IT8321641A1 - Complesso circuitale ad alta frequenza e dispositivo semiconduttore per l'impiego in tale complesso - Google Patents

Complesso circuitale ad alta frequenza e dispositivo semiconduttore per l'impiego in tale complesso

Info

Publication number
IT8321641A1
IT8321641A1 IT1983A21641A IT2164183A IT8321641A1 IT 8321641 A1 IT8321641 A1 IT 8321641A1 IT 1983A21641 A IT1983A21641 A IT 1983A21641A IT 2164183 A IT2164183 A IT 2164183A IT 8321641 A1 IT8321641 A1 IT 8321641A1
Authority
IT
Italy
Prior art keywords
assembly
semiconductor device
high frequency
frequency circuit
circuit assembly
Prior art date
Application number
IT1983A21641A
Other languages
English (en)
Other versions
IT1170151B (it
IT8321641A0 (it
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of IT8321641A0 publication Critical patent/IT8321641A0/it
Publication of IT8321641A1 publication Critical patent/IT8321641A1/it
Application granted granted Critical
Publication of IT1170151B publication Critical patent/IT1170151B/it

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
IT2164183A 1982-06-18 1983-06-15 Complesso circuitale ad alta frequenza e dispositivo semiconduttore per l'impiego in tale complesso IT1170151B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8202470A NL8202470A (nl) 1982-06-18 1982-06-18 Hoogfrequentschakelinrichting en halfgeleiderinrichting voor toepassing in een dergelijke inrichting.

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IT8321641A0 IT8321641A0 (it) 1983-06-15
IT8321641A1 true IT8321641A1 (it) 1984-12-15
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IT2164183A IT1170151B (it) 1982-06-18 1983-06-15 Complesso circuitale ad alta frequenza e dispositivo semiconduttore per l'impiego in tale complesso

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JP (1) JPS594064A (it)
AU (1) AU557136B2 (it)
CA (1) CA1213079A (it)
DE (1) DE3320275A1 (it)
FR (1) FR2529013B1 (it)
GB (1) GB2123209B (it)
IT (1) IT1170151B (it)
NL (1) NL8202470A (it)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3382183D1 (de) * 1982-12-23 1991-04-04 Sumitomo Electric Industries Monolithische integrierte mikrowellenschaltung und verfahren zum auswaehlen derselben.
US4577213A (en) * 1984-03-05 1986-03-18 Honeywell Inc. Internally matched Schottky barrier beam lead diode
US4675717A (en) * 1984-10-09 1987-06-23 American Telephone And Telegraph Company, At&T Bell Laboratories Water-scale-integrated assembly
JPS61292383A (ja) * 1985-06-20 1986-12-23 Sony Corp 集積回路装置
CH668667A5 (de) * 1985-11-15 1989-01-13 Bbc Brown Boveri & Cie Leistungshalbleitermodul.
US5060048A (en) * 1986-10-22 1991-10-22 Siemens Aktiengesellschaft & Semikron GmbH Semiconductor component having at least one power mosfet
FR2608318B1 (fr) * 1986-12-16 1989-06-16 Thomson Semiconducteurs Dispositif semi-conducteur a faible bruit en hyperfrequence, monte dans un boitier
JPS6414949A (en) * 1987-07-08 1989-01-19 Nec Corp Semiconductor device and manufacture of the same
US4901136A (en) * 1987-07-14 1990-02-13 General Electric Company Multi-chip interconnection package
JPH02184054A (ja) * 1989-01-11 1990-07-18 Toshiba Corp ハイブリッド型樹脂封止半導体装置
US4967258A (en) * 1989-03-02 1990-10-30 Ball Corporation Structure for use in self-biasing and source bypassing a packaged, field-effect transistor and method for making same
EP0393220B1 (en) * 1989-04-20 1994-07-13 International Business Machines Corporation Integrated circuit package
JPH0777261B2 (ja) * 1989-07-10 1995-08-16 三菱電機株式会社 固体撮像装置及びその組立方法
EP0411165B1 (en) * 1989-07-26 1997-04-02 International Business Machines Corporation Method of forming of an integrated circuit chip packaging structure
US5244833A (en) * 1989-07-26 1993-09-14 International Business Machines Corporation Method for manufacturing an integrated circuit chip bump electrode using a polymer layer and a photoresist layer
JPH0724270B2 (ja) * 1989-12-14 1995-03-15 株式会社東芝 半導体装置及びその製造方法
EP0460554A1 (en) * 1990-05-30 1991-12-11 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
US5049978A (en) * 1990-09-10 1991-09-17 General Electric Company Conductively enclosed hybrid integrated circuit assembly using a silicon substrate
US5153408A (en) * 1990-10-31 1992-10-06 International Business Machines Corporation Method and structure for repairing electrical lines
DE4108154A1 (de) * 1991-03-14 1992-09-17 Telefunken Electronic Gmbh Elektronische baugruppe und verfahren zur herstellung von elektronischen baugruppen
EP0506122A3 (en) * 1991-03-29 1994-09-14 Matsushita Electric Ind Co Ltd Power module
US5151769A (en) * 1991-04-04 1992-09-29 General Electric Company Optically patterned RF shield for an integrated circuit chip for analog and/or digital operation at microwave frequencies
JPH0583017A (ja) * 1991-09-24 1993-04-02 Mitsubishi Electric Corp マイクロ波集積回路装置
US5665649A (en) * 1993-05-21 1997-09-09 Gardiner Communications Corporation Process for forming a semiconductor device base array and mounting semiconductor devices thereon
US5596171A (en) * 1993-05-21 1997-01-21 Harris; James M. Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit
JP2638514B2 (ja) * 1994-11-11 1997-08-06 日本電気株式会社 半導体パッケージ
DE19720300B4 (de) * 1996-06-03 2006-05-04 CiS Institut für Mikrosensorik gGmbH Elektronisches Hybrid-Bauelement und Verfahren zu seiner Herstellung
WO1998020553A1 (en) * 1996-11-05 1998-05-14 Philips Electronics N.V. Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
JP3859340B2 (ja) * 1998-01-06 2006-12-20 三菱電機株式会社 半導体装置
EP1487019A1 (en) * 2003-06-12 2004-12-15 Koninklijke Philips Electronics N.V. Electronic device and method of manufacturing thereof
US9214909B2 (en) * 2005-07-29 2015-12-15 Mks Instruments, Inc. High reliability RF generator architecture

