG2 in the OFF state connects the connection point IP1 and the second receiving circuit RX1 via the distributed constant line LG2. Further, when the diode DG1 is turned off, the impedance between the connection point IP1 and the first transmission circuit TX1 increases. As a result, the reception signal coming from the first filter circuit F1 is transmitted to the first reception circuit RX1 without leaking to the first transmission circuit TX1.

  The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.

Reference example 1
3 is a plan view showing the high-frequency switch module of FIG. 2, FIG. 4 is a perspective view showing the laminated body portion, and FIG. 5 is a developed view showing the configuration of each layer constituting the laminated body of FIG. . In Reference Example 1, the distributed constant lines of the first and second filter circuits, the low-pass filter circuit, and the switch circuit are configured in a multilayer body, and a diode and a high-capacitance capacitor that cannot be incorporated in the multilayer body are chip capacitors. By mounting on the laminate, a triple-band high-frequency switch module in a single chip was constructed. Note that symbols P1 to P16 given to the external terminals shown in FIG. 4 coincide with symbols such as P2 and P4 attached to the equivalent circuit diagram of FIG.

  This laminate is made of (a) a ceramic dielectric material that can be fired at a low temperature, producing green sheets with a thickness of 50 μm to 200 μm, and (b) printing a conductive paste mainly composed of Ag on each green sheet. Thus, a desired electrode pattern can be formed, (c) a plurality of green sheets having the desired electrode pattern can be stacked and integrated, and (d) fired. The width of the line electrode is preferably mainly 100 to 400 μm.

  The internal structure of the laminate will be described in the order of lamination. First, the ground electrode 31 is formed on almost the entire surface of the lowermost green sheet 11, and connection portions for connecting to the terminal electrodes 81, 83, 87, 89, 91, 93 and 95 on the side surfaces are provided.

  After laminating the green sheet 12 on which the electrode pattern is not printed on the green sheet 11, the green sheet 13 in which one line electrode 41 is formed, and the green sheet in which four line electrodes 42, 43, 44 and 45 are formed The green sheets 15 on which the 14 and four line electrodes 46, 47, 48 and 49 are formed are sequentially laminated. A green sheet 16 on which two through-hole electrodes (the ones marked with a cross in the figure are through-hole electrodes) is laminated thereon, and a green sheet 17 on which a ground electrode 32 is formed is laminated thereon. Laminate.

  By appropriately connecting line electrodes in a region sandwiched between the two ground electrodes 31 and 32, distributed constant lines for the first and second switch circuits SW1 and SW2 are formed. Specifically, referring to the equivalent circuit of FIG. 2, the distributed constant line LG1 is formed by connecting the line electrodes 41, 42, and 46 with through-hole electrodes, and the line electrodes 45 and 49 are connected with the through-hole electrodes. The distributed constant line LG2 is configured, the line electrodes 43 and 47 are connected by through-hole electrodes to form a distributed constant line LP1, and the line electrodes 44 and 48 are connected by through-hole electrodes to thereby distribute the distributed constant line LP2. Configure.

  Capacitor electrodes 61, 62, 63, 64, 65 and 66 are formed on the green sheet 18 laminated on the green sheet 17. Capacitor electrodes 67, 68 and 69 are also formed on the green sheet 19 laminated thereon. A capacitor electrode 70 is formed on the green sheet 20 laminated thereon.

  A green sheet 21 on which the line electrodes 50, 51, 52, 53, and 54 are formed, and a green sheet 22 on which the line electrodes 55, 56, 57, 58, and 59 are formed are sequentially stacked. On the uppermost green sheet 23, lands for connecting mounted elements are formed.

  Each of the capacitor electrodes 61, 62, 63, 64 and 66 of the green sheet 18 forms a capacitance with the ground electrode 32 formed on the green sheet 17. Specifically, referring to the equivalent circuit of FIG. 2, capacitor electrode 61 constitutes capacitor CP3, capacitor electrode 62 constitutes capacitor CP4, capacitor electrode 63 constitutes capacitor CG4, and capacitor electrode 64 constitutes a capacitor CG3, and the capacitor electrode 66 constitutes a capacitor CF3.

  The capacitor electrodes formed on the green sheets 18, 19 and 20 form a capacitance with each other. Specifically, referring to the equivalent circuit of FIG. 2, a capacitor CF4 is formed between the capacitor electrodes 65 and 68, and a capacitor CP7 is formed between the capacitor electrodes 61, 62 and 67 in the same manner. A capacitor CF1 is formed between 69 and 70, and a capacitor CF2 is formed between the capacitor electrodes 68 and 70. The capacitor electrode 65 forms a capacitance facing the capacitor electrode 68, but the ground electrode 32 has a notch so as not to face the ground electrode 32. The through-hole electrode for conducting the distributed constant line is located in the notch.

