ITMI20051637A1 - Elemento sensore con caverna scavata - Google Patents
Elemento sensore con caverna scavataInfo
- Publication number
- ITMI20051637A1 ITMI20051637A1 IT001637A ITMI20051637A ITMI20051637A1 IT MI20051637 A1 ITMI20051637 A1 IT MI20051637A1 IT 001637 A IT001637 A IT 001637A IT MI20051637 A ITMI20051637 A IT MI20051637A IT MI20051637 A1 ITMI20051637 A1 IT MI20051637A1
- Authority
- IT
- Italy
- Prior art keywords
- excavated
- cabinet
- sensor element
- sensor
- excavated cabinet
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0045—Diaphragm associated with a buried cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004043356A DE102004043356A1 (de) | 2004-09-08 | 2004-09-08 | Sensorelement mit getrenchter Kaverne |
Publications (1)
Publication Number | Publication Date |
---|---|
ITMI20051637A1 true ITMI20051637A1 (it) | 2006-03-09 |
Family
ID=35851993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT001637A ITMI20051637A1 (it) | 2004-09-08 | 2005-09-06 | Elemento sensore con caverna scavata |
Country Status (5)
Country | Link |
---|---|
US (1) | US7354786B2 (it) |
JP (1) | JP5221845B2 (it) |
DE (1) | DE102004043356A1 (it) |
FR (1) | FR2874908B1 (it) |
IT (1) | ITMI20051637A1 (it) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005007540A1 (de) | 2005-02-18 | 2006-08-31 | Robert Bosch Gmbh | Mikromechanischer Membransensor mit Doppelmembran |
DE602005007235D1 (de) * | 2005-09-28 | 2008-07-10 | St Microelectronics Srl | Verfahren zum Herstellen von dicken hängenden Strukturen aus Halbleitermaterial |
EP1804281B1 (en) * | 2005-12-28 | 2011-12-14 | STMicroelectronics Srl | Process for digging a deep trench in a semiconductor body and semiconductor body so obtained |
DE102006024668A1 (de) * | 2006-05-26 | 2007-11-29 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zu dessen Herstellung |
DE102006052630A1 (de) * | 2006-10-19 | 2008-04-24 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit monolithisch integrierter Schaltung und Verfahren zur Herstellung eines Bauelements |
DE102007002273A1 (de) * | 2007-01-16 | 2008-07-17 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bauteils und Sensorelement |
DE102007053280A1 (de) * | 2007-11-08 | 2009-05-14 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit einem Membrangitter |
US20110165719A1 (en) * | 2008-03-13 | 2011-07-07 | Florian Solzbacher | Methods of forming an embedded cavity for sensors |
DE102008040597A1 (de) * | 2008-07-22 | 2010-01-28 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit Rückvolumen |
JP5443937B2 (ja) * | 2009-10-16 | 2014-03-19 | Sppテクノロジーズ株式会社 | シリコン構造体の製造方法及びその製造装置並びにその製造プログラム |
US20130130502A1 (en) * | 2010-05-21 | 2013-05-23 | Sand 9, Inc. | Micromechanical membranes and related structures and methods |
US7998776B1 (en) | 2010-06-10 | 2011-08-16 | Memsensing Microsystems Technology Co., Ltd. | Methods for manufacturing MEMS sensor and thin film thereof with improved etching process |
US8481400B2 (en) | 2010-09-17 | 2013-07-09 | Infineon Technologies Ag | Semiconductor manufacturing and semiconductor device with semiconductor structure |
DE102011006332A1 (de) * | 2011-03-29 | 2012-10-04 | Robert Bosch Gmbh | Verfahren zum Erzeugen von monokristallinen Piezowiderständen |
