IT8149859A0 - Bagno e metodo per elettrodeposita re palladio e lega di palladio su sostrati - Google Patents

Bagno e metodo per elettrodeposita re palladio e lega di palladio su sostrati

Info

Publication number
IT8149859A0
IT8149859A0 IT8149859A IT4985981A IT8149859A0 IT 8149859 A0 IT8149859 A0 IT 8149859A0 IT 8149859 A IT8149859 A IT 8149859A IT 4985981 A IT4985981 A IT 4985981A IT 8149859 A0 IT8149859 A0 IT 8149859A0
Authority
IT
Italy
Prior art keywords
palladium
electrodeposit
bath
substrates
alloy
Prior art date
Application number
IT8149859A
Other languages
English (en)
Inventor
Kenneth D Baker
Original Assignee
Hooker Chemicals Plastics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hooker Chemicals Plastics Corp filed Critical Hooker Chemicals Plastics Corp
Publication of IT8149859A0 publication Critical patent/IT8149859A0/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IT8149859A 1980-12-11 1981-12-09 Bagno e metodo per elettrodeposita re palladio e lega di palladio su sostrati IT8149859A0 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21521280A 1980-12-11 1980-12-11

Publications (1)

Publication Number Publication Date
IT8149859A0 true IT8149859A0 (it) 1981-12-09

Family

ID=22802107

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8149859A IT8149859A0 (it) 1980-12-11 1981-12-09 Bagno e metodo per elettrodeposita re palladio e lega di palladio su sostrati

Country Status (13)

Country Link
JP (1) JPS609116B2 (it)
BE (1) BE891319A (it)
BR (1) BR8108038A (it)
CH (1) CH649582A5 (it)
DE (1) DE3147823A1 (it)
DK (1) DK548881A (it)
ES (1) ES507865A0 (it)
FR (1) FR2496130A1 (it)
GB (1) GB2089374B (it)
HK (1) HK67186A (it)
IT (1) IT8149859A0 (it)
NL (1) NL8105601A (it)
SE (1) SE8106867L (it)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512963A (en) * 1982-12-10 1985-04-23 At&T Bell Laboratories Palladium compound synthesis procedure
IN164233B (it) * 1984-12-14 1989-02-04 Oronzio De Nora Impianti
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
US4628165A (en) * 1985-09-11 1986-12-09 Learonal, Inc. Electrical contacts and methods of making contacts by electrodeposition
DE3935664C1 (en) * 1989-10-26 1991-03-28 W.C. Heraeus Gmbh, 6450 Hanau, De Palladium-silver alloys for electrical contacts - deposited from ammoniacal bath contg. palladium tetramine complex, silver di:amine complex and organic sulphur cpd.
DE4444232C1 (de) * 1994-07-21 1996-05-09 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Palladium-Silber-Legierungen
DE19528800C2 (de) * 1995-08-04 1999-05-06 Ami Doduco Gmbh Alkalisches oder neutrales Bad zur galvanischen Abscheidung von Palladium oder Legierungen des Palladiums
US5976344A (en) * 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
JP4598782B2 (ja) 2006-03-03 2010-12-15 日本エレクトロプレイテイング・エンジニヤース株式会社 パラジウムめっき液
GB201200482D0 (en) * 2012-01-12 2012-02-22 Johnson Matthey Plc Improvements in coating technology
IT202000000391A1 (it) * 2020-01-13 2021-07-13 Italfimet Srl Procedimento galvanico, e relativo bagno, di elettrodeposizione di palladio ad alta resistenza alla corrosione.

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2839360C2 (de) * 1978-09-09 1982-11-04 Oxy Metal Industries Corp., Detroit, Mich. Wäßriges Bad zur galvanischen Abscheidung von glänzenden Überzügen aus Palladium oder seinen Legierungen

Also Published As

Publication number Publication date
DE3147823A1 (de) 1982-06-24
NL8105601A (nl) 1982-07-01
JPS609116B2 (ja) 1985-03-07
BR8108038A (pt) 1982-09-21
FR2496130A1 (fr) 1982-06-18
JPS57123992A (en) 1982-08-02
HK67186A (en) 1986-09-18
DK548881A (da) 1982-06-12
GB2089374A (en) 1982-06-23
BE891319A (fr) 1982-06-01
CH649582A5 (de) 1985-05-31
SE8106867L (sv) 1982-06-12
GB2089374B (en) 1983-11-30
ES8304617A1 (es) 1983-03-01
ES507865A0 (es) 1983-03-01

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