  In the green sheets 21 and 22, the line electrodes 52 and 59 constitute a distributed constant line LF1, the line electrodes 54 and 58 constitute a distributed constant line LF2, the line electrode 53 constitutes a distributed constant line LF3, and the line electrode 51 , 57 constitute a distributed constant line LG3, the line electrode 55 constitutes a distributed constant line LP3, and the line electrode 56 constitutes a distributed constant line LP. The line electrode 50 is a wiring line. Further, the line electrodes 51 and 57 constituting the distributed constant line LG3 are formed so as to partially face each other, and the capacitor CG7 is constituted by the facing portions.

  These laminated green sheets were integrally pressed and fired at a temperature of 900 ° C. to obtain a laminate having an outer dimension of 6.7 mm × 5.0 mm × 1.0 mm. Terminal electrodes 81 to 96 were formed on the side surfaces of the laminate. The appearance of the laminate is shown in FIG.

  On this laminate, diodes DG1, DG2, DP1, DP2 and DP3, chip capacitors CG1, CG6, CGP and CP6, and a chip resistor R3 were mounted. FIG. 3 is a plan view showing a laminate on which these elements are mounted. FIG. 3 also shows the mounting configuration (connection structure of each terminal) of this high-frequency switch module. In FIG. 3 and the like, GRD means a terminal connected to ground.

  In this reference example, among the equivalent circuit shown in FIG. 2, CP2, CP5, CG2, CG5, R1, LG, R2, and CP8 are formed on a circuit on which chip components are mounted.

  In this reference example, the distributed constant lines of the first and second switch circuits are formed in a region sandwiched between the ground electrodes in the laminated body, thereby preventing interference between the switch circuit, the branching circuit, and the low-pass filter circuit. It is out. In addition, by arranging a region sandwiched between the ground electrodes at the lower part of the stacked body, it is easy to obtain the ground potential. A capacitor electrode constituting a capacitor is formed between the upper ground electrode and the upper electrode.

  As shown in FIGS. 3 and 4, the reference example has a structure in which a terminal is formed on the side surface of the laminate, so that surface mounting is possible. Terminals on the side are ANT terminal (P2), DCS / PCS TX2 terminal (P7), GSM TX1 terminal (P13), GSM RX1 terminal (P16), DCS1800 RX2 terminal (P9), PCS RX3 terminal (P10) Ground terminals (GRD) and control terminals (VC1, VC2, VC3). In addition, at least one ground terminal is disposed on each side surface of the laminate.

  In this reference example, the ANT terminal, TX terminal group, and RX terminal group are each sandwiched between ground terminals. VC1, VC2 and VC3 are also sandwiched between ground terminals.

  Table 1 shows control logics of the control circuits VC1, VC2, and VC3 of the high-frequency switch module of this reference example. This changes each mode of GSM, DCS1800, and PCS.

  11 to 15 show insertion loss characteristics and isolation characteristics during transmission / reception in each communication mode. As shown in FIGS. 11 to 15, excellent insertion loss characteristics and isolation characteristics were obtained in a desired frequency band in each communication mode, and it was found that the high-frequency switch module of this reference example was small and high-performance. .

Reference example 2
6 shows an equivalent circuit of a high-frequency switch module of another reference example, FIG. 7 is a plan view of the high-frequency switch module, and FIG. 8 shows the internal structure of the laminate. Since this reference example has many parts similar to the reference example 1, only different parts will be described here.

  The first and second filter circuits are the same as in Reference Example 1. The first switch circuit SW1 of the first transmission / reception system (GSM) is also connected to the control circuit VC3 together with the distributed constant line LP1 of the second switch circuit SW2 without the distributed constant line LG1 being connected to the ground. This is the same as Reference Example 1. In the second switch circuit, the directions of the diodes DP1, DP2, and DP3 are opposite to those of the reference example 1, and the control circuit is connected between the diode DP2 and the capacitor CP6 through a series circuit of the inductor LD and the resistor R3. VC4 is connected.

  The structure of the high-frequency switch module laminate is different from that of Reference Example 1 in the following points. The ground electrode 31 of the green sheet 11 is not connected to the terminal electrode 89. In the green sheet 15, the lead terminal of the line electrode 46 is changed. In the green sheet 17, the ground electrode 32 is not connected to the terminal electrode 89. In the green sheet 21, a line electrode 71 which is a wiring line is added. In the green sheet 22, a through hole connected to the line electrode 71 is added. In the green sheet 23, the land shape is changed.

