JP2000031107A5 - - Google Patents

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Publication number
JP2000031107A5
JP2000031107A5 JP1999108436A JP10843699A JP2000031107A5 JP 2000031107 A5 JP2000031107 A5 JP 2000031107A5 JP 1999108436 A JP1999108436 A JP 1999108436A JP 10843699 A JP10843699 A JP 10843699A JP 2000031107 A5 JP2000031107 A5 JP 2000031107A5
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JP
Japan
Prior art keywords
semiconductor substrate
organic solvent
vaporized
drying
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999108436A
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English (en)
Japanese (ja)
Other versions
JP4311809B2 (ja
JP2000031107A (ja
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Publication date
Application filed filed Critical
Priority to JP10843699A priority Critical patent/JP4311809B2/ja
Priority claimed from JP10843699A external-priority patent/JP4311809B2/ja
Publication of JP2000031107A publication Critical patent/JP2000031107A/ja
Publication of JP2000031107A5 publication Critical patent/JP2000031107A5/ja
Application granted granted Critical
Publication of JP4311809B2 publication Critical patent/JP4311809B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP10843699A 1998-05-07 1999-04-15 半導体基板の乾燥装置および半導体基板の乾燥方法 Expired - Fee Related JP4311809B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10843699A JP4311809B2 (ja) 1998-05-07 1999-04-15 半導体基板の乾燥装置および半導体基板の乾燥方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP12493598 1998-05-07
JP10-124935 1998-05-07
JP12493498 1998-05-07
JP12493398 1998-05-07
JP10-124934 1998-05-07
JP10-124933 1998-05-07
JP10843699A JP4311809B2 (ja) 1998-05-07 1999-04-15 半導体基板の乾燥装置および半導体基板の乾燥方法

Publications (3)

Publication Number Publication Date
JP2000031107A JP2000031107A (ja) 2000-01-28
JP2000031107A5 true JP2000031107A5 (enrdf_load_html_response) 2006-03-30
JP4311809B2 JP4311809B2 (ja) 2009-08-12

Family

ID=27469630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10843699A Expired - Fee Related JP4311809B2 (ja) 1998-05-07 1999-04-15 半導体基板の乾燥装置および半導体基板の乾燥方法

Country Status (1)

Country Link
JP (1) JP4311809B2 (enrdf_load_html_response)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931042B2 (ja) * 2006-04-10 2012-05-16 株式会社ジェイ・イー・ティ 基板処理装置
JP2012039163A (ja) * 2011-11-24 2012-02-23 Jet Co Ltd 基板処理装置
CN114562874B (zh) * 2022-03-02 2023-07-04 浙江光特科技有限公司 一种用于晶圆清洗后烘干处理装置
CN114914176A (zh) * 2022-05-07 2022-08-16 北京北方华创微电子装备有限公司 晶圆干燥方法以及半导体干燥设备
CN116544144B (zh) * 2023-05-16 2023-10-27 江苏亚电科技有限公司 具有喷气功能的晶圆清洗干燥升降机构

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