IT8023689A0 - Processo per la deposizione chimica di biossido di silicio da vapore a bassa pressione. - Google Patents

Processo per la deposizione chimica di biossido di silicio da vapore a bassa pressione.

Info

Publication number
IT8023689A0
IT8023689A0 IT8023689A IT2368980A IT8023689A0 IT 8023689 A0 IT8023689 A0 IT 8023689A0 IT 8023689 A IT8023689 A IT 8023689A IT 2368980 A IT2368980 A IT 2368980A IT 8023689 A0 IT8023689 A0 IT 8023689A0
Authority
IT
Italy
Prior art keywords
steam
low pressure
silicon dioxide
chemical deposition
deposition
Prior art date
Application number
IT8023689A
Other languages
English (en)
Other versions
IT1150033B (it
Inventor
Kemlage Bernard Michael
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT8023689A0 publication Critical patent/IT8023689A0/it
Application granted granted Critical
Publication of IT1150033B publication Critical patent/IT1150033B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/401—Oxides containing silicon
    • C23C16/402—Silicon dioxide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
IT23689/80A 1979-08-16 1980-07-25 Processo per la deposizione chimica di biossido di silicio da vapore a bassa pressione IT1150033B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/066,965 US4239811A (en) 1979-08-16 1979-08-16 Low pressure chemical vapor deposition of silicon dioxide with oxygen enhancement of the chlorosilane-nitrous oxide reaction

Publications (2)

Publication Number Publication Date
IT8023689A0 true IT8023689A0 (it) 1980-07-25
IT1150033B IT1150033B (it) 1986-12-10

Family

ID=22072865

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23689/80A IT1150033B (it) 1979-08-16 1980-07-25 Processo per la deposizione chimica di biossido di silicio da vapore a bassa pressione

Country Status (4)