  On the laminate, diodes DG1, DG2, DP1, DP2, and DP3, chip capacitors CG1, CG6, CGP, and CP6 are mounted. FIG. 7 shows a laminate on which these elements are mounted. FIG. 7 also shows the mounting configuration (connection structure of each terminal) of the high-frequency switch module. In this reference example, among the elements constituting the equivalent circuit shown in FIG. 6, CP2, CP5, CG2, CG5, R1, LG, R2, CP8, R3, and LD are formed on a chip component mounting circuit.

  Table 2 shows control logics of the control circuits VC1, VC2, VC3, and VC4 of the high-frequency switch module of this reference example. This changes each mode.

  The high-frequency switch module of this reference example can also use three different communication methods, and has the same effect as that of Reference Example 1.

Reference example 3
FIG. 9 shows a high-frequency switch module of still another reference example of the present invention. Since the high-frequency switch module used in this reference example has many parts similar to those of the reference example 1, only different parts will be described here.

  The first and second filter circuits and the first switch circuit SW1 of the first transmission / reception system (GSM) are equivalent to the reference example 1 in terms of equivalent circuits. The second switch circuit SW2 receives input signals of the second and third transmission / reception systems from the second filter circuit F2 and outputs transmission signals coming from the transmission circuits TX2 of the second and third transmission / reception systems. An output terminal IP2, an input terminal for receiving transmission signals coming from the transmission circuits TX2 of the second and third transmission / reception systems, a third output terminal IP3 for outputting reception signals of the second and third transmission / reception systems, It has a fourth output terminal for outputting the second transmission / reception system reception signal to the reception circuit RX2, and a fifth output terminal for outputting the third transmission / reception system reception signal to the reception circuit RX3. A first diode DP1 disposed between IP2 and the input terminal; a first distributed constant line LP1 provided between the input terminal and ground; an input / output terminal IP2 and a third output terminal IP3; A second distributed constant line LP2 provided between the second output terminal IP3 and a second diode provided between the third output terminal IP3 and the ground. Node DP2, a third distributed constant line LD1 provided between the third output terminal IP3 and the fourth output terminal, and a third diode provided between the fourth output terminal and the ground. DD1, a fourth diode DD2 disposed between the third output terminal IP3 and the fifth output terminal, and a fourth distributed constant line LD2 provided between the fifth output terminal and the ground. It comprises.

  As described above, the second switch circuit SW2 is another switch circuit SW2-1 that switches between the DCS reception circuit RX2 and the PCS reception circuit RX3, and another circuit that switches between the DCS / PCS transmission circuit TX2 and the switch circuit. The switch circuit SW2-2. The switch circuit SW2-1 for switching between the DCS receiving circuit RX2 and the PCS receiving circuit RX3 has two diodes DD1 and DD2 and two distributed constant lines LD1 and LD2 as main elements, and the anode of the diode DD2 is a connection point IP3. A distributed constant line LD2 connected to the RX3 side and connected to the ground is arranged on the cathode side. A distributed constant line LD1 is connected between the connection point IP3 and the receiving circuit RX2, and a diode DD1 connected to the ground via the capacitor CDP2 is disposed on the receiving circuit RX2 side. A control circuit VC5 is connected between the diode DD1 and the capacitor CDP2 via an inductor LD and a resistor R6.

  In front of this switch circuit SW2-1, another switch circuit SW2-2 for switching between the DCS / PCS transmission circuit TX2 and the switch circuit SW2-1 is arranged. The switch circuit SW2-2 includes two diodes DP1 and DP2 and two distributed constant lines LP1 and LP2 as main elements. The diode DP1 is disposed between the TX2 and the connection point IP2, the anode of the diode DP1 is connected to the connection point IP2, and the distributed constant line LP1 connected to the ground is disposed on the cathode side thereof. A distributed constant line LP2 is connected between the connection points IP2 and IP3, and a diode DP2 connected to the ground via the capacitor CP6 is disposed on the connection point IP3 side. A control circuit VC3 is connected between the diode DP2 and the capacitor CP6 via an inductor LP and a resistor R3.

  Table 3 shows control logics of the control circuits VC1, VC3, and VC5 of the high-frequency switch module of this reference example. This changes each mode.

  It can be seen that the high-frequency switch module using the high-frequency switch of Reference Example 3 can also use three different communication methods, and exhibits the same effect as Reference Example 1.

