JP1683107S - - Google Patents
Info
- Publication number
- JP1683107S JP1683107S JPD2020-21837F JP2020021837F JP1683107S JP 1683107 S JP1683107 S JP 1683107S JP 2020021837 F JP2020021837 F JP 2020021837F JP 1683107 S JP1683107 S JP 1683107S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/703,655 USD913979S1 (en) | 2019-08-28 | 2019-08-28 | Inner shield for a substrate processing chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1683107S true JP1683107S (cs) | 2021-04-12 |
Family
ID=74872257
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2020-21837F Active JP1683107S (cs) | 2019-08-28 | 2020-02-27 | |
| JPD2020-3692F Active JP1683051S (cs) | 2019-08-28 | 2020-02-27 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2020-3692F Active JP1683051S (cs) | 2019-08-28 | 2020-02-27 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD913979S1 (cs) |
| JP (2) | JP1683107S (cs) |
| TW (2) | TWD218527S (cs) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD868124S1 (en) * | 2017-12-11 | 2019-11-26 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD933725S1 (en) | 2019-02-08 | 2021-10-19 | Applied Materials, Inc. | Deposition ring for a substrate processing chamber |
| USD942516S1 (en) * | 2019-02-08 | 2022-02-01 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| JP1655453S (cs) * | 2019-06-17 | 2020-03-23 | ||
| US12100577B2 (en) * | 2019-08-28 | 2024-09-24 | Applied Materials, Inc. | High conductance inner shield for process chamber |
| USD896767S1 (en) * | 2019-12-02 | 2020-09-22 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
| US11551960B2 (en) | 2020-01-30 | 2023-01-10 | Applied Materials, Inc. | Helical plug for reduction or prevention of arcing in a substrate support |
| USD941371S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD941372S1 (en) * | 2020-03-20 | 2022-01-18 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD937329S1 (en) * | 2020-03-23 | 2021-11-30 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD998575S1 (en) * | 2020-04-07 | 2023-09-12 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| US12080522B2 (en) | 2020-04-22 | 2024-09-03 | Applied Materials, Inc. | Preclean chamber upper shield with showerhead |
| USD973609S1 (en) * | 2020-04-22 | 2022-12-27 | Applied Materials, Inc. | Upper shield with showerhead for a process chamber |
| USD940765S1 (en) * | 2020-12-02 | 2022-01-11 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD1072774S1 (en) | 2021-02-06 | 2025-04-29 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD980887S1 (en) * | 2021-03-18 | 2023-03-14 | Illinois Tool Works Inc. | Chamber |
| USD1007449S1 (en) * | 2021-05-07 | 2023-12-12 | Applied Materials, Inc. | Target profile for a physical vapor deposition chamber target |
| USD980813S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
| USD980814S1 (en) * | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
| USD997111S1 (en) * | 2021-12-15 | 2023-08-29 | Applied Materials, Inc. | Collimator for use in a physical vapor deposition (PVD) chamber |
| USD1071886S1 (en) | 2022-01-20 | 2025-04-22 | Applied Materials, Inc. | Substrate support for a substrate processing chamber |
| USD1053230S1 (en) | 2022-05-19 | 2024-12-03 | Applied Materials, Inc. | Sputter target for a physical vapor deposition chamber |
| USD1089335S1 (en) * | 2025-02-10 | 2025-08-19 | Zhengzhou Anxin Abrasives Co., Ltd | Multi-layer grinding disc |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401319A (en) | 1992-08-27 | 1995-03-28 | Applied Materials, Inc. | Lid and door for a vacuum chamber and pretreatment therefor |
| US6129808A (en) | 1998-03-31 | 2000-10-10 | Lam Research Corporation | Low contamination high density plasma etch chambers and methods for making the same |
| JP4141234B2 (ja) | 2002-11-13 | 2008-08-27 | キヤノンアネルバ株式会社 | プラズマ処理装置 |
| USD557425S1 (en) * | 2005-08-25 | 2007-12-11 | Hitachi High-Technologies Corporation | Cover ring for a plasma processing apparatus |
| US20070113783A1 (en) * | 2005-11-19 | 2007-05-24 | Applied Materials, Inc. | Band shield for substrate processing chamber |
| JP2009088298A (ja) | 2007-09-29 | 2009-04-23 | Tokyo Electron Ltd | プラズマ処理装置及びプラズマ処理方法 |
| WO2011026127A2 (en) | 2009-08-31 | 2011-03-03 | Lam Research Corporation | A local plasma confinement and pressure control arrangement and methods thereof |
| USD642605S1 (en) * | 2010-04-02 | 2011-08-02 | Applied Materials, Inc. | Lid assembly for a substrate processing chamber |
| USD655258S1 (en) * | 2010-10-21 | 2012-03-06 | Tokyo Electron Limited | Side wall for reactor for manufacturing semiconductor |
| USD703160S1 (en) * | 2011-01-27 | 2014-04-22 | Hitachi High-Technologies Corporation | Grounded electrode for a plasma processing apparatus |
| US9947512B2 (en) | 2011-10-25 | 2018-04-17 | Lam Research Corporation | Window and mounting arrangement for twist-and-lock gas injector assembly of inductively coupled plasma chamber |
| US9162236B2 (en) | 2012-04-26 | 2015-10-20 | Applied Materials, Inc. | Proportional and uniform controlled gas flow delivery for dry plasma etch apparatus |
| USD693782S1 (en) * | 2012-11-19 | 2013-11-19 | Epicrew Corporation | Lid for epitaxial growing device |
| USD716239S1 (en) * | 2013-11-06 | 2014-10-28 | Applied Materials, Inc. | Upper chamber liner |
| USD711331S1 (en) * | 2013-11-07 | 2014-08-19 | Applied Materials, Inc. | Upper chamber liner |
| US9865437B2 (en) | 2014-12-30 | 2018-01-09 | Applied Materials, Inc. | High conductance process kit |
| JP1551512S (cs) * | 2015-06-12 | 2016-06-13 | ||
| JP1546799S (cs) * | 2015-06-12 | 2016-03-28 | ||
| JP1564934S (cs) * | 2016-02-26 | 2016-12-05 | ||
| JP1584906S (cs) * | 2017-01-31 | 2017-08-28 | ||
| JP1584146S (cs) * | 2017-01-31 | 2017-08-21 | ||
| JP1584241S (cs) * | 2017-01-31 | 2017-08-21 | ||
| USD830981S1 (en) * | 2017-04-07 | 2018-10-16 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate processing apparatus |
| JP1620194S (cs) * | 2018-01-22 | 2018-12-10 | ||
| USD891382S1 (en) * | 2019-02-08 | 2020-07-28 | Applied Materials, Inc. | Process shield for a substrate processing chamber |
| USD893441S1 (en) * | 2019-06-28 | 2020-08-18 | Applied Materials, Inc. | Base plate for a processing chamber substrate support |
-
2019
- 2019-08-28 US US29/703,655 patent/USD913979S1/en active Active
-
2020
- 2020-02-27 TW TW110301539F patent/TWD218527S/zh unknown
- 2020-02-27 JP JPD2020-21837F patent/JP1683107S/ja active Active
- 2020-02-27 JP JPD2020-3692F patent/JP1683051S/ja active Active
- 2020-02-27 TW TW109300959F patent/TWD214316S/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWD218527S (zh) | 2022-05-01 |
| TWD214316S (zh) | 2021-10-01 |
| JP1683051S (cs) | 2021-04-12 |
| USD913979S1 (en) | 2021-03-23 |