ITMI951306A0 - Struttura di anello di campo di polisilicio per circuito integrato di potenza - Google Patents

Struttura di anello di campo di polisilicio per circuito integrato di potenza

Info

Publication number
ITMI951306A0
ITMI951306A0 ITMI951306A ITMI951306A ITMI951306A0 IT MI951306 A0 ITMI951306 A0 IT MI951306A0 IT MI951306 A ITMI951306 A IT MI951306A IT MI951306 A ITMI951306 A IT MI951306A IT MI951306 A0 ITMI951306 A0 IT MI951306A0
Authority
IT
Italy
Prior art keywords
polysilic
power
ring structure
field ring
field
Prior art date
Application number
ITMI951306A
Other languages
English (en)
Inventor
Chris Choi Chongwook
Ranjan Niraj
Original Assignee
Int Rectifier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Rectifier Corp filed Critical Int Rectifier Corp
Publication of ITMI951306A0 publication Critical patent/ITMI951306A0/it
Publication of ITMI951306A1 publication Critical patent/ITMI951306A1/it
Application granted granted Critical
Publication of IT1275763B1 publication Critical patent/IT1275763B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
IT95MI001306A 1994-07-12 1995-06-16 Struttura di anello di campo di polisilicio per circuito integrato di potenza IT1275763B1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27401294A 1994-07-12 1994-07-12

Publications (3)

Publication Number Publication Date
ITMI951306A0 true ITMI951306A0 (it) 1995-06-16
ITMI951306A1 ITMI951306A1 (it) 1996-12-16
IT1275763B1 IT1275763B1 (it) 1997-10-17

Family

ID=23046399

Family Applications (1)

Application Number Title Priority Date Filing Date
IT95MI001306A IT1275763B1 (it) 1994-07-12 1995-06-16 Struttura di anello di campo di polisilicio per circuito integrato di potenza

Country Status (6)

Country Link
US (1) US5686754A (it)
JP (1) JP2954854B2 (it)
DE (1) DE19517975B4 (it)
FR (1) FR2722611B1 (it)
GB (1) GB2291257B (it)
IT (1) IT1275763B1 (it)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1263637A (zh) 1997-07-11 2000-08-16 艾利森电话股份有限公司 制作用于射频的集成电路器件的工艺
FR2768555B1 (fr) * 1997-09-12 2001-11-23 Commissariat Energie Atomique Structure microelectronique comportant une partie de basse tension munie d'une protection contre une partie de haute tension et procede d'obtention de cette protection
EP0977264B1 (en) * 1998-07-31 2006-04-26 Freescale Semiconductor, Inc. Semiconductor structure for driver circuits with level shifting
JP2002134692A (ja) * 2000-10-20 2002-05-10 Sanyo Electric Co Ltd 半導体装置及びその製造方法
US6798073B2 (en) * 2001-12-13 2004-09-28 Megic Corporation Chip structure and process for forming the same
WO2003092078A1 (en) * 2002-04-25 2003-11-06 Sanken Electric Co., Ltd. Semiconductor element and manufacturing method thereof
CN100337323C (zh) * 2002-12-31 2007-09-12 上海贝岭股份有限公司 高压集成电路制造工艺
US6836022B2 (en) * 2003-02-13 2004-12-28 Medtronic, Inc. High voltage flip-chip component package and method for forming the same
US8598659B2 (en) * 2005-10-26 2013-12-03 Hewlett-Packard Development Company, L.P. Single finger gate transistor
US8618627B2 (en) 2010-06-24 2013-12-31 Fairchild Semiconductor Corporation Shielded level shift transistor
JP2012023143A (ja) * 2010-07-13 2012-02-02 Mitsumi Electric Co Ltd 半導体集積回路装置
US9818742B2 (en) 2012-05-11 2017-11-14 Polar Semiconductor, Llc Semiconductor device isolation using an aligned diffusion and polysilicon field plate
JP6123516B2 (ja) * 2013-06-28 2017-05-10 株式会社ソシオネクスト 半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218070B2 (it) * 1972-10-04 1977-05-19
US4240093A (en) * 1976-12-10 1980-12-16 Rca Corporation Integrated circuit device including both N-channel and P-channel insulated gate field effect transistors
US5187552A (en) * 1979-03-28 1993-02-16 Hendrickson Thomas E Shielded field-effect transistor devices
US4290077A (en) * 1979-05-30 1981-09-15 Xerox Corporation High voltage MOSFET with inter-device isolation structure
GB2080616A (en) * 1980-07-21 1982-02-03 Siliconix Inc Power semiconductor devices
US4561170A (en) * 1984-07-02 1985-12-31 Texas Instruments Incorporated Method of making field-plate isolated CMOS devices
JPS6151961A (ja) * 1984-08-22 1986-03-14 Sanyo Electric Co Ltd 相補型ｍｏｓ半導体装置
US4900693A (en) * 1987-12-21 1990-02-13 United Technologies Process for making polysilicon field plate with improved suppression of parasitic transistors
US4937756A (en) * 1988-01-15 1990-06-26 Industrial Technology Research Institute Gated isolated structure
US5223735A (en) * 1988-09-30 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device in which circuit functions can be remedied or changed and the method for producing the same
JPH02139963A (ja) * 1988-11-21 1990-05-29 Olympus Optical Co Ltd Ｃｍｏｓデバイス
JPH02172253A (ja) * 1988-12-24 1990-07-03 Mitsubishi Electric Corp 半導体装置およびその製造方法
US5374843A (en) * 1991-05-06 1994-12-20 Silinconix, Inc. Lightly-doped drain MOSFET with improved breakdown characteristics
US5386136A (en) * 1991-05-06 1995-01-31 Siliconix Incorporated Lightly-doped drain MOSFET with improved breakdown characteristics

Also Published As

Publication number Publication date
GB2291257A (en) 1996-01-17
IT1275763B1 (it) 1997-10-17
DE19517975B4 (de) 2007-02-08
GB2291257B (en) 1999-02-17
FR2722611A1 (fr) 1996-01-19
GB9509964D0 (en) 1995-07-12
US5686754A (en) 1997-11-11
JP2954854B2 (ja) 1999-09-27
ITMI951306A1 (it) 1996-12-16
JPH0846059A (ja) 1996-02-16
DE19517975A1 (de) 1996-01-18
FR2722611B1 (fr) 2000-01-07

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Legal Events

Date Code Title Description
0001 Granted