JP1560719S - - Google Patents
Info
- Publication number
- JP1560719S JP1560719S JPD2015-26892F JP2015026892F JP1560719S JP 1560719 S JP1560719 S JP 1560719S JP 2015026892 F JP2015026892 F JP 2015026892F JP 1560719 S JP1560719 S JP 1560719S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2015-26892F JP1560719S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2015-12-01 | 2015-12-01 | |
| US29/566,273 USD798250S1 (en) | 2015-12-01 | 2016-05-27 | Heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2015-26892F JP1560719S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2015-12-01 | 2015-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1560719S true JP1560719S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2016-10-11 |
Family
ID=57048113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2015-26892F Active JP1560719S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 2015-12-01 | 2015-12-01 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD798250S1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
| JP (1) | JP1560719S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1094324S1 (en) | 2023-12-01 | 2025-09-23 | Nuflare Technology, Inc. | Semiconductor wafer heater |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
| JP1581406S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2016-10-14 | 2017-07-18 | ||
| USD832229S1 (en) * | 2017-05-26 | 2018-10-30 | TinyPCB, Inc. | Modular circuit board |
| USD839222S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
| USD842260S1 (en) * | 2017-05-30 | 2019-03-05 | TinyPCB, Inc. | Modular circuit board |
| USD841605S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
| USD839221S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
| USD841606S1 (en) * | 2017-05-30 | 2019-02-26 | TinyPCB, Inc. | Modular circuit board |
| USD839223S1 (en) * | 2017-05-30 | 2019-01-29 | TinyPCB, Inc. | Modular circuit board |
| USD887358S1 (en) * | 2018-12-06 | 2020-06-16 | Lofelt Gmbh | Motor membrane |
| JP1651618S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2019-07-11 | 2020-01-27 | ||
| JP1651619S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2019-07-11 | 2020-01-27 | ||
| JP1651623S (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 2019-07-18 | 2020-01-27 | ||
| JP1684469S (ja) * | 2020-09-24 | 2021-05-10 | 基板処理装置用天井ヒータ |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5540782A (en) * | 1992-10-15 | 1996-07-30 | Tokyo Electron Kabushiki Kaisha | Heat treating apparatus having heat transmission-preventing plates |
| USD428858S (en) * | 1997-01-31 | 2000-08-01 | Tokyo Electron Limited | Quartz fin heat retaining tube |
| USD427570S (en) * | 1997-01-31 | 2000-07-04 | Tokyo Electron Limited | Quartz fin heat retaining tube |
| USD405427S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD404016S (en) * | 1997-01-31 | 1999-01-12 | Tokyo Electron Limited | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| USD405428S (en) * | 1997-01-31 | 1999-02-09 | Tokyo Electron Ltd. | Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| US6616767B2 (en) * | 1997-02-12 | 2003-09-09 | Applied Materials, Inc. | High temperature ceramic heater assembly with RF capability |
| US5911896A (en) * | 1997-06-25 | 1999-06-15 | Brooks Automation, Inc. | Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element |
| USD404375S (en) * | 1997-08-20 | 1999-01-19 | Tokyo Electron Limited | Heat retaining tube base for use in a semiconductor wafer head processing apparatus |
| US6037574A (en) * | 1997-11-06 | 2000-03-14 | Watlow Electric Manufacturing | Quartz substrate heater |
| AU2001271904A1 (en) * | 2000-07-10 | 2002-02-05 | Temptronic Corporation | Wafer chuck having with interleaved heating and cooling elements |
| US6529686B2 (en) * | 2001-06-06 | 2003-03-04 | Fsi International, Inc. | Heating member for combination heating and chilling apparatus, and methods |
| US6506994B2 (en) * | 2001-06-15 | 2003-01-14 | Applied Materials, Inc. | Low profile thick film heaters in multi-slot bake chamber |
| WO2006060134A2 (en) * | 2004-11-15 | 2006-06-08 | Cree, Inc. | Restricted radiated heating assembly for high temperature processing |
| TWD116389S1 (zh) * | 2005-10-27 | 2007-04-11 | 東京威力科創股份有限公司 | 半導體製造用加熱器 |
| TWD125598S1 (zh) * | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | 半導體製造用加熱器 |
| TWD125599S1 (zh) * | 2006-09-28 | 2008-10-21 | 東京威力科創股份有限公司 | 半導體製造用加熱器 |
| US8986456B2 (en) * | 2006-10-10 | 2015-03-24 | Asm America, Inc. | Precursor delivery system |
| KR101480971B1 (ko) * | 2006-10-10 | 2015-01-09 | 에이에스엠 아메리카, 인코포레이티드 | 전구체 전달 시스템 |
| USD600220S1 (en) * | 2008-03-28 | 2009-09-15 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| TWD130834S1 (zh) * | 2008-03-28 | 2009-09-11 | 東京威力科創股份有限公司 | 半導體製造用保溫筒之散熱翼片 |
| USD615937S1 (en) * | 2009-03-06 | 2010-05-18 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD616393S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| USD616392S1 (en) * | 2009-03-06 | 2010-05-25 | Tokyo Electron Limited | Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
| US8933375B2 (en) * | 2012-06-27 | 2015-01-13 | Asm Ip Holding B.V. | Susceptor heater and method of heating a substrate |
-
2015
- 2015-12-01 JP JPD2015-26892F patent/JP1560719S/ja active Active
-
2016
- 2016-05-27 US US29/566,273 patent/USD798250S1/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1094324S1 (en) | 2023-12-01 | 2025-09-23 | Nuflare Technology, Inc. | Semiconductor wafer heater |
Also Published As
| Publication number | Publication date |
|---|---|
| USD798250S1 (en) | 2017-09-26 |