DE102012200983A1 (de) * | 2011-12-23 | 2013-06-27 | Continental Automotive Gmbh | Sensorelement mit Luftdruckmessung |
US8881596B2 (en) * | 2012-01-30 | 2014-11-11 | Continental Automotive Systems, Inc. | Semiconductor sensing device to minimize thermal noise |
JP5868202B2 (ja) * | 2012-02-01 | 2016-02-24 | ローム株式会社 | 静電容量型圧力センサおよびその製造方法 |
JP6160044B2 (ja) | 2012-08-30 | 2017-07-12 | 富士電機株式会社 | 半導体装置の製造方法 |
CN103681233B (zh) * | 2012-09-05 | 2016-06-15 | 无锡华润上华半导体有限公司 | 一种多沟槽结构的制作方法 |
JP2014120729A (ja) * | 2012-12-19 | 2014-06-30 | Fuji Electric Co Ltd | 半導体基板の製造方法および半導体装置 |
US9061896B2 (en) * | 2013-08-26 | 2015-06-23 | Infineon Technologies Ag | Method for manufacturing a MEMS device and MEMS device |
JP6432190B2 (ja) | 2014-07-25 | 2018-12-05 | セイコーエプソン株式会社 | 振動素子、振動素子の製造方法、振動子、電子機器および移動体 |
EP3153851B1 (en) | 2015-10-06 | 2024-05-01 | Carrier Corporation | Mems die with sensing structures |
CN108883927B (zh) * | 2016-02-29 | 2023-06-13 | 密歇根大学董事会 | 制造三维微结构器件的方法 |
DE102016220077A1 (de) * | 2016-10-14 | 2018-04-19 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Drucksensors |
DE102017203919A1 (de) * | 2017-03-09 | 2018-09-13 | Robert Bosch Gmbh | Verfahren zum Herstellen einer MEMS-Einrichtung für einen mikromechanischen Drucksensor |
US10597288B2 (en) | 2017-05-30 | 2020-03-24 | Rohm Co., Ltd. | MEMS-device manufacturing method, MEMS device, and MEMS module |
DE102017210691A1 (de) * | 2017-06-26 | 2018-12-27 | Robert Bosch Gmbh | Verfahren zur Herstellung von mikromechanischen Sensoren |
CN109205549A (zh) * | 2017-07-03 | 2019-01-15 | 无锡华润上华科技有限公司 | 双空腔结构的制备方法 |
US10461152B2 (en) | 2017-07-10 | 2019-10-29 | Globalfoundries Inc. | Radio frequency switches with air gap structures |
DE102017213351A1 (de) * | 2017-08-02 | 2019-02-07 | Robert Bosch Gmbh | Sensorvorrichtung und Herstellungsverfahren für eine Sensorvorrichtung mit zumindest einer chemischen oder elektrochemischen Detektiereinrichtung |
CN107473178A (zh) * | 2017-08-21 | 2017-12-15 | 叶军 | 一种mems器件湿法刻蚀工艺 |
US10833153B2 (en) | 2017-09-13 | 2020-11-10 | Globalfoundries Inc. | Switch with local silicon on insulator (SOI) and deep trench isolation |
DE102017216941A1 (de) * | 2017-09-25 | 2019-03-28 | Robert Bosch Gmbh | Verfahren zum Herstellen eines mikromechanischen Elements |
US10446643B2 (en) | 2018-01-22 | 2019-10-15 | Globalfoundries Inc. | Sealed cavity structures with a planar surface |
KR101999726B1 (ko) * | 2018-04-24 | 2019-07-12 | 한국과학기술연구원 | 트렌치를 따라 주름진 멤브레인을 갖는 멤브레인 소자 및 그 제조방법과 이를 이용하는 응용장치 |
DE102018207689B4 (de) * | 2018-05-17 | 2021-09-23 | Robert Bosch Gmbh | Verfahren zum Herstellen mindestens einer Membrananordnung, Membrananordnung für einen mikromechanischen Sensor und Bauteil |
CN108839672A (zh) * | 2018-06-28 | 2018-11-20 | 上海工程技术大学 | 一种钢轨长波波磨检测装置 |
US11410872B2 (en) | 2018-11-30 | 2022-08-09 | Globalfoundries U.S. Inc. | Oxidized cavity structures within and under semiconductor devices |
US10923577B2 (en) * | 2019-01-07 | 2021-02-16 | Globalfoundries U.S. Inc. | Cavity structures under shallow trench isolation regions |
