IT1252197B - Dispositivo di protezione di circuiti integrati associati a relativi supporti. - Google Patents

Dispositivo di protezione di circuiti integrati associati a relativi supporti.

Info

Publication number
IT1252197B
IT1252197B ITMI913334A ITMI913334A IT1252197B IT 1252197 B IT1252197 B IT 1252197B IT MI913334 A ITMI913334 A IT MI913334A IT MI913334 A ITMI913334 A IT MI913334A IT 1252197 B IT1252197 B IT 1252197B
Authority
IT
Italy
Prior art keywords
integrated circuit
protection device
circuit protection
device associated
circuit
Prior art date
Application number
ITMI913334A
Other languages
English (en)
Italian (it)
Inventor
Claudio Cazzaniga
Angelo Massironi
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to ITMI913334A priority Critical patent/IT1252197B/it
Publication of ITMI913334A0 publication Critical patent/ITMI913334A0/it
Priority to EP92120546A priority patent/EP0546435A2/en
Priority to JP4353362A priority patent/JPH05259345A/ja
Publication of ITMI913334A1 publication Critical patent/ITMI913334A1/it
Application granted granted Critical
Publication of IT1252197B publication Critical patent/IT1252197B/it

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
ITMI913334A 1991-12-12 1991-12-12 Dispositivo di protezione di circuiti integrati associati a relativi supporti. IT1252197B (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ITMI913334A IT1252197B (it) 1991-12-12 1991-12-12 Dispositivo di protezione di circuiti integrati associati a relativi supporti.
EP92120546A EP0546435A2 (en) 1991-12-12 1992-12-02 Protection device for integrated circuit associated with relative supports
JP4353362A JPH05259345A (ja) 1991-12-12 1992-12-11 付属サポートと組み合わせる集積回路用保護デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI913334A IT1252197B (it) 1991-12-12 1991-12-12 Dispositivo di protezione di circuiti integrati associati a relativi supporti.

Publications (3)

Publication Number Publication Date
ITMI913334A0 ITMI913334A0 (it) 1991-12-12
ITMI913334A1 ITMI913334A1 (it) 1993-06-12
IT1252197B true IT1252197B (it) 1995-06-05

Family

ID=11361320

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI913334A IT1252197B (it) 1991-12-12 1991-12-12 Dispositivo di protezione di circuiti integrati associati a relativi supporti.

Country Status (3)

Country Link
EP (1) EP0546435A2 (oth)
JP (1) JPH05259345A (oth)
IT (1) IT1252197B (oth)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0895287A3 (en) * 1997-07-31 2006-04-05 Matsushita Electric Industrial Co., Ltd. Semiconductor device and lead frame for the same
DE10247075A1 (de) * 2002-10-09 2004-04-22 Micronas Gmbh Trägereinrichtung für monolithisch integrierte Schaltungen
AU2003265206A1 (en) * 2003-08-29 2005-03-16 Infineon Technologies Ag Chip support of a lead frame for an integrated circuit package
ITMI20072099A1 (it) 2007-10-30 2009-04-30 St Microelectronics Srl Metodo di fabbricazione di un dispositivo elettronico comprendente dispositivi mems incapsulati per stampaggio

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5655065A (en) * 1979-10-12 1981-05-15 Toshiba Corp Semiconductor lead frame
JPS61137352A (ja) * 1984-12-10 1986-06-25 Hitachi Ltd 半導体装置
JPS62130548A (ja) * 1985-10-09 1987-06-12 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
JPS63202948A (ja) * 1987-02-18 1988-08-22 Mitsubishi Electric Corp リ−ドフレ−ム
JPH01108731A (ja) * 1987-10-21 1989-04-26 Mitsubishi Electric Corp リードフレーム
JPH02213156A (ja) * 1989-02-14 1990-08-24 Mitsubishi Electric Corp 半導体フレーム
JPH02285665A (ja) * 1989-04-26 1990-11-22 Nec Corp リードフレーム
JPH02303055A (ja) * 1989-05-17 1990-12-17 Mitsubishi Electric Corp リードフレーム

Also Published As

Publication number Publication date
JPH05259345A (ja) 1993-10-08
ITMI913334A0 (it) 1991-12-12
EP0546435A3 (oth) 1994-03-16
EP0546435A2 (en) 1993-06-16
ITMI913334A1 (it) 1993-06-12

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19961227