Example 1
FIG. 10 shows an equivalent circuit of the high-frequency switch module according to one embodiment of the present invention. Since the high-frequency switch module of this embodiment has many parts similar to those of the reference example 1, only different parts will be described here. The first and second switch circuit portions of the first to third transmission / reception systems (GSM, DCS, PCS) are equivalent to the reference example 1 in terms of equivalent circuits.

  The first and second filter circuits F1 and F2 connected to the antenna ANT are composed of distributed constant lines and capacitors as in Reference Example 1. In the equivalent circuit, the GSM transmission / reception signals are passed and the DCS and PCS transmission / reception signals are passed. A low-pass filter is provided as a first filter circuit for attenuating the signal, and a high-pass filter is provided as a second filter circuit for passing the DCS and PCS transmission / reception signals and attenuating the GSM transmission / reception signals. The low-pass filter has a distributed constant line LF5 between the antenna ANT and the first switch circuit F1, and a series resonant circuit including the distributed constant line LF6 and the capacitor CF6 is provided between one end of the distributed constant line LF5 and the ground. Connected. On the other hand, the high-pass filter includes a capacitor CF5 connected between the antenna ANT and the second switch circuit F2, and a series resonance circuit including a distributed constant line LF7 and a capacitor CF7 connected between the ground.

  The high-frequency switch module of the present embodiment can also use three different communication methods, and exhibits the same effects as in Reference Example 1.

Although the high-frequency switch module of the present invention has been described in detail with reference to FIGS. 1 to 10, the present invention is not limited to this, and various modifications can be made without departing from the spirit of the present invention. Further, the communication system used for the high-frequency switch module of the present invention is not limited to that shown in the above embodiment, and three different transmission / reception systems, for example, GPS (Global Positioning System) and D-AMPS (Digital Advanced Mobile Service) Even in the case of a combination of PCS and GSM, a combination of GSM, WCDMA (Wide-band Code Division Multiple Access) and PCS, etc., it is possible to switch between three transmission / reception systems in the same manner.
INDUSTRIAL APPLICABILITY The high frequency switch module of the present invention can be used for, for example, a portable communication device such as a mobile phone for a triple band triple communication system that can use three different communication systems. The transmission / reception transmission circuit TX1 and the reception circuit RX1, the second transmission / reception transmission circuit TX2, the second transmission / reception reception circuit RX2, and the third transmission / reception reception circuit RX3 can be switched. Thus, the second transmission / reception transmission circuit and the third transmission / reception transmission circuit can be shared. For this reason, the high-frequency switch module of the present invention can be miniaturized while maintaining excellent electrical characteristics, and can also share some parts (for example, amplifiers) of the transmission circuits of the second and third transmission / reception systems. Is possible. As a result, the portable communication device using the high frequency switch module can be further reduced in size and weight.

  The high-frequency switch module according to the present invention can be used for a mobile communication device such as a triple-band mobile phone using a plurality of communication systems that can use, for example, three different communication systems. The antenna ANT and the first transmission / reception transmission circuit TX1 and reception circuit RX1, second and third transmission / reception system transmission circuit TX2, second transmission / reception system reception circuit RX2 and third transmission / reception system reception circuit RX3 can be switched, and second transmission / reception is possible. The transmission circuit of the system and the transmission circuit of the third transmission / reception system can be shared. For this reason, the high-frequency switch module of the present invention can be miniaturized while maintaining excellent electrical characteristics, and can also share some parts (for example, amplifiers) of the transmission circuits of the second and third transmission / reception systems. Is possible. As a result, the portable communication device using the high frequency switch module can be further reduced in size and weight.