US11127816B2 (en) | 2020-02-14 | 2021-09-21 | Globalfoundries U.S. Inc. | Heterojunction bipolar transistors with one or more sealed airgap |
DE102020211554B3 (de) | 2020-09-15 | 2021-09-30 | Robert Bosch Gesellschaft mit beschränkter Haftung | Herstellungsverfahren für ein mikromechanisches Bauteil |
DE102021205736A1 (de) | 2021-06-08 | 2022-12-08 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauteil für eine Sensorvorrichtung |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05340957A (ja) * | 1992-06-08 | 1993-12-24 | Fujikura Ltd | 半導体センサの製造方法および半導体センサ |
DE4241045C1 (de) * | 1992-12-05 | 1994-05-26 | Bosch Gmbh Robert | Verfahren zum anisotropen Ätzen von Silicium |
DE69333551T2 (de) * | 1993-02-04 | 2005-06-23 | Cornell Research Foundation, Inc. | Einzelmaskenprozess zum Herstellen von Mikrostrukturen, Einkristallherstellungsverfahren |
EP2221852B1 (en) * | 1998-01-15 | 2012-05-09 | Cornell Research Foundation, Inc. | Trench isolation for micromechanical devices |
US6756247B1 (en) * | 1998-01-15 | 2004-06-29 | Timothy J. Davis | Integrated large area microstructures and micromechanical devices |
DE69930099T2 (de) * | 1999-04-09 | 2006-08-31 | Stmicroelectronics S.R.L., Agrate Brianza | Herstellung von vergrabenen Hohlräumen in einer einkristallinen Halbleiterscheibe und Halbleiterscheibe |
DE10030352A1 (de) | 2000-06-21 | 2002-01-10 | Bosch Gmbh Robert | Mikromechanisches Bauelement, insbesondere Sensorelement, mit einer stabilisierten Membran und Verfahren zur Herstellung eines derartigen Bauelements |
KR100414570B1 (ko) * | 2000-07-03 | 2004-01-07 | 조동일 | 삼중막을 이용한 단결정 실리콘 미세 구조물의 절연 방법 |
DE10032579B4 (de) | 2000-07-05 | 2020-07-02 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement |
US7294536B2 (en) * | 2000-07-25 | 2007-11-13 | Stmicroelectronics S.R.L. | Process for manufacturing an SOI wafer by annealing and oxidation of buried channels |
DE10114036A1 (de) | 2001-03-22 | 2002-10-02 | Bosch Gmbh Robert | Verfahren zur Herstellung von mikromechanischen Sensoren und damit hergestellte Sensoren |
JP2004146552A (ja) * | 2002-10-24 | 2004-05-20 | Fujitsu Ltd | 微細レジストパターンの形成方法 |
JP2004235297A (ja) * | 2003-01-29 | 2004-08-19 | Renesas Technology Corp | 半導体装置の製造方法 |
DE102004036032A1 (de) | 2003-12-16 | 2005-07-21 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements sowie ein Halbleiterbauelement, insbesondere ein Membransensor |
US7425507B2 (en) * | 2005-06-28 | 2008-09-16 | Micron Technology, Inc. | Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures |
-
2004
- 2004-09-08 DE DE102004043356A patent/DE102004043356A1/de not_active Ceased
-
2005
- 2005-09-06 FR FR0552684A patent/FR2874908B1/fr not_active Expired - Fee Related
- 2005-09-06 IT IT001637A patent/ITMI20051637A1/it unknown
- 2005-09-07 JP JP2005259437A patent/JP5221845B2/ja not_active Expired - Fee Related
- 2005-09-08 US US11/223,592 patent/US7354786B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7354786B2 (en) | 2008-04-08 |
FR2874908B1 (fr) | 2012-03-09 |
JP2006075981A (ja) | 2006-03-23 |
FR2874908A1 (fr) | 2006-03-10 |
DE102004043356A1 (de) | 2006-03-09 |
US20060057816A1 (en) | 2006-03-16 |
JP5221845B2 (ja) | 2013-06-26 |
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