Country Link
US (1) US4239811A (it)
JP (1) JPS5627937A (it)
CA (1) CA1166128A (it)
IT (1) IT1150033B (it)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4419385A (en) * 1981-09-24 1983-12-06 Hughes Aircraft Company Low temperature process for depositing an oxide dielectric layer on a conductive surface and multilayer structures formed thereby
US4489103A (en) * 1983-09-16 1984-12-18 Rca Corporation SIPOS Deposition method
US4510172A (en) * 1984-05-29 1985-04-09 International Business Machines Corporation Technique for thin insulator growth
US4772486A (en) * 1985-02-18 1988-09-20 Canon Kabushiki Kaisha Process for forming a deposited film
JPH0817159B2 (ja) * 1985-08-15 1996-02-21 キヤノン株式会社 堆積膜の形成方法
JP2635021B2 (ja) * 1985-09-26 1997-07-30 宣夫 御子柴 堆積膜形成法及びこれに用いる装置
CN1015008B (zh) * 1985-10-23 1991-12-04 佳能株式会社 形成沉积膜的方法
US4812325A (en) * 1985-10-23 1989-03-14 Canon Kabushiki Kaisha Method for forming a deposited film
US4837048A (en) * 1985-10-24 1989-06-06 Canon Kabushiki Kaisha Method for forming a deposited film
JPS62136885A (ja) * 1985-12-11 1987-06-19 Canon Inc 光起電力素子、その製造方法及びその製造装置
JPS62136871A (ja) * 1985-12-11 1987-06-19 Canon Inc 光センサ−、その製造方法及びその製造装置
JPH0645886B2 (ja) * 1985-12-16 1994-06-15 キヤノン株式会社 堆積膜形成法
JPH0645885B2 (ja) * 1985-12-16 1994-06-15 キヤノン株式会社 堆積膜形成法
JPH0645888B2 (ja) * 1985-12-17 1994-06-15 キヤノン株式会社 堆積膜形成法
JPS62142778A (ja) * 1985-12-18 1987-06-26 Canon Inc 堆積膜形成法
JPH0645890B2 (ja) * 1985-12-18 1994-06-15 キヤノン株式会社 堆積膜形成法
US5160543A (en) * 1985-12-20 1992-11-03 Canon Kabushiki Kaisha Device for forming a deposited film
JPH0647730B2 (ja) * 1985-12-25 1994-06-22 キヤノン株式会社 堆積膜形成法
JPH0651906B2 (ja) * 1985-12-25 1994-07-06 キヤノン株式会社 堆積膜形成法
US5391232A (en) * 1985-12-26 1995-02-21 Canon Kabushiki Kaisha Device for forming a deposited film
JP2566914B2 (ja) * 1985-12-28 1996-12-25 キヤノン株式会社 薄膜半導体素子及びその形成法
GB2185758B (en) * 1985-12-28 1990-09-05 Canon Kk Method for forming deposited film
JPH084070B2 (ja) * 1985-12-28 1996-01-17 キヤノン株式会社 薄膜半導体素子及びその形成法
JPH0651909B2 (ja) * 1985-12-28 1994-07-06 キヤノン株式会社 薄膜多層構造の形成方法
JPH0651908B2 (ja) * 1985-12-28 1994-07-06 キヤノン株式会社 薄膜多層構造の形成方法
US5322568A (en) * 1985-12-28 1994-06-21 Canon Kabushiki Kaisha Apparatus for forming deposited film
US5037514A (en) * 1986-01-06 1991-08-06 Semiconductor Energy Laboratory Co., Ltd. Silicon oxide depositing method
US5366554A (en) * 1986-01-14 1994-11-22 Canon Kabushiki Kaisha Device for forming a deposited film
US4800173A (en) * 1986-02-20 1989-01-24 Canon Kabushiki Kaisha Process for preparing Si or Ge epitaxial film using fluorine oxidant
US4810673A (en) * 1986-09-18 1989-03-07 Texas Instruments Incorporated Oxide deposition method
US4834023A (en) * 1986-12-19 1989-05-30 Canon Kabushiki Kaisha Apparatus for forming deposited film
GB2213836B (en) * 1987-12-18 1992-08-26 Gen Electric Co Plc Vacuum deposition process
US4900591A (en) * 1988-01-20 1990-02-13 The United States Of America As Represented By The Secretary Of The Air Force Method for the deposition of high quality silicon dioxide at low temperature
US5059550A (en) * 1988-10-25 1991-10-22 Sharp Kabushiki Kaisha Method of forming an element isolating portion in a semiconductor device
US5068124A (en) * 1989-11-17 1991-11-26 International Business Machines Corporation Method for depositing high quality silicon dioxide by pecvd
US5310583A (en) * 1992-11-02 1994-05-10 Dow Corning Corporation Vapor phase deposition of hydrogen silsesquioxane resin in the presence of nitrous oxide
US5820923A (en) * 1992-11-02 1998-10-13 Dow Corning Corporation Curing silica precursors by exposure to nitrous oxide
US5658612A (en) * 1995-09-29 1997-08-19 Osram Sylvania Inc. Method for making a tantala/silica interference filter on the surface of a tungsten-halogen incandescent lamp
US6169026B1 (en) 1995-11-20 2001-01-02 Hyundai Electronics Industries Co., Ltd. Method for planarization of semiconductor device including pumping out dopants from planarization layer separately from flowing said layer
FR2758318B1 (fr) * 1997-01-15 1999-02-05 Air Liquide Procede et installation d'elaboration d'un melange gazeux comportant un gaz porteur, un gaz oxydant et un silane
US6472076B1 (en) * 1999-10-18 2002-10-29 Honeywell International Inc. Deposition of organosilsesquioxane films
US20030104707A1 (en) * 2001-11-16 2003-06-05 Yoshihide Senzaki System and method for improved thin dielectric films
TW200424343A (en) * 2002-09-05 2004-11-16 Asml Us Inc Low temperature deposition of silicon based thin films by single-wafer hot-wall rapid thermal chemical vapor deposition
US7199061B2 (en) * 2003-04-21 2007-04-03 Applied Materials, Inc. Pecvd silicon oxide thin film deposition
JP2014011234A (ja) * 2012-06-28 2014-01-20 Tokyo Electron Ltd シリコン酸化膜の形成方法およびその形成装置
LU92795B1 (en) * 2015-08-10 2017-02-14 Luxembourg Inst Science & Tech List SIO2 thin film produced by atomic layer deposition at room temperature

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3331716A (en) * 1962-06-04 1967-07-18 Philips Corp Method of manufacturing a semiconductor device by vapor-deposition
US3887726A (en) * 1973-06-29 1975-06-03 Ibm Method of chemical vapor deposition to provide silicon dioxide films with reduced surface state charge on semiconductor substrates
DE2409910C3 (de) 1974-03-01 1979-03-15 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen einer Halbleiteranordnung
US4002512A (en) * 1974-09-16 1977-01-11 Western Electric Company, Inc. Method of forming silicon dioxide

Also Published As

Publication number Publication date
US4239811A (en) 1980-12-16
CA1166128A (en) 1984-04-24
JPS6341214B2 (it) 1988-08-16
IT1150033B (it) 1986-12-10
JPS5627937A (en) 1981-03-18

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