It is a block diagram which shows the circuit of the high frequency switch module of a reference example. It is the schematic which shows the equivalent circuit of the high frequency switch module of a reference example. It is a top view which shows the high frequency switch module of FIG. It is a perspective view which shows the laminated body part of the high frequency switch module of FIG. It is a figure which shows the internal structure of the laminated body part of the high frequency switch module of FIG. It is the schematic which shows the equivalent circuit of the high frequency switch module of another reference example. It is a top view which shows the high frequency switch module of FIG. It is a figure which shows the internal structure of the laminated body of the high frequency switch module of FIG. It is the schematic which shows the equivalent circuit of the high frequency switch module of another reference example. It is the schematic which shows the equivalent circuit of the high frequency switch module by one Example of this invention. It is a graph which shows the insertion loss characteristic between TX1-ANT in the GSM TX mode of the high frequency switch module of the reference example 1. It is a graph which shows the isolation characteristic between TX1-RX1 in the GSM TX mode of the high frequency switch module of the reference example 1. 6 is a graph showing insertion loss characteristics between ANT-RX1 in the GSM RX mode of the high-frequency switch module of Reference Example 1. 6 is a graph showing isolation characteristics between ANT-TX1 in the GSM RX mode of the high-frequency switch module of Reference Example 1. 6 is a graph showing insertion loss characteristics between TX2 and ANT in DCS / PCS TX mode of the high-frequency switch module of Reference Example 1; It is a graph which shows the isolation characteristic between TX2-RX2 in the DCS / PCS TX mode of the high frequency switch module of the reference example 1. It is a graph which shows the isolation characteristic between TX2-RX3 in DCS / PCS TX mode of the high frequency switch module of the reference example 1. 7 is a graph showing insertion loss characteristics between ANT-RX2 in the DCS RX mode of the high-frequency switch module of Reference Example 1. 6 is a graph showing isolation characteristics between ANT-TX2 in the DCS RX mode of the high-frequency switch module of Reference Example 1. 6 is a graph showing the isolation characteristics between ANT-RX3 in DCS RX mode of the high-frequency switch module of Reference Example 1. 6 is a graph showing insertion loss characteristics between ANT-RX3 in the PCS RX mode of the high-frequency switch module of Reference Example 1. 4 is a graph showing isolation characteristics between ANT-TX2 in the PCS RX mode of the high-frequency switch module of Reference Example 1. 4 is a graph showing isolation characteristics between ANT-RX2 in the PCS RX mode of the high-frequency switch module of Reference Example 1. It is a block diagram which shows the circuit of the high frequency switch module of another reference example.

Explanation of symbols

ANT ... Antenna
TX1, TX2 ... Transmission circuit
RX1, RX2, RX3 ・ ・ ・ Receiving circuit
DG1, DG2, DP1 to DP3 ... Diodes
LF5 to LF7, LG1 to LG3, LP1 to LP3, LP ... distributed constant line
CG1 to CG7, CF4, CF5, CP2 to CP6, CP8 ... Capacitors
VC1, VC2, VC3 ... Control circuit

Claims (8)

  A high-frequency switch module that switches between a plurality of different transmission / reception transmission circuits and reception circuits, the first and second filter circuits having different passbands, and the first switch circuit connected to the first filter circuit And a second switch circuit connected to the second filter circuit, wherein the first filter circuit is a distributed constant line provided between the antenna and the first switch circuit; A low-pass filter comprising a distributed constant line connected in series between the distributed constant line and ground and a series resonant circuit composed of a capacitor, wherein the second filter circuit includes the antenna, the second switch circuit, And a series resonant circuit comprising a distributed constant line and a capacitor connected in series between the capacitor and the ground. High-frequency switch module, which is a high-pass filter.   2. The high frequency switch module according to claim 1, wherein the first and second filter circuits are demultiplexing circuits for demultiplexing a first transmission / reception system reception signal and a second and third transmission / reception system reception signal. A high-frequency switch module characterized by being.   3. The high frequency switch module according to claim 1, wherein the first and second switch circuits are diode switches having a diode and a distributed constant line as main elements, and a voltage is supplied to the diode switch from a power supply means. A high-frequency switch module, wherein one of the first, second, and third transmission / reception systems is selected by supplying power and controlling the on / off state.   4. The high-frequency switch module according to claim 1, wherein the first switch circuit is a first diode connected between a transmission circuit of a first transmission / reception system and the first filter circuit. 5. A distributed constant circuit provided between the first transmission / reception system reception circuit and the first filter circuit, and between the first transmission / reception system reception circuit side of the distributed constant circuit and the ground. A high-frequency switch module comprising a second diode formed.   5. The high frequency switch module according to claim 4, wherein the distributed constant circuit is connected to the anode side of the first diode and to the cathode side of the second diode, and a control circuit is connected to the anode side of the second diode. A high frequency switch module characterized by being connected.   6. The high-frequency switch module according to claim 1, wherein the second switch circuit is provided between the transmission circuit of the second and third transmission / reception systems and the second filter circuit. A third diode, a distributed constant circuit disposed between the second transmission / reception system reception circuit and the second filter circuit, and the second transmission / reception system reception circuit side of the distributed constant circuit; And a fourth diode provided between the ground and a fifth diode provided between the receiving circuit of the third transmission / reception system and the second filter circuit. High frequency switch module.   7. The high frequency switch module according to claim 6, wherein a control circuit is connected to each anode side of the third and fifth diodes.   A portable communication device comprising the high-frequency switch module according to claim 1.

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