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3022472A (en) * 1958-01-22 1962-02-20 Bell Telephone Labor Inc Variable equalizer employing semiconductive element
LU38614A1 (it) * 1959-05-06
DE1591501A1 (de) * 1967-06-06 1970-02-26 Siemens Ag Integrierter Halbleiterschaltkreis
US3577037A (en) * 1968-07-05 1971-05-04 Ibm Diffused electrical connector apparatus and method of making same
JPS4947713B1 (it) * 1970-04-27 1974-12-17
JPS50147292A (it) * 1974-05-15 1975-11-26
US4023198A (en) * 1974-08-16 1977-05-10 Motorola, Inc. High frequency, high power semiconductor package
US3996603A (en) * 1974-10-18 1976-12-07 Motorola, Inc. RF power semiconductor package and method of manufacture
US4122479A (en) * 1975-01-31 1978-10-24 Hitachi, Ltd. Optoelectronic device having control circuit for light emitting element and circuit for light receiving element integrated in a semiconductor body
JPS5293285A (en) * 1976-02-02 1977-08-05 Hitachi Ltd Structure for semiconductor device
US4092664A (en) * 1976-02-17 1978-05-30 Hughes Aircraft Company Carrier for mounting a semiconductor chip
JPS5337383A (en) * 1976-09-20 1978-04-06 Hitachi Ltd Semiconductor integrated circuit
JPS5411666A (en) * 1977-06-28 1979-01-27 Nec Corp Microwave high output transistor
US4190854A (en) * 1978-02-15 1980-02-26 National Semiconductor Corporation Trim structure for integrated capacitors
JPS5591165A (en) * 1978-12-28 1980-07-10 Fujitsu Ltd Microwave ic
EP0015709B1 (en) * 1979-03-10 1984-05-23 Fujitsu Limited Constructional arrangement for semiconductor devices
JPS57166068A (en) * 1981-04-07 1982-10-13 Toshiba Corp Semiconductor device
DE3165937D1 (en) * 1981-04-14 1984-10-18 Itt Ind Gmbh Deutsche Method of making an integrated planar transistor
US4463322A (en) * 1981-08-14 1984-07-31 Texas Instruments Incorporated Self-biasing for FET-driven microwave VCOs

Also Published As

Publication number Publication date
US4739389A (en) 1988-04-19
NL8202470A (nl) 1984-01-16
DE3320275A1 (de) 1983-12-22
FR2529013A1 (fr) 1983-12-23
IT1170151B (it) 1987-06-03
GB2123209B (en) 1986-01-02
FR2529013B1 (fr) 1987-04-17
JPS594064A (ja) 1984-01-10
AU1583783A (en) 1983-12-22
AU557136B2 (en) 1986-12-04
GB8316270D0 (en) 1983-07-20
GB2123209A (en) 1984-01-25
IT8321641A0 (it) 1983-06-15
CA1213079A (en) 1986-10-21

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