HK67186A - Electrodeposition of palladium and palladium alloys - Google Patents

Electrodeposition of palladium and palladium alloys

Info

Publication number
HK67186A
HK67186A HK671/86A HK67186A HK67186A HK 67186 A HK67186 A HK 67186A HK 671/86 A HK671/86 A HK 671/86A HK 67186 A HK67186 A HK 67186A HK 67186 A HK67186 A HK 67186A
Authority
HK
Hong Kong
Prior art keywords
palladium
electrodeposition
alloys
palladium alloys
Prior art date
Application number
HK671/86A
Inventor
Kenneth D Baker
Yvonne Rymwid
Bruce F Stacy
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of HK67186A publication Critical patent/HK67186A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/567Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK671/86A 1980-12-11 1986-09-11 Electrodeposition of palladium and palladium alloys HK67186A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US21521280A 1980-12-11 1980-12-11

Publications (1)

Publication Number Publication Date
HK67186A true HK67186A (en) 1986-09-18

Family

ID=22802107

Family Applications (1)

Application Number Title Priority Date Filing Date
HK671/86A HK67186A (en) 1980-12-11 1986-09-11 Electrodeposition of palladium and palladium alloys

Country Status (13)

Country Link
JP (1) JPS609116B2 (en)
BE (1) BE891319A (en)
BR (1) BR8108038A (en)
CH (1) CH649582A5 (en)
DE (1) DE3147823A1 (en)
DK (1) DK548881A (en)
ES (1) ES507865A0 (en)
FR (1) FR2496130A1 (en)
GB (1) GB2089374B (en)
HK (1) HK67186A (en)
IT (1) IT8149859A0 (en)
NL (1) NL8105601A (en)
SE (1) SE8106867L (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4512963A (en) * 1982-12-10 1985-04-23 At&T Bell Laboratories Palladium compound synthesis procedure
IN164233B (en) * 1984-12-14 1989-02-04 Oronzio De Nora Impianti
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
US4628165A (en) * 1985-09-11 1986-12-09 Learonal, Inc. Electrical contacts and methods of making contacts by electrodeposition
DE3935664C1 (en) * 1989-10-26 1991-03-28 W.C. Heraeus Gmbh, 6450 Hanau, De Palladium-silver alloys for electrical contacts - deposited from ammoniacal bath contg. palladium tetramine complex, silver di:amine complex and organic sulphur cpd.
DE4444232C1 (en) * 1994-07-21 1996-05-09 Heraeus Gmbh W C Bath for the galvanic deposition of palladium-silver alloys
DE19528800C2 (en) * 1995-08-04 1999-05-06 Ami Doduco Gmbh Alkaline or neutral bath for the galvanic deposition of palladium or alloys of palladium
US5976344A (en) * 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
JP4598782B2 (en) 2006-03-03 2010-12-15 日本エレクトロプレイテイング・エンジニヤース株式会社 Palladium plating solution
GB201200482D0 (en) * 2012-01-12 2012-02-22 Johnson Matthey Plc Improvements in coating technology
IT202000000391A1 (en) * 2020-01-13 2021-07-13 Italfimet Srl Galvanic process, and relative bath, of electrodeposition of palladium with high corrosion resistance.

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2839360C2 (en) * 1978-09-09 1982-11-04 Oxy Metal Industries Corp., Detroit, Mich. Aqueous bath for the galvanic deposition of shiny coatings made of palladium or its alloys

Also Published As

Publication number Publication date
CH649582A5 (en) 1985-05-31
JPS609116B2 (en) 1985-03-07
IT8149859A0 (en) 1981-12-09
GB2089374A (en) 1982-06-23
NL8105601A (en) 1982-07-01
ES8304617A1 (en) 1983-03-01
DK548881A (en) 1982-06-12
DE3147823A1 (en) 1982-06-24
BR8108038A (en) 1982-09-21
BE891319A (en) 1982-06-01
ES507865A0 (en) 1983-03-01
JPS57123992A (en) 1982-08-02
GB2089374B (en) 1983-11-30
FR2496130A1 (en) 1982-06-18
SE8106867L (en) 1982-06-12

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